• Title/Summary/Keyword: Interfacial stress singularity

Search Result 4, Processing Time 0.017 seconds

Viscoelastic Analysis of Stress Intensity Factor for Interface Edge Crack in a Unidirectional Liminate (단일방향 복합재료의 공유면에 존재하는 계면 모서리균열의 점탄성 해석)

  • 이상순;김범식
    • Computational Structural Engineering
    • /
    • v.10 no.1
    • /
    • pp.129-134
    • /
    • 1997
  • Interfacial stress singularity in a unidirectional two-dimensional laminate model consisting of an elastic fiber and a viscoelastic matrix has been investigated using the time-domain boundary element method. First, the interfacial singular stresses between the fiber and the matrix of a unidirectional laminate subjected to a uniform transverse tensile strain have been investigated near the free surface, but without any defect or any edge crack. Such a stress singularity might lead to fiber-matrix debonding or interfacial edge cracks. Then, the overall stress intensity factor for the case of a small interfacial edge crack of length a has been computed.

  • PDF

Viscoelastic Analysis of an Interface Edge Crack in a Bonded Polymeric Film

  • Lee, Sang-Soon
    • Journal of the Semiconductor & Display Technology
    • /
    • v.9 no.3
    • /
    • pp.35-39
    • /
    • 2010
  • Interfacial stress singularity induced in an analysis model consisting of the polymeric thin film and the elastic substrate has been investigated using the boundary element method. The interfacial singular stresses between the viscoelastic thin film and the elastic substrate subjected to a uniform moisture ingression are investigated for the case of a small interfacial edge crack. It is assumed that moisture effects are assumed to be analogous to thermal effects. Then, the overall stress intensity factor for the case of a small interfacial edge crack is computed. The numerical procedure does not permit calculation of the limiting case for which the edge crack length vanishes.

Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
    • /
    • v.14 no.3
    • /
    • pp.309-315
    • /
    • 2001
  • The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

  • PDF

Fracture Mechanical Characterization of Bi-material Interface for the Prediction of Load Bearing Capacity of Composite-Steel Bonded Joints (복합재료-탄소강 접착제 결합 조인트의 하중지지 능력 예측을 위한 이종 재료 접합 계면의 파괴 역학적 분석)

  • Kim, Won-Seok;Shin, Kum-Chel;Lee, Jung-Ju
    • Composites Research
    • /
    • v.19 no.4
    • /
    • pp.15-22
    • /
    • 2006
  • One of the primary factors limiting the application of composite-metal adhesively bonded joints in structural design is the lack of a good evaluation tool for the interfacial strength to predict the load bearing capacity of boned joints. In this paper composite-steel adhesion strength is evaluated in terms of stress intensity factor and fracture toughness of the interface corner. The load bearing capacity of double lap joints, fabricated by co-cured bonding of composite-steel adherends has been determined using fracture mechanical analysis. Bi-material interface comer stress singularity and its order are presented. Finally stress intensities and fracture toughness of the wedge shape bi-material interface corner are determined. Double lap joint failure locus and its mixed mode crack propagation criterion on $K_1-K_{11}$ plane have been developed by tension tests with different bond lengths.