• 한국정밀공학회지
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• 제15권5호
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• pp.9-18
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• 1998

The components with J-lead. which are more integrated and smaller than ones with Gull-wing. are rapidly being used in electronic board such as the PCB, for they have the advantage of occupying a small space compared to the other components. However, the development of inspection system for these new components is not so rapid as component development. Component-inspection with J-lead using vision system is difficult because they are hidden from camera optical axis. X-ray inspection, which has the advantage of inspecting the inside of solder state, is used to J-lead inspection. However. it is high cost and dangerous by leaking out X-ray compared to vision system. Therefore, in this paper, we design vision system suited to J-lead inspection and then propose algorithm which have flexibility in mount and rand error.