• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.1
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• pp.338-344
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• 2021

In this study, an actual test procedure was considered for the effective operation of a bulletproof test. The problems of the existing system were drawn in two ways. First, it is difficult to mount items of various shapes. Second, various test standards cannot be applied. To improve these problems, an automated and standardized mounting system was designed/applied to mount various items. The multi-purpose mount was compatible with the backing support for body armor testing. The sample holding frame was located inside and was designed to mount samples of various sizes and shapes through vertical movement and fixation without a separate detachment/attachment process. A comparison of the economics before and after the introduction of the item mounting system confirmed the effectiveness of the system by the increased number of daily tests and equipment utilization and reduced hourly cost.

• Journal of the Semiconductor & Display Technology
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• v.5 no.1 s.14
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• pp.1-4
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• 2006

Recently, Ball Grid Arrays(BGAs) are getting used more frequently for a package type. The connectors on a BGA consist of a large number of small solder balls in a grid shape on its bottom side. However, since balls of BGAs mounted on PCBs are not visible, inspection before mounting them is indispensable. High speed non-contact 3D measurement technologies are necessary far real-time measurement of ball height, the most important inspection item. In this paper, an accurate 3D data acquisition system for BGAs is proposed that can acquire 3D profile at high speed using a 3D smart camera and laser slit ray projection. Some clipping and morphological filtering operations are employed to remove spiky error data, which occur due to reflections from some ball area to camera direction.