• Title/Summary/Keyword: Ion mixing

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Antimicrobial Properties of Knit made with PET and Ion Exchange Zeolite Nanocomposite Spun Yarn (PET와 이온교환 Zeolite 나노 복합 방적사로 제조한 니트의 항균성)

  • Jeon, Yongwook;Park, Youngmi
    • Textile Coloration and Finishing
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    • v.33 no.1
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    • pp.24-30
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    • 2021
  • In this study, PET containing 3% silver ion-exchange zeolite was mixed with cotton in a ratio of 6:4 to prepare a spun yarn to evaluate the tensile strength, absorption speed, absorption rate, antibacterial property, and the efficiency of deodorization. As a result, the following conclusions were obtained. First, it can be confirmed that silver ion exchange zeolite is evenly distributed inside and on the surface of the antimicrobial PET-SF through SEM. It was found that the tensile strength between the CVC sample mixed with silver ion zeolite PET and cotton and the normal cotton 100% sample was slightly lower in the CVC sample. Although the absorption speed and water absorption rate were measured to find out the moisture characteristics, it was confirmed that there was no significant difference. The contact angle was slightly larger in the antimicrobial CVC sample, but the time it took for the moisture to completely penetrate into the knit fabric was 0.85 seconds. In addition, it was found that out of the total mixing ratio, 40% of antibacterial PET was spun with regular cotton to produce yarn, which had an excellent bacteria reduction rate of 99.9% and a deodorization efficiency of 85%.

Recovery of ultrafine particles from Chemical-Mechanical Polishing wastewater discharged by the semiconductor industry

  • Tu, Chia-Wei;Wen, Shaw-Bing;Dahtong Ray;Shen, Yun-Hwei
    • Proceedings of the IEEK Conference
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    • 2001.10a
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    • pp.715-718
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    • 2001
  • This study uses traditional alum coagulation and sedimentation process to treat CMP wastewater from cleaning after polishing. The primary goal is to successfully recycle both solid fines and water for semiconductor manufacturing. Results indicated that CMP wastewater may be successfully treated to recover clean water and fine particles by alum coagulation. The optimum operating conditions for coagulation are as fellowing: alum dosage of 10 ppm, pH at 5, rapid mixing speed at 800 rpm, 5 min rapid mixing time, and long slow mixing time. The treated water with low turbidity and an average residual aluminum ion concentration of 0.23 ppm may be considered for reuse. The settled sludge after alum coagulation contains mainly SiO$_2$particle with a minor content of aluminum (1.7 wt%) may be considered as raw materials for glass and ceramic industry.

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Thermodynamic Properties of $NiFe_2O_4-NiFe_2O_4$ Spinel Solid Solution

  • 박봉훈;김동수
    • Bulletin of the Korean Chemical Society
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    • v.20 no.8
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    • pp.939-942
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    • 1999
  • The tie lines delineating ion-exchange equilibria between NiFe2O4-NiCr2O4 spinel solid solution and Fe2O3-Cr2O3 corundum solid solution were determined at 900, 1000, and 1200 ℃ by electron microprobe and energy dispersive X-ray analysis of oxide phases, using the flux growth technique. Activities of the spinel components were calculated from the tie lines, assuming Temkin's ideal mixing in the corundum solid solution. The spinel phase could be expressed by a regular solution with negative deviations from ideality. The Gibbs free energies of mixing for spinel solid solution were discussed in terms of the cation distribution model, based on site preference energies and assuming random mixing on both tetrahedral and octahedral sites.

Sputtering of Solid Surfaces at Ion Bombardment

  • Kang, Hee-Jae
    • Proceedings of the Korean Vacuum Society Conference
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    • 1998.02a
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    • pp.20-20
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    • 1998
  • I Ion beam technology has recently attracted much interest because it has exciting t technological p아:ential for surface analysis, ion beam mixing, surface cleaning and etching i in thin film growth and semiconductor fabrication processes, etc. Es야~cially, ion beam s sputtering has been widely used for sputter depth profiling with x-photoelectron S spectroscopy (XPS) , Auger electron s$\pi$~troscopy(AES), and secondary-ion mass S야i따oscopy(SIMS). However, The problem of surface compositional ch없1ge due to ion b bombardment remains to be understo여 없ld solved. So far sputtering processes have been s studied by s따face an외ysis tools such as XPS, AES, and SIMS which use the sputtering p process again. It would be improbable to measure the modified surface composition profiles a accurately due to ion beam bombardment with surface analysis techniques based on sputter d depth profiling. However, recently Medium energy ion scattering spectroscopy(MEIS) has b been applied to study the sputtering of solid surface at ion bombardment and has been p proved that it has been extremely valuable in probing the surface composition 뻐d s structure nondestructively and quantita디vely with less than 1.0 nm depth resolution. To u understand the sputtering processes of solid surface at ion bombardment, The Molecular D Dynamics(MD) and Monte Carlo(MC) simulation has been used and give an intimate i insight into the sputtering processes of solid surfaces. In this presentation, the sputtering processes of alloys and compound samples at ion b bombardment will be reviewed and the MEIS results for the Ar+ sputter induced altered l layer of the TazOs thin film 뻐dd없nage profiling of Ar+ ion sputt얹"ed Si(100) surface will b be discussed with the results of MD and MC simulation.tion.

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이온빔을 이용한 TiN 박막 합성 및 내마모특성에 관한 연구

  • 윤주선;한전건;한승희
    • Proceedings of the Korean Vacuum Society Conference
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    • 1994.02a
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    • pp.53-54
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    • 1994
  • 초정밀 프레스 금형의 주요소재인 SKD 11 소재의 성능향상을 위한 저온표면 경화기술개발을 위해 dynamic ion beam mixing 법을 이용하여 TiN 박막합성 공정 및 내마모 특성에 관해 연구하였다.

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