• 제목/요약/키워드: Interconnecting layer

검색결과 14건 처리시간 0.034초

B-ISDN을 경유한 LAN간 접속 IWU 기능에 관한 연구 (A study on IWU functions interconnecting LANs via B-ISDN)

  • 이종영;조용구;오영환
    • 한국통신학회논문지
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    • 제21권7호
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    • pp.1746-1755
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    • 1996
  • In this paper, we propose the protocol stact and the server functions of IWU which interconnects distributed LAN's users by using of B-ISDN. The protocol stact of interconnecting IWU under consideration users TCP/IP in upper layer. TCP/IP is popular communication protocol in interconnecting distributed LANs. The interconnecting IWU has server functions for transfering datagrams to B-ISDN such as address translation, fragment and reassembly, CL server, signalling and traffic control. We analyze the performance ofinterconnecting IWU with M/M/1/K queueing model and obtain the throughput and buffer size of interconnecting IWU.

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WAVE와 CAN 연동을 위한 OSEK OS기반 게이트웨이 (OSEK OS Based Gateway for Interconnecting WAVE and CAN)

  • 김주영;서현수;이상선
    • 한국통신학회논문지
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    • 제39B권2호
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    • pp.133-141
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    • 2014
  • 최근 차량간 통신 프로토콜 표준인 WAVE를 이용한 다양한 서비스가 이루어지고 있으며, 안정적인 시스템 운영을 위해서 기존의 차량 내부 네트워크와의 원활한 연계를 위한 게이트웨이가 필요하다. 따라서, 본 논문에서는 차량 외부 통신의 대표적인 프로토콜인 WAVE와 차량 내부 네트워크의 대표적인 프로토콜인 CAN을 연동하기 위한 게이트웨이를 제안한다. 제안하는 게이트웨이는 OSEK 운영체제 기반으로 설계되었으며, 통신 계층, 메시지 변환 계층, 메시지 관리 계층으로 구성된다. 통신 계층은 CAN을 통해 차량 정보를 수신하거나, WAVE 모듈로부터 주행안전정보 요청 메시지를 수신, 주행안전정보를 송신한다. 그리고 메시지 관리 계층에서는 수신 메시지 저장, 메시지의 유효성에 대한 오류검사 기능을 수행한다. 게이트웨이에 대한 성능분석을 위해 두 가지의 테스트 시나리오를 구성하였다. 첫 번째는 차량간 통신을 이용한 안전서비스에서의 메시지 구조를 정의한 BSM의 주기적인 전송이 이루어질 경우에서의 성능 테스트이다. 두 번째는 노변장치가 주행안전정보를 요청하는 경우에 게이트웨이가 차량내부정보를 응답하는 경우이다. 테스트 결과로써, 게이트웨이 자체 처리시간은 각각 0.32ms, 0.46ms으로 안정적으로 동작함을 확인하였다.

Towards Thermally Stable Tandem Organic Solar Cells

  • Yang, Feng;Wang, Sihan;Kim, Ji-Hwan;Kim, Yong-Sang
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.410.2-410.2
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    • 2016
  • Tandem structure is promising in organic solar cells because of its double open-circuit voltage (VOC) and efficient photon energy conversion. In a typical tandem device, the two single sub-cells are stacked and connected by an interconnecting layer. The fabrication of two sub-cells are usually carried out in a glovebox filled with nitrogen or argon gas, which makes it expensive and laborious. We report a glovebox-free fabricated inverted tandem organic solar cells wherein the tandem structure comprises sandwiched interconnecting layer based on p-doped hole-transporting, metal, and electron-transporting materials. Complete fabrication process of the tandem device was performed outside the glove box. The tandem solar cells based on poly(3-hexylthiophene) (P3HT) and (6,6)-phenyl C61-butyric acid methyl ester (PCBM) can realize a high VOC, which sums up of the two sub-cells. The tandem device structure was ITO/ZnO/P3HT:PCBM/PEDOT:PSS/MoO3/Au/Al/ZnO-d/P3HT:PCBM/PEDOT:PSS/Ag. The separate sub-cells were morphologically and thermally stable up to 160 oC. The high stability of the active layer benefits in the fabrication processes of tandem device. The performance of tandem organic solar cells comes from the sub-cells with an 50 nm thick active layer of P3HT:PCBM, achieving an average power conversion efficiency (PCE) of 2.9% (n=12) with short-circuit current density (JSC) = 4.26 mA/cm2, VOC = 1.10 V, and fill factor (FF) = 0.62. Based on these findings, we propose a new method to improve the performance and stability of tandem organic solar cells.

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Hybrid-type stretchable interconnects with double-layered liquid metal-on-polyimide serpentine structure

  • Yim, Doo Ri;Park, Chan Woo
    • ETRI Journal
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    • 제44권1호
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    • pp.147-154
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    • 2022
  • We demonstrate a new double-layer structure for stretchable interconnects, where the top surface of a serpentine polyimide support is coated with a thin eutectic gallium-indium liquid metal layer. Because the liquid metal layer is constantly fixed on the solid serpentine body in this liquid-on-solid structure, the overall stretching is accomplished by widening the solid frame itself, with little variation in the total length and cross-sectional area of the current path. Therefore, we can achieve both invariant resistance and infinite fatigue life by combining the stretchable configuration of the underlying body with the freely deformable nature of the top liquid conductor. Further, we fabricated various types of double-layer interconnects as narrow as 10 ㎛ using the roll-painting and lift-off patterning technique based on conventional photolithography and quantitatively validated their beneficial properties. The new interconnecting structure is expected to be widely used in applications requiring high-performance and high-density stretchable circuits owing to its superior reliability and capability to be monolithically integrated with thin-film devices.

스퍼터링 코팅층을 중간재로 사용한 동(Cu)의 저온 접합(제1보) (Low Temperature Bonding of Copper with Interlayers Coated by Sputtering(Part 1))

  • 김대훈
    • 연구논문집
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    • 통권24호
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    • pp.63-79
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    • 1994
  • This article reports a experimental study of the method to achieve a bond joint at lower temperature in a short time. DC magnetron sputtering of Sn, Sn/Pb, Sn/In and Sn/Cu on copper substrate was provided as an interlayer for Cu to Cu bonding under the air environment. Various examination was conducted and investigated on the effect of experimental parameters such as coating materials, coating time(or coating thickness), bonding temperature and bonding time etc. Bonding was performed at the temperature of $210^\circC-320^\circC$ for 0sec and interfacial reaction between the coated layer and copper substrate was examined using optical, scanning electron microscope and x-ray diffractometer. From the obtained results, it was found that intermetallic compounds layer consisted of $\eta-phase(Cu_6Sn_5)$ and $\beta-phase(Cu_3Sn)$ was formed at the joint interface for almost all coating materials. But the dominant phase formed in the preetched Cu substrate coated with Sn was $\beta-phase$. A characteristic morphology looks like a reaction ring, which was believed as the strong interconnecting regions between two substrates, was found to be formed on the reaction surface of copper substrates. The morphologies and compositions of the intermetallics, which depends on the regions of the reaction surface, was appeared as greatly different. Based on above results, the new bonding process to make the joint at lower temperature for short time can be admitted as a feasible process.

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Cross Talk among Pyroelectric Sensitive Elements in Thermal Imaging Device

  • Bang Jung Ho;Yoon Yung Sup
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2004년도 학술대회지
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    • pp.780-783
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    • 2004
  • The two-dimensional modeling of the non-stationary thermal state and voltage responsivity of the sensitive elements usually used in solid-state pyroelectric focal plane arrays are presented. Temperature distributions under periodical thermal excitation and the response of the thermal imaging device, which is composed of the pyroelectric sensitive elements mounted on a single silicon substrate, are numerically calculated. The sensitive element consists of a covering metal layer, infrared polymer absorber, front metal contact, sensitive pyroelectric element, the interconnecting column and the bulk silicon readout. The results of the numerical modeling show that the thermal crosstalk between sensitive elements to be critical especially at low frequency (f < 10Hz) of periodically modulated light. It is also shown that the use of our models gives the possibility to improve the design, operating regimes and sensitivity of the device.

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Tandem white organic light emitting diodes comprising of red, green, blue emission

  • Yang, Jung-Jin;Suman, C.K.;Lee, Chang-Hee
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.820-822
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    • 2009
  • Tandem white organic light emitting diodes (WOLEDs) are fabricated by using a transparent interconnecting layer of Al:LiF composite/molybdenum oxides ($MoO_3$). We demonstrate two types of tandem WOLEDs consisting of two color emissions (red and blue emission) and three color emissions (red, green and blue emission). Tandem WOLED consisting of three color emission shows higher external quantum efficiency and current efficiency.

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집진용 세라믹 필터의 제조 및 공기 투과 특성 (Preparation of Ceramic Foam Filter and Air Permeability)

  • 박재구
    • 한국대기환경학회지
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    • 제16권4호
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    • pp.381-388
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    • 2000
  • Ceramic foam prepared with cordierite as a starting material by foam method was tested to evaluate the feasibility as a filter for the dust collection in hot gas. Two different types of agents Benzethonium chloride (BZTC, C27H42NO2Cl) and Sodium Lauryl Sulfate(SLS, CH3(CH2)11OSO3Na) were used as foaming agents in foaming process. Porosityof ceramic foam was about 80% and mean pore size were 100${\mu}{\textrm}{m}$ for SLS agent and 200 ${\mu}{\textrm}{m}$ for BZTC. It was observed that ceramic foam was composed of continuous macro-pore structure with opening windows interconnecting macro-pores. The surface of ceramic foam support of was coated with cordierite particles ranged from 20${\mu}{\textrm}{m}$ to 50${\mu}{\textrm}{m}$ Meso-pore size in the coating layer on ceramic foam was below 10${\mu}{\textrm}{m}$. While air permeability of the support increased with increasing macro-pore size coated ceramic filters showed a constant permeability without regard to the macro-pore size of the support. The permeabuilities of support varied in the range of 600$\times$10-13m2 to 1000$\times$10-13m2. For the case of coated ceramic filter it was about 200$\times$10-13m2. As a result of particle trapping test by using fly ash the particle removal efficiency was over the 99.9%.

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스크린인쇄 법을 이용한 Build-up다층인쇄회로기판의 쾌속제조공정 기술개발 (Development of Build up Multilayer Board Rapid Manufacturing Process Using Screen Printing Technology)

  • 조병희;정해도;정해원
    • 마이크로전자및패키징학회지
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    • 제6권4호
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    • pp.15-22
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    • 1999
  • 일반적으로 빌드업 다층 인쇄회로기판은 에칭, 도금등의 습식공정에 의해 제작이 이루어지므로 많은 장비와 많은 시간이 필요하게 된다. 이러한 습식공정은 양산에는 적합하지만 개발단계에서는 그리 적합하지 않은 방법이다. 본 연구에서는 스크린 인쇄기술을 도입하여 빌드업 다층 인쇄회로기판을 제작하여 보았다. 절연성 재료로는 광경화성수지 또는 열경화성수지를 사용하였으며 전도성 재료로는 전도성 페이스트를 사용하였다. 층간의 전기적 연결을 담당하는 비아와 회로를 형성하기 위해 스크린 인쇄공정을 통해 전도성 페이스트를 인쇄 하였다. 이러한 방법을 통해 제품의 개발 단계에서 기존의 빌드업 다층 인쇄회로기판 제작 공정과 비교하여 좀더 효율적인 방법을 제시하였다.

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ZigBee 기반 센서 네트워크로의 유비쿼터스 접근을 위한 게이트웨이 아키텍처 (Gateway Architecture for Ubiquitous Access to ZigBee-Based Sensor Networks)

  • 허웅;펑치유;유강수;최재호
    • 한국콘텐츠학회논문지
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    • 제10권8호
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    • pp.73-83
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    • 2010
  • 본 논문에서는 ZigBee/IEEE 802.15.4 기반 무선 센서 네트워크와 TCP/IP 기반 네트워크를 서로 연결할 수 있는 웹-센서 게이트웨이의 아키택처를 제안한다. 제안한 게이트웨이의 주요 역할은 인터넷을 통하여 센서 노드에게 질의 또는 명령을 내리고 센서 데이터를 취득하도록 도와주는 기능이다. 다만, 인터넷과 센서 네트워크의 통신 프로토콜은 서로 불통함으로 양방향 프로토콜 변환이 필요하다. 본 논문에서는 이 변환 기능을 두 통신 프로토콜 APP 계층 위에 위치하도록 설계하여 인터넷 어프리케이션과 ZigBee 어프리케이션이 양 방향으로 변환 될 수 있도록 하였다. CGI 프로그램을 사용하여 변환 계층을 구현하였으며 인터넷의 사용자가 언제 어디서나 웹 페이지를 열어서 검색 요청이나 명령 등을 센서 노드에 전달할 수 할 수 있는 방식을 채택하였다. 이종 네트워크 연결을 위하여 TCP/IP 프로토콜을 센서 노드에 오버레잉 하는 기법도 가능하나 구현의 복잡성, 에너지 효율, 통신 오버헤드 측면에서 제한적이다. 부족한 자원을 가진 센서 노드 환경에서는 본 논문에서 제안한 변환 기반 웹-센서 게이트웨이 방식이 이종 통신 프로토콜 연결 문제를 해결하는 비교적 효과적이며 우수한 방법임을 확인하였다.