• 대한금속재료학회지
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• 제47권5호
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• pp.267-273
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• 2009

Three types of structural intermetallic compounds, $Ni_3Al$, NiAl and TiAl, having each single phase structure without pores were produced by arc-melting process. Their sliding wear properties were investigated against a hardened tool steel. It was shown that the wear of the intermetallic compounds was hardly occurred against the hardened tool steel. TiAl compound showed the best wear resistance among them. In this case, wear was preferentially occurred on the surface of the hardened tool steel of the mating material which has higher hardness. It could be found that the wear mode on intermetallics without pores by arc-melting process was different from that on its porous layer coated on steel by combustion synthesis.

• 대한금속재료학회지
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• 제48권2호
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• pp.141-147
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• 2010

An Ni-Al intermetallic coating has been produced by induction heating on mild steel. The effect of the induction heating conditions on the microstructure of the coating has been investigated. The reaction synthesis of the intermetallic compounds was promoted while increasing the heating rate and the holding time at reaction temperature. Especially, an NiAl phase corresponding to the initial composition of mixed powder was predominantly formed. However, the synthesis at low reaction temperatures occurred by solid state diffusion during the holding time and an Fe-Al reaction layer was formed at the interface with the substrate, regardless of the heating rate. The combustion synthesis of the intermetallic compound occurred at a temperature higher than 1023 K and resulted in an almost single phase NiAl structure.

• 마이크로전자및패키징학회지
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• 제9권2호
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• pp.1-9
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• 2002

실제 BGA패키지에서 Sn-Ag-(Cu) 솔더와 금속패드가 반응하여 생성된 금속간 화합물의 특성을 Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS)f) X-ray Diffractometer (XRD)를 사용하여 분석하였다. EDS로 분석한 결과를 보면 BGA 패키지에서 Sn-Ag-Cu 솔더와 Au/Ni/Cu 금속층간의 반응으로 생성된 금속간화합물은 $(Cu,Ni)_6Sn_5$로 예상되며 . Cu의 편석은 솔더와 Ni 층 사이에서 발견되었다. XRD 분석결과 Cu를 함유하고 있는 Sn-Ag-Cu 솔더와 Ni층 사이에서는 $\eta -Cu_6 Sn_5$ 타입의 금속간화합물이 분석되었으며 Sn-Ag 솔더와 Ni층 사이에서는 $Ni_3$Sn_4$가 분석되었다. 계면에 생성된 금속간화합물은 리플로 회수와솔더내의 Cu의 함량에 따라증가하였다

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.73-73
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• 2000

Shear strength of BGA solder joints on Cu pad was studied for Cu-contained Sn n.5 a and 2.5wt.% Cu) and Sn-Pb (o.5wt.% Cu) solders, with emphasis on the roles of the C Cu-Sn intermetallic layer thickness and the roughness of the interface between the i intermetallic layer and solder. The shear strength test was performed both for a as-soldered s이der joints with soldering reaction times of 1, 2, 4 min and for aged s이der j joints at 170 C up to 16 days. The Cu addition to both pure Sn and eutectic Sn-Pb s solders increased the intermetallic layer thickness at both soldering and aging t temperatures. The Cu addition also resulted in changes in the roughness of the interface b between the intermetallic layer and solder at as-soldered states. With increasing Cu c content. the interface roughened for Sn-Cu solders whereas it flattened for Sn-Pb-Cu s solders. The shear fractures in all solder joints investigated were confined in the bulk s solder rather than through the intermetallic layer. Therefore, the effect of Cu content in s solders on the shear strength of the solder joints was primarily attributed to its i influence on the micros$\sigma$ucture of bulk solder, such as the size and spatial distributions of CU6Sn5 precipitates. In addition, the critical intermetallic layer thickness for a m maximum shear strength seemed to depend on the Cu content in bulk solder.older.

• Composites Research
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• 제16권3호
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• pp.68-74
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• 2003

본 논문에서는 Ni과 Al 금속박판 사이의 자전고온반응을 이용한 금속간화합물/금속 적층복합재료의 제조시 제조공정 조건이 최종 미세조직에 미치는 영향을 연구하였다. 열분석을 통하여 Ni과 Al사이의 반응은 먼저 NiA1$_3$가 핵생성­성장 기구에 의해 생성된 후 다시 Ni$_2$A1$_3$로 확산변태됨을 확인하였다. 자전고온반응을 열역학적으로 해석하여 금속박판의 두께비(Ni:Al) 및 반응전 열처리와 반응후 미세조직에서 잔류한 Al의 부피분율과의 관계를 정립하였다. 후열처리 공정에 의해 Ni/Nl$_3$Al/NiAl의 적층구조와 각 두께비에서 82%(1:1), 59.5%(2:1), 40%(4:1)의 부피분율을 가지는 금속간화합물/금속적층복합재료를 얻을 수 있었다.

• 마이크로전자및패키징학회지
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• 제19권2호
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• pp.35-39
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• 2012

플립칩 접합시 발생하는 계면반응 거동과 접합특성을 계면에 생성되는 금속간화합물의 관점에서 접근하였다. 이를 위하여 Al/Cu와 Al/Ni의 under bump metallization(UBM) 층과 Sn-Cu계 솔더(Sn-3Cu, Sn-0.7Cu)와의 반응에 의한 금속간화합물의 형성거동 및 계면접합성을 분석하였다. Al/Cu UBM 상에서 Sn-0.7Cu 솔더를 리플로우한 경우에는 솔더/UBM 계면에서 금속간화합물이 형성되지 않았으며, Sn-3Cu를 리플로우한 경우에는 계면에서 생성된 $Cu_6Sn_5$ 금속간화합물이 spalling 되어 접합면이 분리되었다. 반면에 Al/Ni UBM 상에서 Sn-Cu계 솔더를 리플로우한 경우에는 0.7 wt% 및 3 wt%의 Cu 함량에 관계없이 $(Cu,Ni)_6Sn_5$ 금속간화합물이 계면에 형성되어 있었으며, 계면접합이 안정적으로 유지되었다.

• 한국주조공학회지
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• 제32권1호
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• pp.50-56
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• 2012

Fusion bonding of cast iron and Al alloy is an effective way to improve the properties such as low inertia, high efficiency and corrosion resistance in machinery parts. In case of fusion bonding, intermetallic compound layers are formed at the interface between cast iron and Al alloy interface. It is important to control the intermetallic compound layers for improving bonding strength. The formation behavior of intermetallic compound layer by heat treatment has been investigated. Heat treatment was performed at temperature from $600^{\circ}C$ to $800^{\circ}C$ with $100^{\circ}C$ interval for an hour to investigate the phase transformation during heat treatment. Heat treated specimens were analyzed by using FE-SEM, EPMA and EDS. The EPMA/WDS results revealed that various phases were formed at the interface, which exhibited 4 distinct intermetallic compound layers such as ${\tau}_6-Al_{4.5}FeSi$, ${\tau}_2-Al_3FeSi$, ${\tau}_{11}-Al_5Fe_2Si $and ${\eta}-Al_5Fe_2$. Also, fine precipitation of ${\tau}_1-Al_2Fe_3Si_3$ phase was formed between ${\tau}_{11}$ and ${\eta}$ layer. The phase fraction in intermetallic compound layer was changed by heat treatment temperature. At $600^{\circ}C$, intermetallic compound layer of ${\tau}_6$ phase was mainly formed with increasing heat treatment time. With increasing heat treatment temperature to $800^{\circ}C$, however, ${\tau}_2$ phase was mainly distributed in intermetallic compound layer. ${\tau}_1$ phase was remarkably decreased with increasing heat treatment time and temperature.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2008년도 추계학술발표대회 및 제15회 신소재 심포지엄
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• pp.28.1-28.1
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• 2008

• 한국재료학회:학술대회논문집
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• 한국재료학회 2007년도 추계학술발표대회 및
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• pp.73.2-73.2
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• 2007

• Bulletin of the Korean Chemical Society
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• 제31권6호
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• pp.1797-1799
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• 2010