• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1292-1293
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• 2006

A non-equilibrium powder metallurgy processing such as an MA/SPS (Mechanical Alloying / Spark Plasma Sintering) process is examined in a Ti-48moll%Al. TiAl intermetallic compound is a potential light-weight/high-temperature structural material. One of the major problems, however, limiting the practical use of the material is its poor workability. From this point, the powder metallurgy (PM) processing route has been attractive alternative of the conventional processing for such material The MA/SPS process is able to apply to a LIGA process. Optimization of the pseudo-superplasticity enables to fabricate micro-parts made of fine grained ceramics composites of TiAl by the LIGA process.

• 한국분말재료학회지
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• 제6권1호
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• pp.56-61
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• 1999

The plastic deformation behaviors for powder extrusion of rapidly soildified Al-Si-Fe alloys at high temperature were investigated. During extrusion of Al-Si-Fe alloys, primary Si and intermetallic compound in matrix are broken finely. Additionally, during extrusion metastable $\delta$ phase($Al_4SiFe_2$) intermetallic compound disappears and the equilibrium $\beta$ phase($Al_5FeSi_2$) is formed. In gereral, it was diffcult to establish optimum process variables for extrusion condition through experimentation, because this was costly and time-consuming. In this paper, in order to overcome these problems, we compared the experimental results to the finite element analysis for extrusion behaviors of rapidly solidified Al-Si-Fe alloys. This ingormation is expected to assist in improving rapidly solidified Al-Si alloys extrusion operations.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.104-108
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• 2002

This paper was investigated the lead free solder characteristics by P mass percentage chang e. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed for estimation. By adding P on the solder alloys, it was showe d improvement of tensile strength, reduction of intermetallic compound growth and reduction of oxidization of fusible solder under wave soldering processes. After comparing solder alloy containing P with tin lead eutectic solder alloy, p containing solder alloys showed much better solderability than eutectic solder alloys.

• 열처리공학회지
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• 제6권3호
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• pp.127-137
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• 1993

The changes of lamellar(${\alpha}_2+{\gamma}$) structure of TiAl intermetallic compound which is a high potential, high temperature aerospace material was investigated by heat treatment. The lamellar structure was short and made subgrain in prior a grains after homogenizing at 1523 K. It became longer and finer, and the subgrain went out during subsequent isothermal heatteating at 1273 K. The yield, fracture strength and strain to fracture if the heat treated specimens was increased and the hardness of them was decreased a little in the finer lamellar structure, because fine lamellar interface, sugrain boundary and grain boundary may block initiation and propagation of crack.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
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• pp.144-145
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• 1994

• 열처리공학회지
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• 제21권3호
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• pp.157-163
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• 2008

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1998년도 추계학술대회 및 발표대회 강연 및 발표논문 초록집
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• pp.17-17
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• 1998

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
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• pp.51-51
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• 2004

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 추계 기술심포지움 논문집
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• pp.67-71
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• 2000

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1999년도 춘계학술대회 및 발표대회 강연 및 발표논문 초록집
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• pp.41-41
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• 1999