• Asia pacific journal of information systems
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• v.9 no.1
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• pp.59-75
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• 1999

Currently, many companies are trying to be more competitive by implementing the most appropriate software package, called ERP (Enterprise Resource Planning). ERP can support the company's business process. A repository, which can store and retrieve enterprise-wide information, is a key component of such software package. This paper implements an enterprise repository for the ERP. A well-known repository standard, IRDS (Information Resource Dictionary System), is employed for the repository architecture. The proposed metadata schema can help develop database, business applications, models, and workflow. To illustrate the practical usefulness, a real-life ERP prototype is built within the framework of the proposed repository.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.23 no.3
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• pp.173-181
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• 2017

This study was conducted to investigate the packaging characteristics including pack sources and pack components of processed foods in Korea. For the survey, 704 food package samples were selected based on the consumption of top 10 brackets in each food item. They were consisted of 1,245 packaging components. Seven specific items were firstly investigated including product name, capacity of the food, package component, package source, food contact area, food contact ratio, and package thickness. The processed foods in Korea can be classified into 16 pack sources and 21 pack components, respectively. By using this information, the data were analyzed specifically. The collected data were analyzed in 8 major categories: frequency of use by pack components and pack sources, pack components by the products, pack sources by the products and pack components, pack thickness/food contact ratio by the products, food contact ratio by pack components and pack sources. Consequently, this survey will provide various information of the packaging characteristics of processed foods in Korea.

• Journal of KIISE:Software and Applications
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• v.33 no.10
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• pp.836-850
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• 2006

Nowadays, due to the rapidly increasing number of package software products, quality test has been emphasized for package software products. When testing software products, one of the most important factors is to select metrics which form the bases for tests. In this paper, the types of package software are represented as characteristic vectors having probabilistic relationships with metrics. The characteristic vectors could be regarded as indicators of software type. To assign the metrics for each software type, the past test metrics are collected and analyzed. Using Bayesian belief network, the dependency relationship network of the characteristic vectors and metrics is constructed. The dependency relationship network is then used to find the proper metrics for the test of new package software products.

• Journal of Digital Convergence
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• v.15 no.9
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• pp.479-486
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• 2017

The purpose of this study is to analyze the preference and value of consumers through the package design of cosmetics with the concept of cause branding, and to propose a package design that can satisfy consumers' needs. I have recruited an experimental group that emphasizes the importance of package design in purchasing cosmetics. And Survey and in-depth interviews were conducted by comparing cause brand's product with general brand's product. In the first experiment, the items were classified into cognitive, emotional, and behavioral responses and a total of 31 subjects were surveyed. In the second experiment, six interviewees were interviewed through a questionnaire prepared by extracting 4 items from Sheth 's consumption value standard. As a result of the experiment, consumers preferred a design that can quickly and accurately grasp the information of the product. Especially, it is not easy to know whether it is a cause brand's product. So It should be stated in the package how it will be socially beneficial.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.10
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• pp.31-39
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• 2004

This paper illustrates the noise characteristics under chip's core operations according to types of packages and modules for DDR DRAM For analyzing this, the impedance profiles and power noises are analyzed with DRAM chips having commercial TSOP package and commercial FBGA package on TSOP-based DIMM and FBGA-based DIMH In controversy with common concepts, we find that the noise-isolation characteristics of FBGA package are more weak and sensitive on transferred noises than those of the TSOP package. In addition, the simulated results show that the decoupling capacitor locations of modules are more important to control the self and transfer noise characteristics than the lead inductance of the packages. Therefore, satisfying the target spec of the noise suppression and isolation can be achieved through the design of power distribution systems only with considering not only the package types but also the whole module system.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1053-1056
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• 1998

Package strutures for RF circuit design are characterized and their equivalent circuitsare developed. The circuit parameters are extracted by using the commercial 3-dimensional field solver. The circuit models are verified by using the full-wave analysis in the RF region. It is demonstarted with the developed circuit models that the packages have substantial effects on the RF circuit performances.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.385-388
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• 1999

A new frequency-variant equivalent circuit model of power/ground plane is presented. The equivalent circuit is modeled with grid cells. The circuit parameters of each cell were extracted by using Fasthenry. To verify the developed circuit model, its s-parameters are compared with the measured s-parameters 〔2〕 and the full-wave simulation-based s-parameters. Consequently, it is shown that our frequency-variant equivalent circuit model can accurately predict imperfect ground effects under the high frequency operation of electronic package.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.487-488
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• 2006

In this paper, we analyzed the FBGA packages operating in high speeds and high frequency rates for DRAM. Using 3D simulations, we could extract s-parameters of packages. We realize that the proposed FBGA package does not operate properly at 3Gbps bacause the FBGA package have delta-I noise($V_{{\Delta}I-peak}$) of 132.0mV and crosstalk of 300mV, which is 25% of the operating clock level.

• KSCI Review
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• v.2 no.1
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• pp.1-12
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• 1995

Recently, graphics by graphic terminal widely used in various fields. But, many graphic software package in our country, though has been designed in other countries and necessarily required the use of Korean alphabet in various fields, not followed the requirements. So, this research analyzed the structures of the Korean alphabet, designed the fonts on the use of Korean, developed software module on the use of Korean using the modules of Tektronix Graphic Software module(PLOT-10)and extended the already used graphic software package.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.10
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• pp.91-97
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• 1998

The modulation performance of 10 Gbps electro-absorption InGaAsP/InGaAsP strain compensated MQW (Multiple Quantum Well) modulator module depends on the modulator as well as the package parasitics. The high frequency package parasitics resulting from various structural discontinuities, limit the modulation bandwidth and increase the chirp-parameter. Therefore, we propose the double bondwires embedded in dielectric materials to minimize the bondwire parasitics. Using the proposed structure with 50 $\Omega$ terminating resistor, the modulation bandwidth is greatly increased by 125 % than the bare chip and the chirp-parameter is also reduced. This technique can be used in optimizing the package of high speed external modulators.