• Proceedings of the Materials Research Society of Korea Conference
• /
• 2009.05a
• /
• pp.12.1-12.1
• /
• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.502-502
• /
• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.1
• /
• pp.83-90
• /
• 2014

EHD (electro-hydro-dynamics) patterning was performed under atmospheric pressure at room temperature in a single step. The drop diameter smaller than nozzle diameter and applied high viscosity conductive ink in EHD patterning method provide a clear advantage over the piezo and thermal inkjet printing techniques. The micro electrode pattern was printed by continuous EHD patterning method using 3-type control parameters (input voltage, patterning speed, nozzle pressure). High viscosity (1000cps) conductive ink with 75wt% of silver nanoparticles was used. EHD cone type nozzle having an internal diameter of $50{\mu}m$ was used for experimentation. EHD jetting mode by input voltage and applied 1st order linear regression in stable jet mode was analyzed. The stable jet was achieved at the amplitude of 1.4~1.8 kV. $10{\mu}m$ micro electrode pattern was created at optimized parameters (input voltage 1.6kV, patterning speed 25mm/sec and nozzle pressure -2.3kPa).

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.15 no.6
• /
• pp.122-128
• /
• 2016

The Biosensor biosensor pattern was developed by via an EHD (electro-hydro-dynamics (EHD) patterning process that was performed under atmospheric pressure at room temperature in a single step. The drop diameter was smaller than nozzle diameter and applied high viscosity conductive ink was applied in the EHD patterning method to provide a clear advantage over the piezo and thermal inkjet printing techniques. The Biosensor's biosensor's micro electrode pattern was printed by via a continuous EHD patterning method using 3three- type types of control parameters parameter (input voltage, patterning speed, nozzle pressure). High viscosity (1000 cps) conductive ink with 75 wt% of silver nanoparticles was used for experimentation. The incremental result of impedance of biosensor impedance was measured between the antibody ($10ug{\mu}g/ml$) to spore (0.1 ng/ml, 10 ng/ml, and $1ug{\mu}g./ml$) reaction at frequency 493 MHz frequency.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2010.06a
• /
• pp.53-53
• /
• 2010

The development of synthetic pathway to produce a highly yield nanoparticles is an important aspect of industrial technology. Herein, we report a simple, rapid approach to synthesize organic-soluble Cu and Ag nanoparticles in colloidal method for the application in a conductive pattern using inkjet printing. The silver nanoparticles have been synthesized in highly concentrated organic phase. The Cu nanoparticles have been synthesized by the reducing of the copper oxide materials using acid molecules in high concentrated organic phase. Their sintering and electric conductivity properties were investigated by melting process between $200^{\circ}C$ and $250^{\circ}C$ for application to printed electronics.