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Miyano, Naoki;Kumagai, Yusuke;Yoshimoto, Masayoshi;Nishimura, Yuta;Tanaka, Shigeo;Ameyama, Kei
- Proceedings of the Korean Powder Metallurgy Institute Conference
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- 2006.09b
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- pp.1292-1293
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- 2006
A non-equilibrium powder metallurgy processing such as an MA/SPS (Mechanical Alloying / Spark Plasma Sintering) process is examined in a Ti-48moll%Al. TiAl intermetallic compound is a potential light-weight/high-temperature structural material. One of the major problems, however, limiting the practical use of the material is its poor workability. From this point, the powder metallurgy (PM) processing route has been attractive alternative of the conventional processing for such material The MA/SPS process is able to apply to a LIGA process. Optimization of the pseudo-superplasticity enables to fabricate micro-parts made of fine grained ceramics composites of TiAl by the LIGA process.
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정기승
- Journal of Powder Materials
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- v.6 no.1
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- pp.56-61
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- 1999
The plastic deformation behaviors for powder extrusion of rapidly soildified Al-Si-Fe alloys at high temperature were investigated. During extrusion of Al-Si-Fe alloys, primary Si and intermetallic compound in matrix are broken finely. Additionally, during extrusion metastable $\delta$ phase($Al_4SiFe_2$) intermetallic compound disappears and the equilibrium $\beta$ phase($Al_5FeSi_2$) is formed. In gereral, it was diffcult to establish optimum process variables for extrusion condition through experimentation, because this was costly and time-consuming. In this paper, in order to overcome these problems, we compared the experimental results to the finite element analysis for extrusion behaviors of rapidly solidified Al-Si-Fe alloys. This ingormation is expected to assist in improving rapidly solidified Al-Si alloys extrusion operations.
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김경대;김택관;황성진;신영의;김종민
- Proceedings of the International Microelectronics And Packaging Society Conference
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- 2002.05a
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- pp.104-108
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- 2002
This paper was investigated the lead free solder characteristics by P mass percentage chang e. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed for estimation. By adding P on the solder alloys, it was showe d improvement of tensile strength, reduction of intermetallic compound growth and reduction of oxidization of fusible solder under wave soldering processes. After comparing solder alloy containing P with tin lead eutectic solder alloy, p containing solder alloys showed much better solderability than eutectic solder alloys.
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Shin, Jae-Kwan;Chung, In-Sang;Park, Kyuong-Chae
- Journal of the Korean Society for Heat Treatment
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- v.6 no.3
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- pp.127-137
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- 1993
The changes of lamellar(${\alpha}_2+{\gamma}$) structure of TiAl intermetallic compound which is a high potential, high temperature aerospace material was investigated by heat treatment. The lamellar structure was short and made subgrain in prior a grains after homogenizing at 1523 K. It became longer and finer, and the subgrain went out during subsequent isothermal heatteating at 1273 K. The yield, fracture strength and strain to fracture if the heat treated specimens was increased and the hardness of them was decreased a little in the finer lamellar structure, because fine lamellar interface, sugrain boundary and grain boundary may block initiation and propagation of crack.
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