• 한국재료학회지
• /
• 제11권4호
• /
• pp.266-271
• /
• 2001

Al-Cu-Mn 주조합금의 응력부식균열 저항성에 미치는 Cd첨가의 영향을 C-ring test와 전기전도도 시험을 통하여 조사하였다. Cd첨가량이 증가함에 따라 전기전도도가 증가하였고 SCC 저항성도 증가하였다. SCC 시험결과 균열이 입계를 따라 전파되는 입계파괴가 일어났으며, 파면은 취성파괴양상을 나타내었고, 입계를 따라 조대 석출물과 무석출대가 나타난 것으로 보아서 이 합금의 SCC 기구는 anodic dissolution model이라고 판단된다. Cd을 첨가하지 않은 경우 최대경도값은 127Hv였으나, Cd을 첨가한 경우 최대경도값은 138∼146Hv로 증가하였다.

• 한국재료학회지
• /
• 제12권6호
• /
• pp.436-441
• /
• 2002

Effect of Sn addition on the stress corrosion cracking(SCC) resistance of the Al-Cu-Mn cast alley was investigated by C-ring teat and electrical conductivity measurement, The electrical conductivity and SCC resistance increased by Sn addition. The alley containing 0,10%Sn showed maximum electrical conductivity and the best SCC resistance. At the same composition, the electrical conductivity and SCC resistance increased from peak aged condition to ever aged condition. The PFZ and coarse precipitates along the grain boundary were observed from TEM micrographs. The fracture mode of the alloy was confirmed as intergranular type and showed brittle fracture surface. The SCC mechanism of the alloy was concluded as the anodic dissolution model, The maximum hardness was increased from 130Hv in the Sn-free alloy to 156Hv in the 0.10%Sn added alloy.