• 제목/요약/키워드: Interconnection Cost

검색결과 189건 처리시간 0.028초

최적화 기법을 적용한 효율적인 철도 연결선 구축 전략 (The Strategy for Interconnection Branch Line Construction used Optimization Program)

  • 김용석;김시곤
    • 대한토목학회논문집
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    • 제39권6호
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    • pp.853-858
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    • 2019
  • 철도 네트워크를 효율적으로 사용하는 방법 중 하나는 연결선 건설을 통해 여러 노선이 하나의 선로를 공유하는 방법인데, 국내에서도 이미 사용하고 있거나 사업화 추진 중인 노선이 존재한다. 본 연구는 철도 연결선 건설시 사업화 단계가 아닌 계획 단계에서 연결선 건설의 위치 선정, 우선순위 산정 등에 필요한 연결선 설계 모형을 구축하고 이에 대한 해법을 제시하였다. 모형은 연결선건설비용, 노선운영비용, 이용자 총통행비용을 최소화하기 위한 비선형 최적화문제로 구축하였고, 결정변수로는 연결선 건설여부 및 방향, 노선의 열차 운행 빈도로 설정하였다. 본 연구에서는 문제 풀이 알고리즘과 경로선택 알고리즘을 각각 제시하였고, 예제네트워크에 적용을 통하여 모형의 실용성을 검증하였다. 향후 현실을 반영한 실제네트워크와 파라미터를 설정하여 연구의 결과를 발전시킬 여지가 있다.

동북아 에너지협력을 위한 전력계통 연구 : 러시아와의 전력계통 연계를 중심으로 (A Study on the Power Interconnection in the Northeast Asian Region)

  • 김현제;노동석;조성한
    • 자원ㆍ환경경제연구
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    • 제17권3호
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    • pp.167-199
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    • 2008
  • 세계 각지에서 전력망 연계를 통한 전력부문의 협력과 전력시장의 통합이 추진되어 가시적인 성과를 거두고 있다. 동북아 지역은 상당한 경제적 편익이 기대됨에도 불구하고 역내 국가들의 다양한 이해관계와 현실적 제약요인 등으로 인해 전력협력의 성과가 제대로 나타나지 않고 있다. 미국 에너지부 산하의 아르곤연구소(Argonne National Laboratory)에서 개발한 발전 및 송전을 모의하는 프로그램인 GTMax를 통하여 러시아로부터 값 싼 전력이 국내에 수입되는 경우를 분석하였다. 러시아로부터의 수전량이 2,000MW(2017년의 국내 설비용량은 약 90,000MW 이상으로 2,000MW는 2%에 해당)일 경우 절대량이 미미하여 국내 전력시장에 미치는 영향이 거의 없다. 전력망 연계에 의해 큰 폭의 비용 절감을 도모하기 위해서는 수전량이 전체의 10% 수준이 될 정도로 커질 필요가 있음을 보여주고 있다. 또한 경인지역으로 직접 연계되는 것이 비용절감을 크게 하며, 영동지역과 연계되는 경우 영동-경인 간 선로용량의 증설이 불가능하다면 수전전력은 중부지역의 발전량을 대체하게 되어 수전의 상대적 이득이 감소하는 것으로 나타났다.

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잘림구조 집중기에 기초한 O(logN) 깊이의 라우팅 구조 (O(logN) Depth Routing Structure Based on truncated Concentrators)

  • Lee, Jong-Keuk
    • 한국멀티미디어학회:학술대회논문집
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    • 한국멀티미디어학회 1998년도 춘계학술발표논문집
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    • pp.366-370
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    • 1998
  • One major limitation of the efficiency of parallel computer designs has been the prohibitively high cost of parallel communication between processors and memories. Linear order concentrators can be used to build theoretically optimal interconnection schemes. Current designs call for building superconcentrators from concentrators, then using these to recursively partition the connection streams O(log2N) times to achieve point-to-point routing. Since the superconcentrators each have O(N) hardware complexity but O(log2N) depth, the resulting networks are optimal in hardware, but they are of O(log2N) depth. This pepth is not better than the O(log2N) depth Bitonic sorting networks, which can be implemented on the O(N) shuffle-exchange network with message passing. This paper introduces a new method of constructing networks using linear order concentrators and expanders, which can be used to build interconnection networks with O(log2N) depth as well as O(Nlog2N) hardware cost. (All logarithms are in base 2 throughout paper)

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다중포트 메모리를 지원하는 데이터패스 자동 합성 시스템의 설계 (Design of an Automatic Synthesis System for Datapaths Based on Multiport Memories)

  • 이해동;김용노;황선영
    • 전자공학회논문지A
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    • 제31A권7호
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    • pp.117-124
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    • 1994
  • In this pape, we propose a graph-theoretic approach for solving the allocation problem for the synthesis of datapaths based on multiport memories. An efficient algorithm is devised by using the weighted bipartite matching algorithm to assign variables to each port of memory modules. The proposed algorithm assigns program variables into a minimum number of multiport memory modules such that usage of memory elements and interconnection cost can be kept minimal. Experimental results show that the proposed algorithm generates the datapaths with fewer registers in memory modules and less interconnection cost for several benchmarks available from the literatures.

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멀티컴퓨팅 시스템을 위한 피터슨-토러스(PT) 네트워크 (Petersen-Torus(PT) Network for Multicomputing System)

  • 서정현;이형옥;장문석
    • 한국정보과학회논문지:시스템및이론
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    • 제35권6호
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    • pp.263-272
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    • 2008
  • 본 논문은 피터슨 그래프를 기본으로 만든 새로운 상호연결망 피터슨-토러스(PT) 네트워크를 제안한다. PT 네트워크는 동일한 노드수를 갖는 honeycomb 토러스보다 짧은 지름을 갖고 망 비용이 개선된 연결망이다. 본 논문에서는 PT 네트워크의 최적 라우팅 알고리즘과 해밀톤 사이클 알고리즘을 제안하고, 지름, 망 비용 그리고 bisection width를 분석하였다.

Shared Memory Model over a Switchless PCIe NTB Interconnect Network

  • Lim, Seung-Ho;Cha, Kwangho
    • Journal of Information Processing Systems
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    • 제18권1호
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    • pp.159-172
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    • 2022
  • The role of the interconnect network, which connects computing nodes to each other, is important in high-performance computing (HPC) systems. In recent years, the peripheral component interconnect express (PCIe) has become a promising interface as an interconnection network for high-performance and cost-effective HPC systems having the features of non-transparent bridge (NTB) technologies. OpenSHMEM is a programming model for distributed shared memory that supports a partitioned global address space (PGAS). Currently, little work has been done to develop the OpenSHMEM library for PCIe-interconnected HPC systems. This paper introduces a prototype implementation of the OpenSHMEM library through a switchless interconnect network using PCIe NTB to provide a PGAS programming model. In particular, multi-interrupt, multi-thread-based data transfer over the OpenSHMEM shared memory model is applied at the implementation level to reduce the latency and increase the throughput of the switchless ring network system. The implemented OpenSHMEM programming model over the PCIe NTB switchless interconnection network provides a feasible, cost-effective HPC system with a PGAS programming model.

Cu pad 위에 무전해 도금된 플립칩 UBM과 비솔더 범프에 관한 연구

  • 나재웅;백경욱
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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    • pp.95-99
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    • 2001
  • Cu is considered as a promising alternative interconnection material to Al-based interconnection materials in Si-based integrated circuits due to its low resistivity and superior resistance to the electromigration. New humping and UBM material systems for solder flip chip interconnection of Cu pads were investigated using electroless-plated copper (E-Cu) and electroless-plated nickel (E-Ni) plating methods as low cost alternatives. Optimally designed E-Ni/E-Cu UBM bilayer material system can be used not only as UBMs for solder bumps but also as bump itself. Electroless-plated E-Ni/E-Cu bumps assembled using anisotropic conductive adhesives on an organic substrate is successfully demonstrated and characterized in this study

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남한-러시아 국가간 계통연계를 위한 예비 타당성 검토 (A feasibility study of interconnection between ROK and Russia)

  • 김종율;이승렬;윤재영
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2005년도 추계학술대회 논문집 전력기술부문
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    • pp.356-358
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    • 2005
  • This paper evaluates minimum and maximum power exchange considering economic and technical characteristics between Russia and ROK. First, we evaluate minimum power exchange to assure the economic feasibility by comparison with the total cost and benefit of the interconnected line. For evaluating maximum exchange power, system constraints are considered, which are examined through load flow and dynamic analysis by using the PSS/E program. As a result of these evaluations, we suggest the reasonable range of power exchange between ROK and Russia considering economic and technical constraints with the interconnection scenario that power system interconnection between ROK and Russia will be realized in the year 2010.

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The Criteria, Procedure, and Classification of Traffic-Sensitive and Non-Traffic-Sensitive Components: A Case of CDMA Mobile System

  • Kim, Moon-Soo
    • ETRI Journal
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    • 제28권6호
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    • pp.777-786
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    • 2006
  • Since the introduction of competition in the telecommunication market due to the growth of the interconnection between heterogeneous networks, particularly fixed and mobile networks, the interconnection charge based on traffic-sensitive (TS) and non-traffic-sensitive (NTS) costs has become more important. Although there have been many studies of the public switched telephone network (PSTN), previous studies of TS and NTS costs in mobile networks are very few. In this paper, as a pilot study, we propose three criteria and a procedure for the classification of TS and NTS costs based on mobile systems. The three criteria are the following: function type, investment requirement, and main exhaust driver. Moreover, for a CDMA mobile system, strongly TS, strongly NTS, and mixed components are classified by the proposed criteria and procedure. The proposed criteria, procedure, and classification can provide a systematic and useful guideline to decide the scope of mobile facilities and to determine the terminating cost on mobile networks from fixed networks.

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3D 웨이퍼 전자접합을 위한 관통 비아홀의 충전 기술 동향 (Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging)

  • 고영기;고용호;방정환;이창우
    • Journal of Welding and Joining
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    • 제32권3호
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    • pp.19-26
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    • 2014
  • Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.