• Journal of the Korean Ceramic Society
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• v.34 no.10
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• pp.1009-1014
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• 1997

Ammonia gas was blown into the solution of zirconium ion to induce precipitation of supersaturated zirconium ion at gas-liquid interface with increase in pH. The influence of pH on the phase and particle size of precipitate and calcined powders has been investigated. At pH 4.5 of zirconium solution, maximum yield of 98.7% was obtained. Above pH 4.5, there was no more increase of yield. Above pH 5.5, large aggregates consisting of primary particles were observed in precipitate and calcined powders. At pH 4.5, almost aggregate-free fine spherical zirconia powders were obtained.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1307-1308
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• 2006

The purpose of this study was to examine the interfacial reaction between diamond grits and Ni-based, Ag-based, brazing filler metal, respectively. The morphology of the interface between diamond grits and Ni-based, filler metal exhibited a very good condition after this heat treatment. Cr-carbide and Ni-rich compounds were detected by XRD analysis in the vicinity of the interface between diamond grits and Ni-based, filler metal after vacuum induction brazing. Chromium carbide is considered to play an important role in the high bonding strength achieved between diamonds grits and the brazing alloy.

• Journal of Adhesion and Interface
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• v.13 no.2
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• pp.85-88
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• 2012

In this paper, the curing reaction of UF resins was investigated by a real time FT-IR method. The curing temperature range of the UF resin was $25{\sim}200^{\circ}C$. It was found that the reactions of UF resin at different temperatures resultedin resins with different cross-linked structures. A real time FT-IR spectroscopy can be considered as a good routine analytical tool for following the progress of UF resin curing.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.169-169
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• 2000

최근 반도체 소자의 초고집적화 현상에 따라 기존의 Al-base 합금에 대한 한계에 달하면서 그에 대한 대체 물질로 Cu가 관심을 모으게 되었고 그럼으로써 Cu metallization을 위한 많은 연구가 진행되어 왔다. Cu는 Al-base 합금계보다 비저항이 낮고, 녹는점이 높으며, 또한 electromigration 특성이 뛰어난 것으로 알려져 있다. 공학적인 면에서 이미 이들 계에 대한 adhesion 및 전기적 특성에 대한 많은 연구가 있어왔지만, 이들 특성 변화에 대한 물리적 의미를 제공할 만한 기초 자료들이 부족한 상태이다. 본 연구에서는 부도체인 polyimide 박막과 diffusion barrier인 TiN 박막위에서의 Cu 박막성장에 따르는 interface chemical reaction의 변화를 XPS를 이용하여 관찰함으로서 이들 계에 있어서의 adhesion과의 관계를 조사하였다. 그리고 XPS를 이용한 modified surface accumulation method를 적용시켜 TiN diffusion barrier를 통한 Cu의 grain boundary diffusion 상수들을 측정하였다. Cu/TiN system의 경우에는 interface chemical reaction이 일어나지 않았지만 Cu/polymide system에 있어서는 boundary diffusivity는 특히 40$0^{\circ}C$에서 $650^{\circ}C$ 영역에서, Db=60$\times$10-11exp[-0.29/(kBT)]cm2/sec 이었다.

• Korean Journal of Metals and Materials
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• v.46 no.1
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• pp.33-38
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• 2008

The interfacial reactions and shear strength of pure Sn solder bump were investigated with different under bump metallizations (UBMs) and reflow numbers. Two different UBMs were employed in this study: Cu and Ni. Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) were formed at the bump/Cu UBM interface, whereas only a Ni3Sn4 IMC was formed at the bump/Ni UBM interface. These IMCs grew with increasing reflow number. The growth of the Cu-Sn IMCs was faster than that of the Ni-Sn IMC. These interfacial reactions greatly affected the shear properties of the bumps.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.309-309
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• 2011

There have been large research activities on the high quality oxide films for the realization oxide based electronics. However, the interface interdiffusion prohibits achieving high quality oxide films, when the oxide films are grown on non-oxide substrates. In the case of Si substrates, there exist lattice mismatch and interface interdiffusion when oxide films deposited on direct Si surface. In this presentation, we report the interface characteristics of yttria-stabilized zirconia films grown on silicon substrates. From x-ray reflectivity analysis we found that the film thickness and interface roughness decreased as the growth temperature increased, indicating that the growth mechanism varies and the chemical reaction is limited to the interface as the growth condition varies. Furthermore, the packing density of the film increased as the growth temperature increased and the film thickness decreased. X-ray photoelectron spectroscopy analysis of very thin films revealed that the amount of chemical shift increased as the growth temperature increased. Intriguingly, the direction of the chemical shift of Zr was opposite to that of Si due to the second nearest neighbor interaction.

• Industrial Engineering and Management Systems
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• v.6 no.1
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• pp.40-48
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• 2007

This study investigated the optimum positions and warning foreperiod for auditory signals with an experiment on spatial stimulus-response (S-R) compatibility effects. The auditory signals were presented at the front-right, front-left, rear-right, and rear-left positions from the subjects, whose reaction times and accuracies at different spatial mapping conditions were examined. The results showed a significant spatial stimulus-response compatibility effect in which faster and more accurate responses were obtained in the transversely and longitudinally compatible condition while the worst performance was found when spatial stimulus-response compatibility did not exist in either orientation. It was also shown that the transverse compatibility effect was found significantly stronger than the longitudinal compatibility effect. The effect of signal position was found significant and post hoc test suggested that the emergent warning alarm should be placed on the front-right position for right-handed users. The warning foreperiod prior to the signal presentation was shown to influence reaction time and a warning foreperiod of 3 s is found optimal for the 2-choice auditory reaction task.

• Journal of the Korean Ceramic Society
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• v.33 no.12
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• pp.1421-1425
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• 1996

Sintered Si3N4 and Inconel composed of Ni(58-63%) Cr(21-25%) Al(1-17%) Mn(<1%) fe(balance) were pressurelessly joined by using Ag-Cu-Ti brazing filler metal at 950℃ and 1200℃ under N2 gas atmosphere of 1atm and their interfacial structures were investigated. In case that the reaction temperature was low as 950℃ its interfacial structure was "Inconel metal/Ti-rich phase layer/brazing filler metal layer/Si3N4 " Ti used as reactive metal existed in between inconel steel and brazing metal and moved to the interface of between brazing filler metal nd Si3N4 according as reaction temperature increased up to 1200℃. The interfacial structure of inconel steel-Si3N4 reacted at 1200℃ was ' inconel metal/Ni-rich phase layer containing of Fe. Cr and Si/Cu-rich phase layer containing of Mn and Si/Si3N4 " Cr Mn, Ni and Fe diffused to the interface of between brazing filler metal and Si3N4 and reacted with Si3N4 The most reactive components of ingredients of inconel metal were Cr and Mn. On the other hand Ti added as reactive components to Ag-Cu eutectic segregated into Ni-rich phase layer,.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.517-524
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• 2002

An overlaying of the seating surfaces of engine valves by OAW, GTAW or PTA weldings are common practice. The OAW method of a lower torch energy density compared to GTAW and PTA methods produces smoother deposits but the pain size at the vicinity of the interface is increased remarkably up to $30~50{\mu\textrm{m}}$ (that of base metal is about $10\mu\textrm{m}$). It's grain coarsening and the solute dilution are related to the decarburizing during OAW could be minimized by reducing the preheating temperature and by maintaining the carbide precipitates in base metal prior to welding. The formation of columnar structures and carbide precipitation zone in the vicinity of the GTAW welded interface, because of the high heat concentration, causes weakened zone on the valve seat face. The width of the reaction boundary zone is about $50\mu\textrm{m}$ for PTA and GTAW overlaying, and about $150\mu\textrm{m}$ for OAW welding. The smaller width of the reaction boundary zone is the less the solute-dilution rate. Thereby PTA welding may be recommended for overlaying of the seating surfaces.

• Journal of Adhesion and Interface
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• v.4 no.3
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• pp.14-20
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• 2003

In order to study the radiation curing behavior of poly(ethylene glycol 400) dimethacrylate and ethylene glycol dimethacrylate, we investigated the influence of temperature and photoinitiator concentration by photo-DSC. As the number of ethylene glycol unit, the concentration of photoinitiator, and the reaction temperature increased, the reaction speed of PEG400DMA and EGDMA increased. Although the reaction speed of PEG400DMA was lower than EGDMA, the overall conversion of PEG400DMA was high.