• Title/Summary/Keyword: Joining strength

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Effect of Weldbond Process on the Weldability of 1.2GPa Grade Galvannealed TRIP Steel for Car Body Manufacturing (차체용 1.2GPa급 합금화아연도금 TRIP강의 용접성에 미치는 Weldbond 공정의 효과)

  • Lee, Jong-Dae;Lee, Hye-Rim;Kim, Mok-Soon;Seo, Jong-Deok;Kim, Jun-Ki
    • Journal of Welding and Joining
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    • v.34 no.6
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    • pp.28-34
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    • 2016
  • Galvannealed(GA) steels are now generally used in car body manufacturing for corrosion resistance. In this study, the weldability and joint mechanical behavior of a newly developed 1.2GPa grade GA ultra high strength TRIP(transformation induced plasticity) steel was investigated for three joining processes, such as adhesive bonding, resistance spot welding and weldbonding. Under both shear and peel stress conditions, the failure mode of the adhesive joints were the mixture of the adhesive cohesive failure, adhesive interface failure and coating layer failure. It means that the adhesion strength of GA coating onto the base metal was similar to that of adhesive bonding onto the GA coating. Under the shear stress condition, the weldbonding exerted to expand the optimal spot welding condition of 1.2GPa GA TRIP steel because the strength of adhesive bond overwhelmed that of the resistance spot weld. Under the peel stress condition, the weldbonding also exerted to expand the optimal spot welding condition of 1.2GPa GA TRIP steel by inducing the tear fracture mode rather than the partial plug fracture mode.

Technical Development using High Strength Steel of mP Type on Automobile Parts (TRIP형 고장력강판의 부품적용 기술개발)

  • 류성지;이상제;이규현;이문용
    • Journal of Welding and Joining
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    • v.20 no.3
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    • pp.46-53
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    • 2002
  • The expolitation of substitute material and new manufacturing technology of the automobile body panel for next generation cars have been steadily professed by advanced automobile companies. High strength steel of TRIP (Transformation of Induced Plasticity) type is developed in response to demands about crash safety and high strength of automobile. In this study, basic technologies can fix up problems occurring on the mass production and applied to the other forming methods will be prepared through rasping a property of TRIP material.

Scarf Welding of Thin Substrates and Evaluation of the Tensile Properties (박형 기판의 사면 접합 공정 및 인장 특성 평가)

  • Beomseok Kang;Jeehoo Na;Myeong-Jun Ko;Minjeong Sohn;Yong-Ho Ko;Tae-Ik Lee
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.3
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    • pp.102-110
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    • 2023
  • This paper introduces scarf welding process of thin substrates using flexible laser transmission welding (f-LTW) technology. We examined the behavior of tensile strength relative to the scarf angle for flexible applications. Thin plastic substrates with the thickness of less than 100 ㎛ were bonded and a jig to form a slope at the edge of the substrate was developed. By developing the scarf welding process, we successfully created a flexible bonding technology that maintains joint's thickness after the process. The tensile strength of the joint was assessed through uniaxial test, and we found that the tensile strength increases as the slope of bonding interface decreases. By conducting stress analysis at the bonding interface with respect to the slope angle, design factor of bonding structure was investigated. These findings suggest that the tensile strength depends on the geometry of the joint, even under the same process conditions, and highlights the significance of considering the geometry of the joint in welding processes.

Study on Joining Strength Improvement of Solder Joint with Pb Free Solder (Pb Free 솔더를 사용한 솔더 접합부의 접합 강도 향상에 관한 연구)

  • 신영의;김영탁
    • Journal of Welding and Joining
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    • v.15 no.2
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    • pp.36-42
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    • 1997
  • In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.

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Strength of Composite-to-Aluminum Bonding and Bolting Hybrid Joints (복합재-알루미늄 이종재료 하이브리드 체결부 강도 특성에 관한 연구)

  • Jung, Jae-Wo;Kim, Tae-Hwan;Kweon, Jin-Hwe;Choi, Jin-Ho
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2005.11a
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    • pp.57-60
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    • 2005
  • Composite-to-aluminum joins were tested to get failure loads and modes for three types of joins; adhesive bonding, bolt fastening, and adhesive-bolt hybrid joining. Film type adhesive FM73 and paste type adhesive Cytec EA9394S were used for aluminum and composite bonding to make a double-lap joint. A digital microscope camcorder was used to monitor the failure initiation and propagation. It was found that the hybrid joining is an effective method to strengthen the joint when the mechanical fastening is stronger than the bonding as in the case of using the paste type adhesive. On the contrary, when the strength of the bolted joint is lower than the strength of the bonded joint as in the joint with the film type adhesive, the bolt joining contribute little to the hybrid joint strength.

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A Study on Fluxless Soldering using Solder Foil (솔더 포일을 이용한 무플럭스 솔더링에 관한 연구)

  • 신영의;김경섭
    • Journal of Welding and Joining
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    • v.16 no.5
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    • pp.100-107
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    • 1998
  • This paper describes fluxless soldering of reflow soldering process using solder foil instead of solder pastes. There is an increasing demand for the reliable solder connection in the recent high density microelectronic components technologies. And also, it is problem fracture of an Ozone layer due to freon as which is used to removal of remained flux on the substrate. This paper discussed joining phenomena, boudability and joining processes of microelectronics devices, such as between outer lead of VLSI package and copper pad on a substrate without flux. The shear strength of joints is 8 to 13 N using Sn/Pb (63/37 wt.%) solder foil with optimum joining conditions, meanwhile, in case of using Sn/In (52/48 wt.%) solder foil, it is possible to bond with low heating temperature of 550 K, and accomplish to high bonding strength of 25N in condition heating temperature of 650K. Finally, this paper experimentally shows fluxless soldering using solder foil, and accomplishes key technology of microsoldering processes.

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Evaluation of Friction Spot Joining Weldability of Mg alloys (마찰교반 점용접(FSJ)을 이용한 Mg 합금의 접합성 평가)

  • Jo, Hyeon-Jin;Kim, Heung-Ju;Bang, Guk-Su;Cheon, Chang-Geun;Jang, Ung-Seong
    • Proceedings of the KWS Conference
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    • 2005.11a
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    • pp.183-185
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    • 2005
  • In an attempt to optimize friction spot joining process of Mg alloys, effects of joining parameters such as rotating speed, plunging depth, and dwelling time on the joints properties were evaluated. Experimental tests were carried out for lap joined AZ31B-H24 sheets. A wide range of joining conditions could be applied to join Mg alloys without defects in the weld zone except for certain welding conditions with an insufficient heat input. The microstructures and hardness variations in the weld regions are discussed. For sound joints without defects, tensile shear strength of weld joints was higher approximately 116% than typical tensile shear strength of electrical resistance spot-welded joints for magnesium(Welding handbook, Vol 3, AWS).

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Development of Solar Energy Concentration for Plastic Joining

  • Yarlagadda, P.;Kim, I.S.
    • International Journal of Korean Welding Society
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    • v.2 no.1
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    • pp.57-61
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    • 2002
  • This paper presents development of a SEC(Solar Energy Concentration) utilizing the concentrated solar beam radiation for joining engineering thermoplastics such as Acrylonitrile/Butadiene/Styrene(ABS), Polycarbonate(PC) and Polymethylmethacrylate (PMMA). In addition, to study the joining of the materials, necessary experimentation with applying primer was performed. Tensile tests were conducted to determine the bond strength achieved at the specimen Joint interface. Microscopic examinations of the fractured joints were performed in order to analyze the overall bond quality. Finally, the results in terms of bond strength achieved at the joint interface and energy consumed in the process was compared with those obtained with similar thermoplastic joining technique utilizing microwave energy.

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An Experimental Study on the Strength Evaluation of Mechanical Press Joint (기계적 프레스 접합부의 강도 평가에 관한 실험적 연구)

  • Park, Yeong-Geun;Jeong, Jin-Seong;Kim, Ho-Gyeong;Lee, Yong-Bok
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.2 s.173
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    • pp.438-448
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    • 2000
  • Mechanical press joining technique has been used in sheet metal joining processes because of its simple process and possibility of joining dissimiliar metals, such as steel and aluminum. The static and cyclic behavior of single overlap AI-alloy and steel(SPCC) joints has been investigate. Relationships were developed to estimate the strength of the joint taking into consideration base metal strength properties and the geometry of the joint. Fatigue test results have shown that fatigue resistance of the SPCC mechanical press joints is almost equal to that of the spot weld at the life of $10^6$ cycles. Also, the dissimilar material jointed specimen with upper SPCC plate and button diameter corresponding to the nugget diameter of the spot welded specimen has almost same strength as the same material jointed specimen and as the spot welded specimen.

Joining of Presureless Sintered SiC Ceramics using $MgO-Al_2O_3-SiO_2$ System ($MgO-Al_2O_3-SiO_2$계를이용한 상압소결 SiC의 접합)

  • 이홍림;남서우;한봉석;박병학;한동빈
    • Journal of the Korean Ceramic Society
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    • v.34 no.7
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    • pp.781-789
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    • 1997
  • Pressure sintered SiC specimens were joined using MgO-Al2O3-SiO2 (MAS) glass which has a thermal expansion coefficient similar to that of SiC. MAS melt showed excellent behavior of wetting on the SiC substrate over 148$0^{\circ}C$, and the wettability was much influenced by the joining atmosphere. The joining was conducted at 150$0^{\circ}C$ for 30 min in Ar atmosphere. The flexural strength of the joined specimen shows 342~380 MPa up to 80$0^{\circ}C$, which is almost the same as that of as-recieved SiC specimen. However, the flexural strength of the joined specimen decreased to about 80 MPa at 90$0^{\circ}C$ due to softening of the glass melt. The analyses od XRD and WDS show that the reaction between the SiC specimen and the MAS melt produces the oxycarbide glass, which had a high strength and a good stability at high temperatures.

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