• Korean Journal of Materials Research
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• v.10 no.6
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• pp.403-408
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• 2000

The Al-Cr-Zr composite metal powders were prepared by mechanical alloying and consolidated by vacuum hot pressing. The microstructural characteristics and the thermal stability of the MA Al-Cr-Zr alloys were evaluated by means of microhardness measurement, XRD and TEM in order to develop high temperature, high strength aluminum alloys. The mechanical alloying was conducted in attritor with 300rpm for 20 hours. The density of the vacuum hot pressed Al-Cr-Zr alloy reached at 97% of theoretical one. After exposing at $300^{\circ}C$ for 100 hours, there is almost no variation in hardness change of the MA alloys. Even after exposing at $ 500^{\circ}C$ for 100 hours, the hardness of the alloy was decreased within 6% of the initial value. The fine stable $Al_3Zr\;and\; Al_{13}Cr_2$ intermetallics were formed at the stage of consolidation and heat treatment in aluminum matrix. The good thermal stability of the MA Al-Cr-Zr alloy can ab attributed to the role of the dispersoids, inhibiting grain growth of nanocrystalline, and the final grain size after heat treatment was less than 150nm.

• Korean Journal of Materials Research
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• v.10 no.6
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• pp.398-402
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• 2000

Three kinds of $Al_3Ti-Cr$ alloys, namely, $Al_{67}Ti_{25}Cr_8,\;Al_{66}Ti_{24}Cr_{10}\;and\;Al_{59}Ti_{26}Cr_{15}$, were prepared by induction melting followed by the thermomechanical treatment. The corrosion behavior in 3.5% NaCl solution and the high-temperature oxidation behavior at 1000, 1100 and $1200^{\circ}C$ for the prepared alloys were investigated. Electrochemical results indicated increased resistance to localized corrosion with increasing Cr content. Cr additions were found to prevent passive film from undergoing brittle fracture. XPS results revealed the passive films of $Al_3Ti-Cr$ alloys were composed mainly of $Al_2O_3$ that coexisted with $TiO_2$ and $Cr_2O_3$. The overall oxidation resistance of the prepared alloys were excellent. Specifically, the oxidation resistance increased in the order of $Al_{59}Ti_{26}Cr_{15},\;Al_{66}Ti_{24}Cr_{10}\;and\;Al_{67}Ti_{25}Cr_8$. As the Al content in the base alloys increased, the $Al_2O_3$ formation was facilitated leading to the increased oxidation resistance.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.37-42
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• 2001

The concerns of the toxicity and health hazard of lead in solders have demanded the research to find suitable lead-free solder alloys. It was discussed that effect of the intermetallic formation and structure on the reliability of solder joints. In this study, lead-free solder alloys with compositions of Sn/3.5Ag/0.75Cu, Sn/2.0Ag/0.5Cu/2.0Bi were applied to the 48 $\mu$BGA packages. Also, the lead-free solder alloys compared with eutectic Sn/37Pb solder using shear test under various aging temperature. Common $\mu$BGA with solder components was aged at $130^{\circ}C$, $150^{\circ}C$ and $170^{\circ}C$. And the each temperature applied to 300, 600 and 900 hours. The thickness of the intermetallics was measured for each condition and the activation energy for their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS (Energy Dispersive Spectroscopy). These results for reliability of lead-free interconnections are discussed.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.71-79
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• 2021

In this study, we have successfully fabricated the Sn-Ni paste and evaluated the bonding properties for high-temperature endurable EV (Electric Vehicle) power module applications. From evaluating of the micro-structural changes in the TLPS (Transient Liquid Phase Sintering) joints with Sn and Ni contents in the Sn-Ni pastes, a lack of Ni powders and Ni particle agglomerations by Ni surplus were observed in the Sn-20Ni and Sn-50Ni joints (in wt.%), respectively. In contrast, relatively dense microstructures are observed in the Sn-30Ni and Sn-40Ni TLPS joints. From differential scanning calorimetry (DSC) thermal analysis results of the fabricated Sn-Ni paste and TLPS bonded joints, we confirmed that the complete reactions of Sn with Ni to form Ni-Sn intermetallic compounds (IMCs) at bonding temperatures occurred, and there is no remaining Sn in the joints after TLPS bonding. In addition, the interfacial reactions and IMC phase changes of the Sn-30Ni joints under various bonding temperatures were reported, and their mechanical shear strength were investigated. The TLPS bonded joints were mainly composed of residual Ni particles and Ni₃Sn₄ intermetallic phase. The average shear strength tended to increase with increasing bonding temperature. Our results indicated a high shear strength value of approximately 30 MPa at a bonding temperature of 270 ℃ and a bonding time of 30 min.

• Korean Journal of Metals and Materials
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• v.47 no.3
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• pp.147-154
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• 2009

The effect of carbon addition on the microstructures and mechanical properties of $Ni_3Al$ and TiAl intermetallic alloys have been characterized. It is shown that carbon is not only an efficient solid solution strengthener in $Ni_3Al$ and TiAl, it is also an efficient precipitation strengthener by fine dispersion of carbide. Transmission electron microscope investigation has been performed on the particle-dislocation interactions in $Ni_3Al$ and TiAl intermetallics containing various types of fine precipitates. In an $L1_2$-ordered $Ni_3Al$ alloy with 4 mol.% of chromium and 0.2~3.0 mol.% of carbon, fine octahedral precipitates of $M_{23}C_6$ type carbide, which has the cube-cube orientation relationship with the matrix, appear during aging. Typical Orowan loops are formed in $Ni_3Al$ containing fine dispersions of $M_{23}C_6$ particles. In the L10-ordered TiAl containing 0.1~2.0 mol.% carbon, TEM observations revealed that needle-like precipitates, which lie only in one direction parallel to the [001] axis of the $L1_0$ matrix, appear in the matrix and preferentially at dislocations. Selected area electron diffraction (SAED) patterns analyses have shown that the needle-shaped precipitate is $Ti_3AlC$ of perovskite type. The orientation relationship between the $Ti_3AlC$ and the $L1_0$ matrix is found to be $(001)_{Ti3AlC}//(001)_{L10\;matrix}$ and $[010]_{Ti3AlC}//[010]_{L10\;matrix}$. By aging at higher temperatures or for longer period at 1073 K, plate-like precipitates of $Ti_2AlC$ with a hexagonal structure are formed on the {111} planes of the $L1_0$ matrix. The orientation relationship between the $(0001)_{Ti2AlC}//(111)_{L10\;matrix}$ is and $[1120]_{Ti2AlC}//[101]_{L10\;matrix}$. High temperature strength of TiAl increases appreciably by the precipitation of fine carbide. Dislocations bypass the carbide needles at further higher temperatures.