• Composites Research
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• v.25 no.3
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• pp.76-81
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• 2012

Atmospheric pressure plasma treatment on carbon nanotube (CNT) surfaces was performed to modify reinforcement effect and interfacial adhesion of carbon fiber reinforced CNT-phenolic composites. The surface changes occurring on CNT treated with plasma were analyzed by using Fourier transform infrared spectroscope (FT-IR). The significant improvement of wettability on CNT was confirmed by static contact angle test after plasma treatment. Such plasma treatment resulted in a decrease in the advancing contact angle from $118^{\circ}$ to $60^{\circ}$. The interfacial adhesion between carbon fiber and CNT-phenolic composites increased by plasma treatment based on apparent modulus test results during quasi-static tensile strength. Furthermore, the proposed database offers valuable knowledge for evaluating interfacial shear strength (IFSS).

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1596-1598
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• 1999

In order to determine what influences the interfacial breakdown between two internal dielectric surfaces. We studied the interfacial breakdown phenomena at several interfacial conditions. With the increase of interfacial pressure, at first breakdown strength in interfaces was increased, and then saturated. Breakdown strength in interface pasted with silicone oil was higher than that with silicone grease. As a function of heat treatment time in a vacuum oven interfacial breakdown strength was increased much in XLPE/EPDM laminates pasted with silicone grease but increased a little in that with silicone oil. As an increase of curing agent in silicone oil and grease, breakdown strength in interfaces was increased and then saturated.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Korean Journal of Materials Research
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• v.18 no.9
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• pp.486-491
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• 2008

The effect of annealing treatment conditions on the interfacial adhesion energy between electrolessplated Ni film and polyimide substrate was evaluated using a $180^{\circ}$ peel test. Measured peel strength values are $26.9{\pm}0.8,\;22.4{\pm}0.8,\;21.9{\pm}1.5,\;23.1{\pm}1.3,\;16.1{\pm}2.0\;and\;14.3{\pm}1.3g/mm$ for annealing treatment times during 0, 1, 3, 5, 10, and 20 hours, respectively, at $200^{\circ}C$ in ambient environment. XPS and AES analysis results on peeled surfaces clearly reveal that the peeling occurs cohesively inside polyimide. This implies a degradation of polyimide structure due to oxygen diffusion through interface between Ni and polyimide, which is also closely related to the decrease in the interfacial adhesion energy due to thermal treatment in ambient conditions.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.39-47
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• 2007

It is investigated how KOH and Rthylenediamine(EDA) treatment conditions on Polyimide film surface affect the interfacial fracture energy between electroless plated Ni and Polyimide film by $180^{\circ}$ peel test. Estimated values of interfacial fracture energy were 24.5 g/mm and 33.3 g/mm for the KOH treatment times under 1 and 5 minutes, respectively, while, those were 31.6 g/mm and 22.3 g/mm for EDA treatment times under 1 and 5 minutes, respectively. Interfacial bonding between electroless plated Ni and Polyimide seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical treatment produces carboxyl and mine functional groups which are closely related the interfacial bonding mechanism. Finally, it is speculated that interfacial fracture energy seems to be controlled by O=C-O bonding near cohesive failure region.

• Carbon letters
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• v.1 no.3_4
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• pp.138-142
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• 2001

The effect of electrochemical surface treatments in KOH chemical solution on microstructures of carbon blacks was investigated in terms of surface functional values and XRD measurements. And their mechanical interfacial properties of the carbon blacks/rubber composites were studied by the composite tearing energy ($G_{IIIC}$). It was found that the development of basic-surface functional groups lead to the significant physical changes of carbon blacks, such as, decrease of the interlayer spacing ($d_{002}$), increase of the crystalline size along c-axis ($L_c$), and increase of degree of crystalline (${\chi}_c$). This treatment is possibly suitable for carbon blacks to be incorporated in a hydrocarbon rubber matrix, resulting in improving the hardness and tearing energy of the resulting composites.

• Carbon letters
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• v.11 no.2
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• pp.102-106
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• 2010

In this work, the effect of aminized multi-walled carbon nanotubes (NH-MWNTs) on the mechanical interfacial properties of epoxy nanocomposites was investigated by means of fracture toughness, critical stress intensity factor ($K_{IC}$), and impact strength testing, and their morphology was examined by scanning electron microscope (SEM). It was found that the incorporation of amine groups onto MWNTs was confirmed by the FT-IR and Raman spectra. The mechanical interfacial properties of the epoxy nanocomposites were remarkably improved with increasing the NH-MWNT content. It was probably attributed to the strong physical interaction between amine groups of NH-MWNTs and epoxide groups of epoxy resins. The SEM micrographs showed that NH-MWNTs were uniformly embed and bonded with epoxy resins, resulted in the prevention of the deformation and crack propagation in the NH-MWNTs/epoxy nanocomposites.

• Journal of Korea Foundry Society
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• v.25 no.2
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• pp.80-87
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• 2005

The microstructure and mechanical property of the Ni and Ni-Cr porous metal reinforced AC4C matrix composites fabricated by squeeze casting were investigated. In this study Ni, Ni-Cr porous metals which are estimated to be easy to fabricate by squeeze casting are used as strengtheners for composite materials. As a matrix material, Al-7wt.%Si-0.3wt.%Mg(AC4C) has been used. In case of Ni/AC4C and Ni-Cr/AC4C composite, $750^{\circ}C$ melt temperature and minimum 25MPa squeezing pressure are needed to produce sound composite materials. The observation of interfacial reaction zone at various heat treatment condition shows that atsolutionizing temperature of above $520^{\circ}C$, the interfacial reaction zone increases proportionally with heat treatment time and the reaction products formed by interfacial reactions are mainly composed by $Al_{3}Ni$ and $Al_{3}Ni_{2}$ phases.

• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.275-282
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• 2015

The cost for maintenance (replacement cost) of Ni-superalloy components in plant industry is very expensive because of high unit price of INCONEL 718. A development of repairing technology using kinetic spray process can be very helpful for reducing the maintenance cost. However, it is very difficult to produce well-deposited INCONEL 718 layer showing high interfacial bond strength via kinetic spraying. Thus, INCONEL 718 was deposited on SCM 440 substrate and the interfacial properties were investigated, in order to elucidate the cause of hindrance to the bonding between INCONEL 718 layer and SCM 440 substrate. As a result, it was revealed that the dominant obstacle to the interfacial bonding was excessive compressive residual stress accumulated in the coating layer, resulting from low plastic-deformation susceptibility of INCONEL 718. Nevertheless, the bonding state was enhanced by the post heat-treatment through relieving the residual stress and generating a diffusion/metallurgical bonding between the INCONEL 718 deposit and SCM 440 substrate.

• Polymer(Korea)
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• v.25 no.4
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• pp.587-593
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• 2001

In this work, red mud (RM) was chemically modified by 0.1, 1, and 5 M H3PO4 solution to prepare epoxy/RM nanocomposites. The effect of chemical treatment on pH, acid-base values, specific surface area, and porosity of RM surface was analyzed. To estimate the mechanical interfacial properties of epoxy/RM nanocomposites, the critical stress intensity factor (K$_{IC}$) was measured. From the experimental results, it was clearly revealed that the porosity, specific surface area, and acid values of RM surface were developed as the increase of the treatment concentration due to the increase of acidic functional group, including hydroxyl group on RM surface. The mechanical interfacial properties of epoxy/treated-RM nanocomposites were higher than those of epoxy/RM as-received due to an improvement of interfacial bonding between basic matrix and RM surface.