• Title/Summary/Keyword: Isolation capacitance

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Classification of Grid Connected Transformerless PV Inverters with a Focus on the Leakage Current Characteristics and Extension of Topology Families

  • Ozkan, Ziya;Hava, Ahmet M.
    • Journal of Power Electronics
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    • v.15 no.1
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    • pp.256-267
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    • 2015
  • Grid-connected transformerless photovoltaic (PV) inverters (TPVIs) are increasingly dominating the market due to their higher efficiency, lower cost, lighter weight, and reduced size when compared to their transformer based counterparts. However, due to the lack of galvanic isolation in the low voltage grid interconnections of these inverters, the PV systems become vulnerable to leakage currents flowing through the grounded star point of the distribution transformer, the earth, and the distributed parasitic capacitance of the PV modules. These leakage currents are prohibitive, since they constitute an issue for safety, reliability, protection coordination, electromagnetic compatibility, and module lifetime. This paper investigates a wide range of multi-kW range power rating TPVI topologies and classifies them in terms of their leakage current attributes. This systematic classification places most topologies under a small number of classes with basic leakage current attributes. Thus, understanding and evaluating these topologies becomes an easy task. In addition, based on these observations, new topologies with reduced leakage current characteristics are proposed in this paper. Furthermore, the important efficiency and cost determining characteristics of converters are studied to allow design engineers to include cost and efficiency as deciding factors in selecting a converter topology for PV applications.

Comparison of Electrical Characteristics of SiGe pMOSFETs Formed on Bulk-Si and PD-SOI (Bulk-Si와 PD-SOI에 형성된 SiGe p-MOSFET의 전기적 특성의 비교)

  • Choi, Sang-Sik;Choi, A-Ram;Kim, Jae-Yeon;Yang, Jeon-Wook;Han, Tae-Hyun;Cho, Deok-Ho;Hwang, Yong-Woo;Shim, Kyu-Hwan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.6
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    • pp.491-495
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    • 2007
  • This paper has demonstrated the electrical properties of SiGe pMOSFETs fabricated on both bulk-Si and PD SOI substrates. Two principal merits, the mobility increase in strained-SiGe channel and the parasitic capacitance reduction of SOI isolation, resulted in improvements in device performance. It was observed that the SiGe PD SOI could alleviate the floating body effect, and consequently DIBL was as low as 10 mV/V. The cut-off frequency of device fabricated on PD SOI substrate was roughly doubled in comparison with SiGe bulk: from 6.7 GHz to 11.3 GHz. These experimental result suggests that the SiGe PD SOI pMOSFET is a promising option to drive CMOS to enhance performance with its increased operation frequency for high speed and low noise applications.

Effects of Post Annealing and Oxidation Processes on the Shallow Trench Etch Process (Shallow Trench 식각공정시 발생하는 결함의 후속열처리 및 산화곤정에 따른 거동에 관한 연구)

  • 이영준;황원순;김현수;이주옥;이정용;염근영
    • Journal of the Korean institute of surface engineering
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    • v.31 no.5
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    • pp.237-244
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    • 1998
  • In this stydy, submicron shallow trenches applied to STI(shallow tench isolation) were etched using inductively coupled $CI_2$/HBr and $CI_2/N_2$plasmas and the physical and electrical defects remaining on the etched silicon trench surfaces and the effects of various annealing and oxidation on the removal of the defects were studied. Using high resolution electron microscopy(HRTEM), Physical defects were investigated on the silicon trench surfaces etched in both 90%$CI_2$/ 10%$N_2$ and 50%$CI_2$/50%HBr. Among the areas in the tench such as trench bottom, bottom edge, and sidewall, the most dense defects were found near the trench bottom edge, and the least dense defects were found near the trench bottom edge, and least dense defects compared to that etched with ment as well as hydrogen permeation. Thermal oxidation of 200$\AA$ atthe temperature up to $1100^{\circ}C$apprars not to remove the defects formed on the etched silicon trenches for both of the etch conditions. To remove the physicall defects, an annealing treatment at the temperature high than $1000^{\circ}C$ in N for30minutes was required. Electrical defects measured using a capacitance-voltage technique showed the reduction of the defects with increasing annealing temperature, and the trends were similar to the results on the physical defects obtained using transmission electron microscopy.

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Design of a MIMO Antenna Using a RF MEMS Element (RF MEMS 소자를 이용한 MIMO 안테나 설계)

  • Lee, Won-Woo;Rhee, Byung-Ho
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.24 no.12
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    • pp.1113-1119
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    • 2013
  • In this letter, a new approach is proposed for the design of a multi antenna for MIMO wireless devices. The proposed antenna covers various LTE(Long Term Evolution) service bands: band 17(704~746 MHz), band 13(746~787 MHz), band 5(824~894 MHz), and band 8(880~960 MHz). The proposed main antenna consists of a conventional monopole antenna with an inverted L-shaped slit for wideband operation. The proposed the LTE sub antenna is based on a switch loaded loop antenna structure, with a resonance frequency that can be controlled by capacitance of a logic circuit. The tuning technique for the LTE Rx antenna uses a RF MEMS(Micro-Electro mechanical system) to match the impedances to realize the bands of interest. Because the two proposed antennas are polarized orthogonally to each other, the ECC(Envelope Correlation Coefficient) characteristic between two antennas was measured to be very low (below 0.06) with an isolation characteristic below -20 dB between the two antennas in the operating overall LTE bands. The proposed antenna is particularly attractive for mobile devices that integrate LTE multiple systems.

A Study on the Characteristic Analysis of Implemented Baseband AIN MIM Capacitor for Wireless PANs & Mobile Communication (무선PAN 및 이동통신용 기저대역 AIN MIM Capacitor의 구현과 특성분석에 관한 연구)

  • Lee, Jong-Joo;Kim, Eung-Kwon;Cha, Jae-Sang;Kim, Jin-Young;Kim, Young-Sung
    • The Journal of The Korea Institute of Intelligent Transport Systems
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    • v.7 no.5
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    • pp.97-105
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    • 2008
  • The micro capacitors are passive elements necessary to electronic circuits and wireless portable PAN(personal area network) and Mobile Communications device modules in the baseband circuits in combination with another passive and active devices. As capacitance is proportionally increased with dielectric constant and electrode areas, in addition, inversely decreased the thickness of the dielectric material, thus thin film capacitors are generally seen as a preferable means to achieve high performance and thin film capacitors are used in a variety of functional circuit devices. In this paper, propose dielectric material as AIN(Aluminium nitride) to make micro thin film capacitor, and this capacitor has the MIM(metal-insulator-metal) structure. AIN thin films are widespread applied because they had more excellent properties such as chemical stability, high thermal conductivity, electrical isolation and so on. In addition, AIN films show low frequency response for baseband signal ranges, I-V and C-V electrical characterization of a thin film micro capacitor. The above experimental test and estimated results demonstrate that the thin film capacitor has sufficient and efficient functional performance to be the baseband range frequency of general electronics circuit and passive device applications.

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