• 제목/요약/키워드: Inter CU

검색결과 87건 처리시간 0.03초

Mechanism of Metal Ion Binding to Chitosan in Solution. Cooperative Inter- and Intramolecular Chelations

  • Joon Woo Park;Myung Ok Park;Kwanghee Koh Park
    • Bulletin of the Korean Chemical Society
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    • 제5권3호
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    • pp.108-112
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    • 1984
  • Interactions between metal ions and chitosan in solution were studied by spectroscopic and viscometric measurements. $Cu^{++}$-chitosan complex exhibited an absorption band at 265 nm, whereas D-glucosamine complex showed one at 245 nm. The difference in ${\lambda}_{max}$ was attributed to the different amine to $Cu^{2+}$ ratios of the complexes, that is, 2 : 1 for chitosan and 1 : 1 for D-glucosamine. The molar absorptivities and binding constants of the complexes were evaluatatled. The binding of $Cu^{2+}$ to chitosan was cooperative near pH 5, and both intra- and intermolecular chelations depending on chitosan and $Cu^{2+}$concentrations were observed, The intermolecular chelation was stabilized by addition of salts. The cooperative intermolecular chelation of $Ni^{++}$ was also observed at pH 6.2. No significant binding of other divalent ions was observed. The reported high adsorption abilities of chitosan particles for these ions were attributed to the deposition of metal hydroxide aggregates in pores of chitosan particles rather than chelation to amine groups.

고려시대의 청동 주물에서 관찰되는 불순물(Cu2S) 특성 연구 (A Study of the Microstructure and Impurity Characteristics of Cast Bronze in Koryo Period)

  • 최정은
    • 보존과학회지
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    • 제32권3호
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    • pp.313-320
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    • 2016
  • 청동으로 주조된 공예품의 금속 조직학적 연구를 통해 그 내부에 관찰되는 불순물을 추측하고, 그 물질의 특성을 파악하여 향후 제련 및 과거 청동 주물 제조 방법 및 재료 연구의 기초데이터를 제공하는 것을 목적으로 한다. 분석에는 SEM-EDS, XRD, 광학현미경을 이용하였다. 분석 결과, 3점의 시료는 ${\alpha}$상, ${\delta}$상, Pb, 불순물 입자인 $Cu_2S$의 4개의 상으로 이루어져 있으며, $Cu_2S$입자는 황동광을 제련하였을 때 생기는 제련 중간 발생물로 추측된다. 이 입자는 Pb와 인접하여 주로 관찰되며, ${\delta}$상 내부에서 관찰되는 경우도 있었다. $Cu_2S$의 입자 특성을 파악하기 위하여 1) 고려경 파편 및 2) $Cu_2S$와 Pb을 1273 K에서 녹여 $10^{\circ}C/min$의 속도로 냉각시켰다. 두 가지 실험으로 공통적으로 검은색 연기가 발생하였으며, 이 연기를 분석한 결과 PbS이었다. $Cu_2S$와 Pb을 반응 시킨 실험에서는 $Cu_2S+Pb{\rightarrow}PbS{\uparrow}+2Cu$의 반응식을 얻었다.

관교의치용 Au-Ag-Cu-Pt-Zn 합금의 시효경화성과 관련된 상변태와 입계석출 (Phase transformation and grain boundary precipitation related to the age-hardening of an Au-Ag-Cu-Pt-Zn alloy for crown and bridge fabrication)

  • 조미향
    • 대한치과기공학회지
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    • 제34권4호
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    • pp.345-352
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    • 2012
  • Purpose: The age-hardening mechanism of an Au-Ag-Cu-Pt-Zn alloy for crown and bridge fabrication was investigated by means of hardness test, X-ray diffraction study and field emission scanning electron microscopic observation. Methods: Before hardness testing, the specimens were solution treated and then were rapidly quenched into ice brine, and were subsequently aged isothermally at $400-450^{\circ}C$ for various periods of time in a molten salt bath and then quenched into ice brain. Hardness measurements were made using a Vickers microhardness tester. The specimens were examined at 15 kV using a field emission scanning electron microscope. Results: By the isothermal aging of the solution-treated specimen at $450^{\circ}C$, the hardness increased rapidly in the early stage of aging process and reached a maximum hardness value. After that, the hardness decreased slowly with prolonged aging. However, the relatively high hardness value was obtained even with 20,000 min aging. By aging the solution-treated specimen, the f.c.c. Au-Ag-rich ${\alpha}_0$ phase was transformed into the Au-Ag-rich ${\alpha}_1$ phase and the AuCu I ordered phase. Conclusion: The hardness increase in the early stage of aging process was attributed to the formation of lattice strains by the precipitation of the Cu-rich phase and then subsequent ordering into the AuCu I-type phase. The decrease in hardness in the later stage of aging process was due to the release of coherency strains by the coarsening of tweed structure in the grain interior and by the growth and coarsening of the lamellar structure in the grain boundary. The increase of inter-lamellar space contributed slightly to the softening compared to the growth of lamellar structure toward the grain interior.

Formation of a MnSixOy barrier with Cu-Mn alloy film deposited using PEALD

  • Moon, Dae-Yong;Hwang, Chang-Mook;Park, Jong-Wan
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.229-229
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    • 2010
  • With the scaling down of ultra large integrated circuits (ULSI) to the sub-50 nm technology node, the need for an ultra-thin, continuous and conformal diffusion barrier and Cu seed layer is increasing. However, diffusion barrier and Cu seed layer formation with a physical vapor deposition (PVD) method has become difficult as the technology node is reduced to 30 nm and beyond. Recent work on self-forming barrier processes using PVD Cu alloys have attracted great attention due to the capability of conformal ultra-thin barrier formation using a simple technique. However, as in the case of the conventional barrier and Cu seed layer, PVD of the Cu alloy seed layer will eventually encounter the difficulty in conformal deposition in narrow line trenches and via holes. Atomic layer deposition (ALD) has been known for its good step coverage and precise thickness control, and is a candidate technique for the formation of a thin conformal barrier layer and Cu seed layer. Conformal Cu-Mn seed layers were deposited by plasma enhanced atomic layer deposition (PEALD) at low temperature ($120^{\circ}C$), and the Mn content in the Cu-Mn alloys were controlled form 0 to approximately 10 atomic percent with various Mn precursor feeding times. Resistivity of the Cu-Mn alloy films decreased by annealing due to out-diffusion of Mn atoms. Out-diffused Mn atoms were segregated to the surface of the film and interface between a Cu-Mn alloy and $SiO_2$, resulting in self-formed $MnO_x$ and $MnSi_xO_y$, respectively. No inter-diffusion was observed between Cu and $SiO_2$ after annealing at $500^{\circ}C$ for 12 h, indicating an excellent diffusion barrier property of the $MnSi_xO_y$. The adhesion between Cu and $SiO_2$ was enhanced by the formation of $MnSi_xO_y$. Continuous and conductive Cu-Mn seed layers were deposited with PEALD into 32 nm $SiO_2$ trench, enabling a low temperature process, and the trench was perfectly filled using electrochemical plating (ECD) under conventional conditions. Thus, it is the resultant self-forming barrier process with PEALD Cu-Mn alloy film as a seed layer for plating Cu that has further potential to meet the requirement of the smaller than 30 nm node.

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상위깊이의 Sub-CU 부호화 정보를 이용한 HEVC의 고속 PU 결정 기법 (Fast PU Decision Method Using Coding Information of Co-Located Sub-CU in Upper Depth for HEVC)

  • 장재규;최호열;김재곤
    • 방송공학회논문지
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    • 제20권2호
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    • pp.340-347
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    • 2015
  • HEVC(High Efficiency Video Coding)는 재귀적 쿼드트리 분할구조의 부호화단위(CU: Coding Unit)와 각 CU에서 다양한 예측단위(PU: Prediction Unit)를 제공하고, 율-왜곡 기반으로 최적의 CU 분할구조와 PU 모드를 결정함으로써 높은 부호화 효율을 얻을 수 있는 반면 복잡도 또한 크게 증가하는 문제가 있다. 본 논문에서는 부호화기의 복잡도를 감소시키기 위해 상위깊이의 부호화 정보를 이용한 다음 세 가지의 PU 모드 고속 결정 기법을 제안한다. 첫 번째 방법은 상위깊이 CU의 sub-CBF(Coded Block Flag)를 이용하여 현재깊이 CU에서의 PU 모드를 조기 결정하여 PU 탐색을 고속화 한다. 두 번째 방법은 화면내(Intra) 예측 고속화를 위하여 상위 CU의 sub-Intra 율-왜곡 비용을 이용하여 현재깊이에서의 화면내 예측을 생략한다. 마지막 방법으로는 화면내 예측 고속화를 위하여 현재 CU의 sub-CBF를 함께 사용하여 하위깊이에서의 화면내 예측을 생략한다. 실험결과 제안 방법은 HM 14.0 대비 각각 1.2%, 0.11%, 0.9%의 BD-rate 증가에 31.4%, 2.5%, 23.4%의 부호화 시간 감소 효과를 얻을 수 있었다. 제안된 3가지 방법은 화면간 및 화면내 예측에 적용되는 것으로 결합하여 적용될 수 있으며, 이 경우 1.9%의 BD-rate 증가에 34.2%의 부호화 시간 감소를 얻었다.

Hardware Implementation of HEVC CABAC Binarizer

  • Pham, Duyen Hai;Moon, Jeonhak;Lee, Seongsoo
    • 전기전자학회논문지
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    • 제18권3호
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    • pp.356-361
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    • 2014
  • This paper proposes hardware architecture of HEVC (high efficiency video coding) CABAC (context-based adaptive binary arithmetic coding) binarizer. The proposed binarizer was designed and implemented as an independent module that can be integrated into HEVC CABAC encoder. It generates each bin string of each syntax element in a single cycle. It consists of controller module, TU (truncated unary binarization) module, TR (truncated Rice binarization) module, FL (fixed length binarization) module, EGK (k-th order exp-Golomb coding) module, CALR (coeff_abs_level_remaining) module, QP Delta (cu_qp_delta_abs) module, Intra Pred (intra_chroma_pred_mode) module, Inter Pred (inter_pred_idc) module, and Part Mode (part_mode) module. The proposed binarizer was designed in Verilog HDL, and it was implemented in 45 nm technology. Its operating speed, gate count, and power consumption are 200 MHz, 1,678 gates, and 50 uW, respectively.

A New Method of HTS Material Synthesis by Combination of MCA and SHS

  • Korobova, N.;Soh, Dea-Wha
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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    • pp.1270-1273
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    • 2004
  • The combination of methane-chemical activation and Self-propagating High-temperature synthesis (SHS) has widened the possibilities for both methods. For YBCO systems the investigation showed that a short-term mechano-chemical activation of initial powders before SHS leads to single-phase and ultra-fine products. A new technique for preparation ultra-fine high-temperature superconductors of YBCO composition with a grain size d < $1{\mu}m$ is developed. The specific feature of the technique is formation of the $YBa_2Cu_3O_{7-x}$ crystalline lattice directly from an X-ray amorphous state arising as a result of mechanical activation of the original oxide mixture. The technique allows the stage of formation of any intermediate reaction products to be ruled out. X-ray and magnetic studies of ultra-fine high temperature superconductors (HTS) are carried out. Dimension effects associated with the microstructure peculiarities are revealed. A considerable enhancement of inter-grain critical currents is found to take place in the ultra-fine samples investigated.

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W-B-C-N 확산방지막의 특성 및 열적 안정성 연구 (Diffusion and Thermal Stability Characteristics of W-B-C-N Thin Film)

  • 김상윤;김수인;이창우
    • 한국자기학회지
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    • 제16권1호
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    • pp.75-78
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    • 2006
  • 텅스턴-보론-카본질소 화합물 박막(W-B-C-N)을 만들기 위하여 박막내에 보론과 카본 그리고 질소의 불순물을 주입한 다음 결정구조를 조사하였으며, 이러한 박막의 식각 특성을 조사하기 위하여 고온에서 열처리한 다음 Cu박막을 W-B-C-N 박막위에 증착한 다음에 열처리하였고 여기에서 열적인 특성을 조사하였다. $1000\;{\AA}$의 박막을 RF magnetron sputtering방법을 이용하여 증착한 후에 박막의 전기적구조적인 특성을 측정하였으며, scratch test를 통해 박막의 결합력을 측정하였고, XRD측정을 통하여 결정성을 조사하였으며, 열처리한 후 etching을 하여 nomarski 현미경을 통하여 확산방지막의 안정성을 조사하였다. 이로부터 확산방지막내의 보론과 카본 질소 등의 불순물이 들어감에 따라 Cu가 Si 속으로 얼마나 들어가는가를 효과적으로 조사하였다. W-B-C-N 확산방지막의 역할은 $850^{\circ}C$까지 고온 열처리를 하는 경우에 Cu 원자가 Si 속으로 확산되어 나가는 것을 효과적으로 방지하는 것을 알 수 있었다. 텅스텐-보론-카본질소 화합물 박막의 비저항은 질소 가스의 유량비를 조절함으로써 쉽게 조절할 수 있었으며, 텅스텐-보론-카본-질소 화합물 박막은 Cu 확산방지막으로 적용했을 때 적절한 질소 농도가 들어간 확산방지막에서는 효과적으로 Cu의 확산을 방지하는 것을 알 수 있었다.

나노 구리 분말의 냉간정수압 공정에 대한 치밀화 거동 해석 (Analysis of Densification Behavior of Nano Cu Powders during Cold Isostatic Pressing)

  • 윤승채;김형섭;이창규
    • 한국분말재료학회지
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    • 제11권4호
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    • pp.341-347
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    • 2004
  • In the study, a hybrid constitutive model for densification of metallic powders was applied to cold isostatic pressing. The model is based on a pressure-dependent plasticity model for porous materials combined with a dislocation density-based viscoplastic constitutive model considering microstructural features such as grain size and inter-particle spacing. Comparison of experiment and calculated results of microscale and nanoscale Cu powders was made. This theoretical approach is useful for powder densification analysis of various powder sizes, deformation routes and powder processing methods.

Inter- and Intra-granular Critical Current in $Bi_{1.4}Pb_{0.6}Sr_2Ca_2Cu_{3.6}O_x$ Superconducting Oxide

  • Choy, Jin-Ho;Kim, Seung-Joo;Park, J.C.;Frohlich, K.;Dordor, P.;Grenier, J.C.
    • Bulletin of the Korean Chemical Society
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    • 제11권6호
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    • pp.560-563
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    • 1990
  • A.c. susceptibility for $Bi_{1.4}Pb_{0.6}Sr_2Ca_2Cu_{3.6}O_x$ superconductor is measured as a function of temperature at different value of a.c. magnetic field amplitude. Two transition steps are attributed to the intergranular and intragranular properties. Based on Bean's critical state model, intergranular critical current density, $J_c^{gb}$ (11 $A/cm^2$ at 77 K) and intragranular critical current density, $J_c^g (7{\times}10^3\;A/cm^2$ at 100 K) are estimated. The low values of $J_c^{gb}$and $J_c^g$ reflect a poor nature of coupling between grains and the low pinning force density of intragrain in $Bi_{1.4}Pb_{0.6}Sr_2Ca_2Cu_{3.6}O_x$ superconductor.