• Title/Summary/Keyword: Ion-Beam sputter

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Liquid Crystal orientation on the NDLC Thin Film Deposited using physical deposition method (PVD방식을 이용한 NDLC 박막에서의 액정 배향 효과)

  • Lee, Won-Kyu;Oh, Byoung-Yun;Lim, Ji-Hun;Na, Hyun-Jae;Lee, Kang-Min;Park, Hong-Gyu;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.301-301
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    • 2008
  • Ion beam (IB)-induced alignment of inorganic materials has been investigated intensively as it provides controllability in a nonstop process for producing high-resolution displays[1][2]. LC orientation via ion-beam (IB) irradiation on the nitrogen doped diamond like carbon (NDLC) thin film deposited by physical deposition method-sputtering was embodied. The NDLC thin film that was deposited by sputter showed uniform LC alignment at the 1200eV of the ion beam intensity. The pretilt angle of LC on NDLC thin films was measured with various IB exposure time and angle. The maximum pretilt angle were showed with IB irradiation angle of $45^{\circ}$ and exposure time of 62.5 sec, respectively. To show NDLC thin film stability in high temperature, thermal stability test was proceeded. The uppermost of the thermal stability of NDLC thin film was $200^{\circ}C$. In this investigation, the electro-optical (EO) characteristics of LC on NDLC thin film were measured.

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Study on ZnO Thin Film Irradiated by Ion Beam as an Alignment Layer (배향막 응용을 위한 이온 빔 조사된 ZnO 박막에 관한 연구)

  • Kang, Dong-Hoon;Kim, Byoung-Yong;Kim, Jong-Yeon;Kim, Young-Hwan;Kim, Jong-Hwan;Han, Jeong-Min;Ok, Chul-Ho;Lee, Sang-Keuk;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.430-430
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    • 2007
  • In this study, the nematic liquid crystal (NLC) alignment effects treated on the ZnO thin film layers using ion beam irradiation were successfully studied for the first time. The ZnO thin films were deposited on indium-tin-oxide (ITO) coated glass substrates by rf-sputter and The ZnO thin films were deposited at the three kinds of rf power. The used DuoPIGatron type ion beam system, which can be advantageous in a large area with high density plasma generation. The ion beam parameters were as follows: energy of 1800 eV, exposure time of 1 min and ion beam current of $4\;mA/cm^2$ at exposure angles of $15^{\circ}$, $30^{\circ}$, $45^{\circ}$, and $60^{\circ}$. The homogeneous and homeotropic LC aligning capabilities treated on the ZnO thin film surface with ion beam exposure of $45^{\circ}$ for 1 min can be achieved. The low pretilt angle for a NLC treated on the ZnO thin film surface with ion beam irradiation for all incident angles was measured. The good LC alignment treated on the ZnO thin film with ion beam exposure at rf power of 150 W can be measure. For identifying surfaces topography of the ZnO thin films, atomic force microscopy (AFM) was introduced. After ion beam irradiation, test samples were fabricated in an anti-parallel configuration with a cell gap of $60{\mu}m$.

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Fundamental characteristics of non-mass separated ion beam deposition with RE sputter-type ion source (고주파 스퍼터타입 이온소스를 이용한 비질량분리형 이온빔증착법에 관한 특성연구)

  • ;Minoru Isshiki
    • Journal of the Korean Vacuum Society
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    • v.12 no.2
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    • pp.136-143
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    • 2003
  • In this paper, high purity RF sputter-type ion source for non-mass separated ion beam deposition was evaluated. The fundamental characteristics of the ion source which is composed of an RF Cu coil and a high purity Cu target (99.9999 %) was studied, and the practical application of Cu thin films for ULSI metallization was discussed. The relationship between the DC target current and the DC target voltage at various RF power and Ar gas pressures was measured, and then preparation conditions for Cu thin films was described. As a result, it was found that the deposition conditions of the target voltage, the target current and the Ar pressure were optimized at -300 V, 240 W and 9 Pa, respectively. The resistivity of Cu films deposited at a bias voltage of -50 V showed a minimum value of 1.8 $\pm$ 0.1 $mu\Omega$cm, which is close to that of Cu bulk (1.67 $mu\Omega$cm).

Epitaxy of Si and Si1-xGex(001) by ultrahigh vacuum ion-beam sputter deposition

  • Lee, N. E.;Greene, J. E.
    • Journal of Korean Vacuum Science & Technology
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    • v.2 no.2
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    • pp.107-117
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    • 1998
  • Epitaxial undoped and Sb-doped si films have been grown on Si(001) substrates at temperatures T between 80 and 750$^{\circ}C$ using energetic Si in ultra-high-vacuum Kr+-ion-beam sputter deposition(IBSD). Critical epitaxial thicknesses te, The average thickness of epitaxial layers, in undoped films were found to range from 8nm at Ts=80$^{\circ}C$ to > 1.2 ${\mu}$m at Ts=300$^{\circ}C$ while Sb incorporation probabilities $\sigma$sb varied from unity at Ts 550$^{\circ}C$ to 0.1 at 750$^{\circ}C$. These te and $\sigma$Sb values are approximately one and one-to-three orders of magnitude, respectively, higher than reported results achieved with molecular-beam epitaxy. Plan-view and cross-sectional transmission electron microscopy, high-resolution x-ray diffraction, channeling and axial angular-yield profiles by Rutherford back scattering spectroscopy for epitaxial Si1-x Gex(001) alloy films (0.15$\leq$x$\leq$0.30) demonstrated that the films are of extremely high crystalline quality. critical layer thicknesses hc the film thickness where strain relaxation starts, I these alloys wre found to increase rapidly with decreasing growth temperature. For Si0.70 Ge0.30, hc ranged from 35nm at Ts=550$^{\circ}C$ to 650nm at 350$^{\circ}C$ compared to an equilibrium value of 8nm.

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Vacuum Web-coater with High Speed Surface Modification Equipment for fabrication of 300 mm wide Flexible Copper Clad Laminate (FCCL) (초고속 대면적 표면 처리 장치가 부착된 300 mm 폭 연성 동박적층 필림 제작용 진공 웹 코터)

  • Choi, H.W.;Park, D.H.;Kim, J.H.;Choi, W.K.;Sohn, Y.J.;Song, B.S.;Cho, J.;Kim, Y.S.
    • Journal of the Korean Vacuum Society
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    • v.16 no.2
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    • pp.79-90
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    • 2007
  • Prototype of $800{\ell}$ vacuum web coater (Vic Mama) consisting of ion source with low energy less than 250 eV for high speed surface modification and 4 magnetron sputter cathodes was designed and constructed. Its performance was evaluated through fabricating the adhesiveless flexible copper clad laminate (FCCL). Pumping speed was monitored in both upper noncoating zone pumped down by 2 turbo pumps with 2000 l/sec pumping speed and lower surface modification and sputter zone vacuumed by turbo pumps with 450 1/sec and 1300 1/sec pumping speed respectively. Ion current density, plasma density, and uniformity of ion beam current were measured using Faraday cup and the distribution of magnetic field and erosion efficiency of sputter target were also investigated. With the irradiation of ion beams on polyimide (Kapton-E, $38{\mu}m$) at different fluences, the change of wetting angle of the deionized water to polyimide surface and those of surface chemical bonding were analyzed by wetting anglometer and x-ray photoelectron spectroscopy. After investigating the deposition rate of Ni-Cr tie layer and Cu layer was investigated with the variations of roll speed and input power to sputter cathode. FCCL fabricated by sputter and electrodeposition method and characterized in terms of the peel strength, thermal and chemical stability.

SBN Thin films Prepared by Ion Beam Sputtering method (이온빔 스퍼터링법으로 제조된 SBN 박막의 특성)

  • Lee, Dong-Gun;Jang, Jae-Hoon;Lee, Hee-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07b
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    • pp.1144-1147
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    • 2002
  • Ferroelectric $Sr_xBa_{1-x}Nb_2O_6(0.25{\leq}x{\leq}0.75)$ thin films were prepared by the Ion Beam Sputtering method. Deposit onto Pt/Ti/$SiO_2$/Si(100) substrates. The deposited thin films were heat-treated for crystallization. Microstructure and crystallization behavior were examined using FE-SEM, XRD. Ferroelectric hysteresis were measured. The measured remanent polarization and coercive field values were $38{\mu}C/cm^2$ and 120kV/cm, respectively.

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Development of certified reference material (CRM)s for surface analysis II : multilayer thin films for sputter depth profiling (표면분석용 인증표준물질의 개발 II : 깊이분포도용 다층 박막 표준물질의 개발)

  • 김경중;문대원
    • Journal of the Korean Vacuum Society
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    • v.8 no.3B
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    • pp.283-289
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    • 1999
  • Multilayer thin film reference materials for the sputter depth profiling analysis are used to calibrate the sputter depth scale by measuring the sputtering rate and to optimize the sputtering conditions for the best depth resolution. Surface analysis group of Korea Research Institute of Standards and science (KRISS) have developed various types of multilayer thin films by using an ion beam sputter deposition and in-situ surface analysis system. The chemical states of the thin films reference materials were certified by in-situ XPS and the thicknesses were certified by transmission electron microscopy (TEM).

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Investigation of The New LC Alignment Film using $TiO_2$ thin film ($TiO_2$ 박막을 적용한 새로운 액정배향막의 연구)

  • Kim, Sang-Hoon;Kim, Byoung-Yong;Kang, Dong-Hun;Han, Jin-Woo;Kim, Sung-Yeon;Myoung, Jae-Min;Oh, Yong-Cheul;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.280-281
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    • 2006
  • We studied the nematic liquid crystal (NLC) aligning capabilities using the new alignment material of a Titanium dioxide ($TiO_2$) thin film by rf magnetron sputtering system for 15min under various rf power. A very low pretilt angle by ion beam exposure on the $TiO_2$ thin film was measured. A good LC alignment by the ion beam alignment method on the $TiO_2$ thin film surface was observed at annealing temperature of $200^{\circ}C$, and the alignment defect of the NLC was observed above annealing temperature of $250^{\circ}C$. Consequently, the low NLC pretilt angle and the good thermal stability of LC alignment by the ion beam alignment method on the $TiO_2$ thin film by sputter method as various rf power condition can be achieved.

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