• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
• /
• pp.1322-1325
• /
• 2009

Adaptive black band insertion improve blur phenomenon that caused by hold type issue of LCD, the approach regulate charge time by OE signal to control black inserted ratio, and the charge time be modified according the motion quantity of displaying content.

• 대한족부족관절학회지
• /
• 제10권1호
• /
• pp.71-75
• /
• 2006

Purpose: To evaluate the results of treatments by percutaneous Acutrak screw fixation for intra-articular tongue type fracture of calcaneus, especially in elderly patient or patients with underlying disease including diabetes mellitus. Materials and Methods: Seven cases with intra-articular tongue type fracture of calcaneus, from November 2003 to February 2005, were reviewed. There were 6 males and 1 female with 65 years old mean age (range: $61{\sim}71$ years old). The average follow-up period was 16 months (range: $10{\sim}25$ months). Two Steinmann pins were used for closed reduction. After closed reduction was done like Essex-Lopresti's method, two Acutrak screws were inserted. The third Acutrak screw was inserted at the sustentaculum tali away from sinus tarsi to fix the primary fracture line. The patients were evaluated with Salama scale, the extent of recovery of Bohler angle, state of subtalar joint. Results: Clinical results according Salama scale were excellent in 5 cases, and good in 2 cases. Average preoperative Bohler angle was $13^{\circ}$ (range: $12{\sim}15^{\circ}$). Average postoperative Bohler angle was 31o (range: $23^{\circ}-40^{\circ}$). There were no soft tissue complications. There were two mild subtalar arthritis. Conclusions: We think that percutaneous Acutrak screw fixation is a good option for tongue type fracture of calcaneus in elderly patient or patients with underlying disease including diabetes mellitus.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2004년도 학술대회 논문집 정보 및 제어부문
• /
• pp.577-579
• /
• 2004

Digital hearing aids enclose $6{\sim}8$ tiny components. Those electromechanical components are individually wired by soldering which is a manual labor and sometimes causes components' damage by heating. This paper suggests a PCB design for overcome these problems. Several PCBs are designed and manufactured and circuited to produce ITE(In The Ear) type hearing aids which are inserted in the ear canal. The most optimal size of the PCB design for the ITE hearing aid is presented in this paper.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2004년도 추계학술대회
• /
• pp.1012-1015
• /
• 2004

Digital hearing aids enclose $6{\sim}8$ tiny components. Those electromechanical components are individually wired by soldering which is a manual labor and sometimes causes components' damage by heating. This paper suggests a PCB design for overcome these problems. Several PCBs are designed and manufactured and circuited to produce ITE(In-the-Ear) type hearing aids which are inserted in the ear canal. The most optimal size of the PCB design for the ITE hearing aid is presented in this paper.

• 한국방사성폐기물학회:학술대회논문집
• /
• 한국방사성폐기물학회 2006년도 학술논문요약집
• /
• pp.349-350
• /
• 2006

• 한국전기전자재료학회논문지
• /
• 제21권12호
• /
• pp.1111-1117
• /
• 2008

A transformer type superconducting fault current limiter (SFCL) is one of the fault current limiters which have been proposed to reduce the fault current in the transmission lines. This paper proposes the new circuit configuration of a transformer type SFCL and also investigates the operating characteristics of the transformer type SFCL containig the resistor in the tertiary winding. The proposed SFCL contains the resistor in the tertiary winding. The newly inserted resistor can divert the power which the High-Tc superconducting has to bear. Because the resistor in the tertiary winding relieves the power of the High-Tc superconducting, it is possible that the proposed transformer type SFCL can decrease the more larger fault current than the conventional SFCL with the same High-Tc superconducting. And the cost of the proposed transformer type SFCL can be reduced.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제15권1호
• /
• pp.114-121
• /
• 2015

In conventional LEDs, a mesa-structure is usually used and it causes the current to be overcrowded in a specific region. We propose a novel structure of GaN-based LED to overcome this problem. In order to distribute the current in an active region, a spreading pad is inserted at the p-type region in the GaN based LED device. The inserted spreading pad helps the current flow because it is more conductive than the p-type GaN layer. By performing electrical and optical simulations, the effects of the spreading pad insertion are confirmed. The results of electrical simulation show that the current spreads more uniformly and more radiative recombination is produced as well. Moreover, from the optical simulation, it is revealed that the ITO is less absorptive material than p-GaN if the condition of specific wavelength sources is satisfied. Considering all of the results, we can conclude that the luminescent power is enhanced by the spreading pad.

• 한국전기전자재료학회논문지
• /
• 제23권11호
• /
• pp.896-900
• /
• 2010

Electrical properties of organic light-emitting diodes were studied in a device with 7,7,8,8-tetracyano-quinodimethane (TCNQ) to see how the TCNQ affects on the device performance. Since the TCNQ has a high electron affinity, it is used for a charge-transport and injection layer. We have made a reference device in a structure of ITO(170 nm)/TPD(40 nm)/$Alq_3$(60 nm)/LiF(0.5 nm)/Al(100 nm). And two types of devices were manufactured. One type of device is the one made by doping 5 and 10 vol% of TCNQ to N,N'-diphenyl-N,N'-di(m-tolyl)-benzidine (TPD) layer. And the other type is the one made with TCNQ layer inserted in between the ITO anode and TPD organic layer. Organic layers were formed by thermal evaporation at a pressure of $10^{-6}$ torr. It was found that for the TCNQ doped devices, turn-on voltage of the device was reduced by about 20 % and the current efficiency was improved by about three times near 6 V. And for devices with TCNQ layer inserted in between the ITO anode and TPD layer, it was found that the current efficiency was improved by more than three times even though there was not much change in turn-on voltage.

• Journal of Advanced Marine Engineering and Technology
• /
• 제30권6호
• /
• pp.702-708
• /
• 2006

This study shows the experimental characteristics of the double pipe inserted liquid pipe with small diameter in the gas pipe with large diameter for circulating of a liquid of high temperature, pressure and a gas of low temperature, pressure at the same time. So the functions of pipe and pipe's expansion and heat transfer are presented simultaneously. In the result, the temperature of gas refrigerant at the inlet of compressor increased about $5^{\circ}C$ by the heat transfer with liquid refrigerant in case of the double pipe. And liquid gas refrigerant which the temperature at the inlet of evaporator decreased about $3^{\circ}C$ comparing with the existing type flows into an evaporator COP of the double pipe increased about $7{\sim}10%$ comparing with that of the conventional pipe. And the noise of the double pipe at capillary tube is less than that of the conventional type about 3dB. Consequently. it is convinced the superiority of the double pipe in the heat loss and soundproofing aspect.

• 대한전자공학회논문지
• /
• 제13권3호
• /
• pp.22-27
• /
• 1976

집적회로(I.C)의 설계에 있어서는 평수구조의 변형만이 가능하므로 여러가지 다른 트랜지스터 (Transistor)가 결합하여 하나의 특정한 기능을 발휘하게 되는 선형회로에는 회로의 설계와 동시에 사용될 적층(EPI)의 비저항 및 두께와 적층(EPI)과 기판 사이에 삽입되는 이침층(Buried Layer)의 구조 등을 정확히 알아야 한다. 본 연구에서는 집적회로의 동작전압과 적층 두께및 비저항과의 관계를 실측치와 비교분석 하였고 이 결과를 선형 집적회로 설계에 이용 가능하도록 도시하였다. For linear IC design, one has to know the epi thickness, resistivity, and structure of buried island inserted between epi and substrate because the mask structure can only be changed for linear IC consisted of various type of transistors to be made for desired specific function. The interrelation of IC operational and saturation voltages with epi resistivity, theckness and divice structure are studied and presented in graphic forms so that IC design engineers can utilize them.