• Title/Summary/Keyword: Ink Pattern

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Address Electrode for PDP by Ink-Jet Method

  • Park, Lee-Soon;Im, Moo-Sik;Jung, Young-Chul
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.775-777
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    • 2003
  • Several methods are available for the fabrication of electrode pattern for the plasma display panel(PDP) including screen printing and photolithographic method. Piezo type ink-jet printing method is considered to the method of choice for electrode patterning in manufacturing of PDP. Both silver ink and absorbent layer paste formulation were developed for ink-jet printing of electrode pattern. The ink-jet printing of silver electrode with preformed absorbent layer was especially suitable for the patterning of address electrode for high resolution PDP.

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Process Improvement of PCB Electric Circuit Pattern by Ink Drop Jetting Control and Characteristics Analysis of Industrial Inkjet Piezoelectric Print Head (산업용 잉크젯 압전프린트 헤드의 특성해석 및 잉크 망점제어에 의한 PCB 전기회로패턴 공정개선)

  • Youn, Shin-Yong
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.65 no.1
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    • pp.57-65
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    • 2016
  • This paper was analyzed the characteristics of piezoelectric inkjet print head using finite element method(FEM). It showed the bending node driving of piezoelectric and relation theory principle consider piezoelectric material characteristics and ink characteristics. From such result we were had the piezoelectric head design and manufacture. It got a this head characteristics through experiment, we confirmed that proper voltage control is possible to through ink drop control experiment of piezoelectric print head. This paper was obtained the suitable ink jetting characteristics that manufacture the control circuit and piezoelectric inkjet print head. This practice product was applied to improvement of PCB electric circuit pattern by etching resist ink that PCB manufactured to complex process over traditional 6 stages can be simpled to 1 stage by inkjet printing technology.

Analysis of Ink Transfer Mechanism in Gravure-offset Printing Process (그라비아 옵셋 프린팅 공정에서의 잉크전이 메커니즘 해석 연구)

  • Lee, Seung-Hyun;Nam, Ki-Sang;Lee, Taik-Min;Yoon, Deok-Kyun;Jo, Jeong-Dai
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.10
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    • pp.1146-1152
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    • 2011
  • Ink transfer process is very important to determine quality of printed pattern, therefore its mechanism should be understood to control printing quality. Although there have been many attempts to understand ink transfer mechanism by numerical simulation and experimental studies, their model was too much simple to model realistic printing process and our understanding is not enough yet. In this paper we designed ink transfer visualization system to present flow visualization of ink transfer process for gravure offset printing. We considered rotational effect of blanket roll which is related with printing speed and used non-Newtonian fluid as working fluid such as Ag paste. For printing unit, cantilever-type blanket roll is used for convenient visualization of ink transfer. Serial images were captured continuously by using high-speed CMOS camera and long range microscope. We investigated the effects of various design parameters such as printing speed and pattern angle on the ink transfer process. We found more stretched ink filament for non-Newtonian fluid than Newtonian fluid. As increasing printing speed, length of stretched ink filament and height of break-up point are also increased. We also compared ink transfer process between CD and MD pattern and its relationship with ink transfer mechanism.

A Study on fabrication of the Ag fine pattern using Near Field Electro Spinning(NFES) (근접장 전기방사 방식을 이용한 Ag 미세 패턴 형성)

  • Sim, Hyo-Sun;Seo, Hwa-Il;Youn, Doo-Hyeb
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.4
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    • pp.65-70
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    • 2011
  • These days, printed electronics attract attention from electronics industry. In this paper, the fabrication of the fine patterns by Near Field Electro Spinning (NFES) was studied by using Ag ink on silicon wafer (substrate). Two types of ink, the high viscous ink Ag-200 and low viscous ink Ag-15, were used. The fine and uniform patterns were easily fabricated by using Ag-200 because jet breakup is less occurred in high viscosity solution. As increasing flow rate of solution, aspect ratio of Ag pattern decreased. And there was optimum applied voltage for fine pattern. In case of Ag-200, the optimum applied voltage was about 2.02KV. When pattern was fabricated by NFES, the pattern width and height were affected by many factors such as viscosity, flow rate of solution, applied voltage etc.

Cu Line Fabricated with Inkjet Printing Technology for Printed Circuit Board (잉크젯 인쇄 기술을 이용한 인쇄회로기판용 나노구리배선 개발)

  • Seo, Shang-Hoon;Lee, Ro-Woon;Yun, Kwan-Soo;Joung, Jae-Woo;Lee, Hee-Jo;Yook, Jong-Gwan
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1806-1809
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    • 2008
  • Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

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Analysis of Ink Transfer for R2R Printing Process with High Speed Operation and Complex Roll Patterns (고속 웹 이송속도 및 복잡한 롤 패턴 형상을 고려한 R2R공정에서의 잉크전달 특성 해석)

  • Kim, Kyung-Hun;Kim, So-Hee;Na, Yang
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.2
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    • pp.55-60
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    • 2010
  • Ink transfer process from the printing roll to the moving web was investigated using a CFD technique for the application in R2R printed electronics. In line with the requirement that the web handling speed needs to be increased further for the cost competitiveness, the effects of web moving velocity with relatively complex roll patterns were analyzed. To make the present analysis more realistic, the numerical geometry and the ink properties were selected to match those of the real printing production system. Our numerical results showed that both web handling speed and complex printing-roll patterns influenced the shape of the transferred ink. As the web moving speed approaches towards 30mpm, a significant distortion of the shape of the transferred ink occurred. In the range of pattern width smaller than 100 microns, a phase distortion was also found to occur in all the printing-roll patterns considered in the present work but the ratio of the phase distortion to the line width gets smaller as the width becomes smaller. Thus, the web handling speed and the shape of printing-roll pattern will be important elements for the better printing quality under 100 micron line width range.

A Study for Micro-patterning using an Electrostatic Inkjet (정전기력 잉크젯 프린팅을 이용한 마이크로 패터닝에 관한 연구)

  • Kim, Jun-Woo;Choi, Kyoung-Hyun;Kim, Dong-Soo
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1103-1106
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    • 2008
  • For the current display process, the innovative micro pattern fabrication process using semiconductor process should be developed, which requires the expensive equipment, the limited process environment and the expensive optic-sensitive material. The effort of process innovation during past several years ends up the limit of cost reduction. The existing ink jet technologies such as a thermal bubble ink jet printing and a piezo ink jet printing are required to shorten the nozzle diameter in order to apply to the micro pattern fabrication. In this paper, as one way to cope these problems the micro pattern equipment based on the electrostatic ink jet has been developed and carried out some experiments.

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Pattern Characteristic by Electrostatic Field Induced Drop-On-Demand Ink-jet Printing

  • Choi, J.Y.;Kim, Y.J.;Son, S.U.;Kim, Y.M.;Lee, S.H.;Byun, D.Y.;Ko, H.S.
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.451-454
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    • 2007
  • This paper presents the pattern characteristic using the electrostatic drop-on-demand ink-jet printing system. In order to achieve the pattern characteristic of electrostatic inkjet printing, the capillary inkjet head system is fabricated using capillary tube, Pt wire and electrode, and is packaged by acrylic board for the accurate alignment between wire and electrode-hole. The applied DC voltage of 1.4 $\sim$ 2.0 kV used for the observation of electrostatic droplet ejection. Electrostatic droplet ejection is directly observed using a high-speed camera. For investigated pattern characteristic, conductive inkjet silver ink used. The higher voltage has a good condition which has micro dripping mode. Also, the droplet size decreases with increasing the supplied DC voltage. This paper shows the pattern which is formed by about 300um. Also, capillary inkjet head system will be applied industrial area comparing conventional electrostatic inkjet head system.

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A Study on the Computer Simulation of Ink Flow in the Reverse Offset Printing (Reverse Offset에서 잉크 전이 유동에 관한 시뮬레이션 연구)

  • Lee, Ane-Seok;Youn, Jong-Tae
    • Journal of the Korean Graphic Arts Communication Society
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    • v.30 no.2
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    • pp.23-33
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    • 2012
  • With the development of many display technologies currently applied to them in the field of printed electronics, there have been many researches that high resolution printing for thin and uniform pattern. In this paper, printing ink flow properties in the reverse offset mechanism were simulated. The aim of this research is to expect the ink flow behavior between cliches to make fine pattern by a printing technique which is a reverse offset. The simulation results show that almost the same as the experiments and the flow behavior according to the ink film thickness and printing pressure changes could be expected.