• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.332-336
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• 2001

In this study, the reaction at UBM(Under Bump Metallurgy) and solder interface was investigated. The UBM employed in conventional optical packages, Au/Pt/Ti layer, were found to dissolve into molten Au-Sn eutectic solder during reflow soldering. Therefore, the reaction with different diffusion barrier layer such as Fe, Co, Ni were investigated to replace the conventional R layer. The reaction behavior was investigated by reflowing the solder on the pad of the metals defined by Cr layer for 1, 2, 3, 4, and 5 minutes at 330$^{\circ}C$. Among the metals, Co was found to be most suitable for the diffusion barrier layer as the wettability with the solder was reasonable and the reaction rate of intermetallic formation at the interface is relatively slow.

• Korean Journal of Materials Research
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• v.21 no.2
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• pp.120-124
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• 2011

Silicon heterojunction solar cells have been studied by many research groups. In this work, silicon heterojunction solar cells having a simple structure of Ag/ZnO:Al/n type a-Si:H/p type c-Si/Al were fabricated. Samples were fabricated to investigate the effect of transparent conductive oxide growth conditions on the interface between ZnO:Al layer and a-Si:H layer. One sample was deposited by ZnO:Al at low working pressure. The other sample was deposited by ZnO:Al at alternating high working pressure and low working pressure. Electrical properties and chemical properties were investigated by light I-V characteristics and AES method, respectively. The light I-V characteristics showed better efficiency on sample deposited by ZnO:Al by alternating high working pressure and low working pressure. Atomic concentrations and relative oxidation states of Si, O, and Zn were analyzed by AES method. For poor efficiency samples, Si was diffused into ZnO:Al layer and O was diffused at the interface of ZnO:Al and Si. Differentiated O KLL spectra, Zn LMM spectra, and Si KLL spectra were used for interface reaction and oxidation state. According to AES spectra, sample deposited by high working pressure was effective at reducing the interface reaction and the Si diffusion. Consequently, the efficiency was improved by suppressing the SiOx formation at the interface.

• Bulletin of the Korean Chemical Society
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• v.34 no.6
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• pp.1689-1692
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• 2013

Food is a common source of chromium (Cr) exposure. However, it is difficult to analyze Cr in complex food matrices by using inductively coupled plasma mass spectrometry (ICP-MS) because the major isotope, $^{52}Cr$, is masked by interference generated by the sample matrix and the plasma gas. Among the systems available to minimize interference, the recently developed collision-reaction interface (CRI) has a different structure relative to that of other systems (e.g., collision cell technology, octopole reaction system, and dynamic reaction cell) that were designed as a chamber between the skimmer cone and quadrupole. The CRI system introduces collision or reaction gas directly into the plasma region through a modified hole of skimmer cone. We evaluated the use of an CRI ICP-MS system to minimize polyatomic interference of $^{52}Cr$ and $^{53}Cr$ in various foodstuffs. The $^{52}Cr$ concentrations measured in the standard mode were 2-3 times higher than the certified values. This analytical method based on an ICP-MS system equipped with a CRI of helium gas was effective for Cr analysis in complex food matrices.

• Korean Journal of Metals and Materials
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• v.49 no.8
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• pp.664-670
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• 2011

3-ply Mg/Al/STS clad-metal was fabricated by the roll bonding process. An interfacial reaction layer was formed at the Mg/Al interface at and above $300^{\circ}C$ whereas no interfacial reaction layer was observed up to $400^{\circ}C$. The effect of the interfacial reaction layer on the mechanical and fracture properties in clad metals after heat treatments were investigated The chemical compositions were analyzed at the Mg/Al interface by an Energy dispersive X-ray analysis (EDX). A tension test was performed to examine the interfacial cracking properties. The Mg layer fractured first, causing a sudden drop of the stress and Al/STS layer continued to deform until the final fracture. Periodic cracks and crack propagation was observed at the reaction layer between Mg and Al.

• International Journal of Concrete Structures and Materials
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• v.1 no.1
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• pp.75-81
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• 2007

The concrete pavement of the Seohae Highway in Korea has suffered from serious distress, only four to seven years after construction. Deterioration due to Alkali-Silica Reaction (ASR) has seldom been reported per se in Korea, because the aggregate used for the cement concrete has been considered safe against alkali-silica reaction so far. The purpose of this study is to examine the deterioration caused by an alkali-silica reaction of concrete pavement in Korea. The investigation methods included visual inspection and Automatic Road Analyzer (ARAN) analysis of surface cracks, coring for internal cracks, stereo microscopic analysis, scanning electronic microscope (SEM) analysis, and electron dispersive X-ray spectrometer (EDX) analysis. The results are presented as follows: the crack pattern of the concrete pavement in Korea was longitudinal cracking, map cracking or D-cracking. Local areas of damage were noticed four to five years after construction. The cracks started from edges or joints and spread out to slabs. The most intensive cracking was observed at the intersection of the transverse and longitudinal joints. Where cracking was the most intense, pieces of concrete and aggregate had spalled away from top surface and joint interface area. The progress of deterioration was very fast. The reaction product of alkali-silica gel was clearly identified by its generally colorless, white, or very pale yellow hue seen through a stereo optical microscopy. The typical locations of the reaction product were at the interface between aggregate and cement paste in a shape of a rim, within aggregate particles in the cracks, and in the large void in the cement paste. Most of the white products were found at interface or internal aggregates. SEM and EDX analysis confirmed that the white gel was a typical reaction product of ASR. The ASR gel in Korea mainly consisted of Silicate (Si) and Potassium (K) from the cement. The crack in the concrete pavement was caused by ASR. It seems that Korea is no longer safe from alkali-silica reaction.

• Journal of the Korean Ceramic Society
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• v.30 no.5
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• pp.357-364
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• 1993

Chemical reaction occurred in the interface of Mn-Zn ferrite and glass after bonding. Effects of the formation of reaction layer on the magnetic properties were investigated. The composition of glass was 23PbO-61SiO2-6ZnO-8Na2O-2K2O and the ferrite was chosen to have a high permeability. Toroid samples of ferrites bonded with glasses, were heat-treated at $700^{\circ}C$, 80$0^{\circ}C$ and 90$0^{\circ}C$ for 1h. The reaction was observed to increase with bonding temperature, resulting in the development of reaction layer. Subsequently the initial permeability was found to be decreased. The permeabilities decreased by 25% with increasing bonding temperature from $700^{\circ}C$ to 80$0^{\circ}C$. At the bonding temperature of 90$0^{\circ}C$, the permeability was decreased by 45%, compared to that of 80$0^{\circ}C$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.12
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• pp.83-89
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• 1996

The electrochemical spike oscillations at the nickel (Ni) electrode/(0.05M KHC$_{8}$H$_{4}$O$_{4}$) buffer solution (pH 9) interface have been studied using voltammetric and chronoamperometric methods. The nature of the periodic cathodic current spikes is the activation controlled currents due to the hydrogen evolution reaction and depends onthe fractioanl surface coverage of the adsorbed hydrogen intermediate or the cathodic potential. There is two kinds of the waveforms corresponding to two kinds of the cathodic current spike oscillations. The widths, periods, and amplitudes of the cathodic current spikes are 4 ms or 5ms, 151 ms or 302 ms, and < 30 mA or < 275 mA, respectively. The fast discharge and recombination reaction steps are 1.5 times and twice and faster than the slow discharge and recombination reaction steps. The fast and slow discharge and recombination reaction steps are 1.5 times and twice faster than the slow discharge and recombination reaction steps. The fast and slow discharge and recombination reactions corresponding to the fast and slow adsorption sites at the Ni cathode.

• Journal of Korea Multimedia Society
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• v.18 no.3
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• pp.376-386
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• 2015

Since affective computing has been introduced in 90s, affect recognition technology has achieved substantial progress recently. However, the application of user emotion recognition into software user interface is in its early stages. In this paper, we describe a new approach for developing mobile user interface which could react differently depending on user emotion states. First, an emotion reaction model is presented which determines user interface reactions for each emotional state. We introduce a pair of mappings from user states to different user interface versions. The reacting versions are implemented by a set of variations for a view. Further, we present an authoring framework to help developers/designers to create emotion-aware reactions based on the proposed emotion reaction model. The authoring framework is necessary to alleviate the burden of creating and handling multi versions for views at the development process. A prototype implementation is presented as an extension of the existing authoring tool DAT4UX. Moreover, a proof-of-concept application featuring an emotion-aware interface is developed using the tool.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.67-73
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• 2012

After flash memory card(FMC) was manufactured by $B^2it$ process, interfacial reaction of silver bump with thermal stress was studied. To investigate bonding reliability of Ag bump, thermal shock and thermal stress tests were conducted and then examined on the crack between Cu land and Ag bump interface. Diffusion reaction of Ag bump/Cu land interface was analyzed using SEM, EDS and FIB. The Ag-Cu alloy layer due to the interfacial reaction was formed at the Ag/Cu interface. As the diffusivity of Ag ${\rightarrow}$ Cu is faster than Cu ${\rightarrow}$ Ag, a lot of (Cu, Ag) alloy layers were observed at the Cu layer than Ag. These alloy layers contributed to increase the Cu-Ag bonding strength and its reliability.

• Journal of Korea Foundry Society
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• v.17 no.4
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• pp.371-378
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• 1997

The study for direct synthesis of TaC carbide which was a reaction product of tantalum and carbon in the cast iron was performed. Cast iron which has hypo-eutectic composition was cast bonded in the metal mold with tantalum thin sheet of thickness of $100{\mu}m$. The contents of carbon and silicon of cast iron matrix was controlled to have constant carbon equivalent of 3.6. The chracteristics of microstructure and the formation mechanism of TaC carbide in the interfacial reaction layer in the cast iron/tantalum thin sheet heat treated isothermally at $950^{\circ}C$ for various time were examined. TaC carbide reaction layer was grown to the dendritic morphology in the cast iron/tantalum thin sheet interface by the isothermal heat treatment. The composition of TaC carbide was 48.5 at.% $Ti{\sim}48.6$ at.% C-2.8 at.% Fe. The hardness of reaction layer was MHV $1100{\sim}1200$. The thickness of reaction layer linearly increased with increasing the total content of carbon in the cast iron matrix and isothermal heat treating time. The growth constant for TaC reaction layer was proportional to the log[C] of the matrix. The formation mechanism of TaC reaction layer at the interface of cast iron/tantalum thin sheet was proved to be the interfacial reaction.