• Title/Summary/Keyword: Interconnection Cost

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The Strategy for Interconnection Branch Line Construction used Optimization Program (최적화 기법을 적용한 효율적인 철도 연결선 구축 전략)

  • Kim, Yong-seok;Kim, Sigon
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.39 no.6
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    • pp.853-858
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    • 2019
  • One of the methods which can enhance the efficiency of railroad network is construction of interconnection branch line for several route to share one railway. In Korea, this method already has been implemented or excuted as project level. This study suggests a network design model and a solution algorithm to choice most proper site to construction it and determine the priority of branch lines which can be considered in planning level, not project level. The model is a non-linear optimization program which minimize total cost-construction cost, operating cost and passengers' travel cost. The decision variables are a binary variable to explain whether construction or not and its direction and a integer variable of the frequencies of travel routes. The solution algorithm-problem solution and route choice and also the result of implementation for example network are suggested. This result can be more advanced after application in real network and calibration of parameters.

A Study on the Power Interconnection in the Northeast Asian Region (동북아 에너지협력을 위한 전력계통 연구 : 러시아와의 전력계통 연계를 중심으로)

  • Kim, Hyun Jae;Roh, Dong Seok;Jo, Sung Han
    • Environmental and Resource Economics Review
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    • v.17 no.3
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    • pp.167-199
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    • 2008
  • There are many successful cases in power interconnection among European and South American countries. However, that is not the case in Northeast Asian countries. Even though there will be a considerable benefit in power interconnection in Northeast Asian countries, there will be some difficulties due to various interest relationship and constraints among countries in Northeast Asia. GTMax(Generation and Transmission Maximization) Program is a very useful tool to analyze competitive electricity market and power interconnection developed by Argonne National Laboratory under the Department of Energy in the USA. This study tried to verify applicability and usefulness by GTMax model to domestic electric power system and power transfer from Russia Far East by power interconnection. When the power by importing from Russia is 2,000MW(around 2% of domestic installed capacity in 2017), there is no impact on domestic electricity market because of small power transfer. The power by importing should be large enough for achieving greater cost reduction by power interconnection. Besides, it would be better to supply power to Kyung-In region directly in reducing overall cost when the power by importing from Russia are sold at low price. In the case of interconnecting Young-Dong region, if it is not possible to upgrade transmission line with power transfer capabilities between Young-Dong and Kyung-In region, then the power by importing from Russia can replace the power produced in Jung-Bu region and the relative benefit of importing power can be reduced.

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O(logN) Depth Routing Structure Based on truncated Concentrators (잘림구조 집중기에 기초한 O(logN) 깊이의 라우팅 구조)

  • Lee, Jong-Keuk
    • Proceedings of the Korea Multimedia Society Conference
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    • 1998.04a
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    • pp.366-370
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    • 1998
  • One major limitation of the efficiency of parallel computer designs has been the prohibitively high cost of parallel communication between processors and memories. Linear order concentrators can be used to build theoretically optimal interconnection schemes. Current designs call for building superconcentrators from concentrators, then using these to recursively partition the connection streams O(log2N) times to achieve point-to-point routing. Since the superconcentrators each have O(N) hardware complexity but O(log2N) depth, the resulting networks are optimal in hardware, but they are of O(log2N) depth. This pepth is not better than the O(log2N) depth Bitonic sorting networks, which can be implemented on the O(N) shuffle-exchange network with message passing. This paper introduces a new method of constructing networks using linear order concentrators and expanders, which can be used to build interconnection networks with O(log2N) depth as well as O(Nlog2N) hardware cost. (All logarithms are in base 2 throughout paper)

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Design of an Automatic Synthesis System for Datapaths Based on Multiport Memories (다중포트 메모리를 지원하는 데이터패스 자동 합성 시스템의 설계)

  • 이해동;김용노;황선영
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.7
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    • pp.117-124
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    • 1994
  • In this pape, we propose a graph-theoretic approach for solving the allocation problem for the synthesis of datapaths based on multiport memories. An efficient algorithm is devised by using the weighted bipartite matching algorithm to assign variables to each port of memory modules. The proposed algorithm assigns program variables into a minimum number of multiport memory modules such that usage of memory elements and interconnection cost can be kept minimal. Experimental results show that the proposed algorithm generates the datapaths with fewer registers in memory modules and less interconnection cost for several benchmarks available from the literatures.

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Petersen-Torus(PT) Network for Multicomputing System (멀티컴퓨팅 시스템을 위한 피터슨-토러스(PT) 네트워크)

  • Seo, Jung-Hyun;Lee, Hyeong-Ok;Jang, Moon-Suk
    • Journal of KIISE:Computer Systems and Theory
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    • v.35 no.6
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    • pp.263-272
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    • 2008
  • We propose and analyze a new interconnection network, called petersen-torus(PT) network based on well-known petersen graph. PT network has a smaller diameter and a smaller network cost than honeycomb torus with same number of nodes. In this paper, we propose optimal routing algorithm and hamiltonian cycle algorithm. We derive diameter, network cost and bisection width.

Shared Memory Model over a Switchless PCIe NTB Interconnect Network

  • Lim, Seung-Ho;Cha, Kwangho
    • Journal of Information Processing Systems
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    • v.18 no.1
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    • pp.159-172
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    • 2022
  • The role of the interconnect network, which connects computing nodes to each other, is important in high-performance computing (HPC) systems. In recent years, the peripheral component interconnect express (PCIe) has become a promising interface as an interconnection network for high-performance and cost-effective HPC systems having the features of non-transparent bridge (NTB) technologies. OpenSHMEM is a programming model for distributed shared memory that supports a partitioned global address space (PGAS). Currently, little work has been done to develop the OpenSHMEM library for PCIe-interconnected HPC systems. This paper introduces a prototype implementation of the OpenSHMEM library through a switchless interconnect network using PCIe NTB to provide a PGAS programming model. In particular, multi-interrupt, multi-thread-based data transfer over the OpenSHMEM shared memory model is applied at the implementation level to reduce the latency and increase the throughput of the switchless ring network system. The implemented OpenSHMEM programming model over the PCIe NTB switchless interconnection network provides a feasible, cost-effective HPC system with a PGAS programming model.

Cu pad 위에 무전해 도금된 플립칩 UBM과 비솔더 범프에 관한 연구

  • 나재웅;백경욱
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.07a
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    • pp.95-99
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    • 2001
  • Cu is considered as a promising alternative interconnection material to Al-based interconnection materials in Si-based integrated circuits due to its low resistivity and superior resistance to the electromigration. New humping and UBM material systems for solder flip chip interconnection of Cu pads were investigated using electroless-plated copper (E-Cu) and electroless-plated nickel (E-Ni) plating methods as low cost alternatives. Optimally designed E-Ni/E-Cu UBM bilayer material system can be used not only as UBMs for solder bumps but also as bump itself. Electroless-plated E-Ni/E-Cu bumps assembled using anisotropic conductive adhesives on an organic substrate is successfully demonstrated and characterized in this study

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A feasibility study of interconnection between ROK and Russia (남한-러시아 국가간 계통연계를 위한 예비 타당성 검토)

  • Kim, Jong-Yul;Lee, Seong-Ryul;Yoon, Jae-Young
    • Proceedings of the KIEE Conference
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    • 2005.11b
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    • pp.356-358
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    • 2005
  • This paper evaluates minimum and maximum power exchange considering economic and technical characteristics between Russia and ROK. First, we evaluate minimum power exchange to assure the economic feasibility by comparison with the total cost and benefit of the interconnected line. For evaluating maximum exchange power, system constraints are considered, which are examined through load flow and dynamic analysis by using the PSS/E program. As a result of these evaluations, we suggest the reasonable range of power exchange between ROK and Russia considering economic and technical constraints with the interconnection scenario that power system interconnection between ROK and Russia will be realized in the year 2010.

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The Criteria, Procedure, and Classification of Traffic-Sensitive and Non-Traffic-Sensitive Components: A Case of CDMA Mobile System

  • Kim, Moon-Soo
    • ETRI Journal
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    • v.28 no.6
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    • pp.777-786
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    • 2006
  • Since the introduction of competition in the telecommunication market due to the growth of the interconnection between heterogeneous networks, particularly fixed and mobile networks, the interconnection charge based on traffic-sensitive (TS) and non-traffic-sensitive (NTS) costs has become more important. Although there have been many studies of the public switched telephone network (PSTN), previous studies of TS and NTS costs in mobile networks are very few. In this paper, as a pilot study, we propose three criteria and a procedure for the classification of TS and NTS costs based on mobile systems. The three criteria are the following: function type, investment requirement, and main exhaust driver. Moreover, for a CDMA mobile system, strongly TS, strongly NTS, and mixed components are classified by the proposed criteria and procedure. The proposed criteria, procedure, and classification can provide a systematic and useful guideline to decide the scope of mobile facilities and to determine the terminating cost on mobile networks from fixed networks.

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Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging (3D 웨이퍼 전자접합을 위한 관통 비아홀의 충전 기술 동향)

  • Ko, Young-Ki;Ko, Yong-Ho;Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.32 no.3
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    • pp.19-26
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    • 2014
  • Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.