• 수산해양교육연구
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• 제16권2호
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• pp.257-270
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• 2004

The two-phase closed thermosyphon is a heat transfer device capable of transfer large quantities of heat from a source to a sink by taking advantage of the high heat transfer rates associated with the evaporation and condensation of a working fluid within the device. A study was carried out with the performance of the heat transfer of the thermosyphon having 50, 60, 70, 80, 90 internal micro grooves in which boiling and condensation occur. A plain thermosyphon having the same inner and outer diameter as the grooved thermosyphon is also tested for comparison. Water, methanol and ethanol have been used as the working fluids. The liquid filling as the ratio of working fluid volume to total volume of thermosyphon, the inclination angle, micro grooves and operating temperature have been used as the experimental parameters. The heat flux and the boiling and the condensation heat transfer coefficient and overall heat transfer coefficient at the condenser and evaporator zone are estimated from the experimental results. The experimental results have been assessed and compared with existing correlations. Imura's and Kusuda's correlation for boiling showed in good agreement with experimental results within ${\pm}20$％ in plain thermosyphon. The maximum heat transfer rate was obtained when the liquid fill ratio was about 25%. The high heat transfer coefficient was found between 25o and 30o of inclination angle for water and between 20o and 25o for methanol and ethanol. The relatively high rates of heat transfer have been achieved in the thermosyphon with internal micro grooves. The micro grooved thermosyphon having 60 grooves shows the best heat transfer coefficient in both condensation and boiling. The maximum enhancement (i.e. the ratio of the heat transfer coefficients of the micro grooved thermosyphon to plain thermosyphon) is 2.5 for condensation and 2.3 for boiling.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 동계학술발표대회 논문집
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• pp.170-174
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• 2008

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of slimness of the devices, so it is not easy to find the optimal thermal management technology for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint. In the present study, the silicon and metal flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. Through the experimental study, the normal isothermal characteristic by vapor-liquid phase change was confirmed and the cooling device with 70mm of total length showed 6.8W of the heat transfer rate within the range of $4{\sim}5^{\circ}C$/W of thermal resistance. In the meantime, the metal cooling device was developed for commercialization. The device was designed to have all structures of evaporator, vapor flow path, liquid flow path and condenser in one plate. And an envelope of that could be completed by combining the two plates of same structure and size. And the simplicity of fabrication process and reduction of manufacturing cost could be accomplished by using the stamping technology for fabricating large flow paths relatively. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of that.