• 제목/요약/키워드: Impedance Matching

검색결과 672건 처리시간 0.024초

고압전력선 통신을 위한 임피던스 측정 및 정합 방안 연구 (Impedance Measurement and Matching Technique for Medium-Voltage Powerline Communication)

  • 이재조;유정훈;홍충선;이대영
    • 대한전기학회논문지:시스템및제어부문D
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    • 제53권5호
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    • pp.345-352
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    • 2004
  • Currently, high data rate PLC(Power Line Communications), up to 100 Mbps, which use frequency bandwidth between 2 MHz and 30 MHz is investigated very hard, and commercial PLC modem for low voltage powerline network (indoor) is coming soon into communication market. For the purpose of developing a fit communication system which has little distortion of signal and attenuation, it is surely necessary to know about channel environments of powerline. Especially, the impedance measurement of the powerline and impedance matching are very important. As is known, since medium-voltage powerline (22.9 ㎸) is still working, it is not so simple to measure the powerline impedance. In our study, a portable impedance measurement equipment is developed. It consists of coupling capacitor, a drain coil and impedance matching transformer. The equipment is easily connected to medium voltage line and impedance of power line is measured using a network analyzer. Also, measurement results are used for impedance matching of PLC signal. In fact, matching transformer with several different impedances are used. The matching transformer is connected between coupling capacitor and signal port. In this paper, the developed portable impedance measurement equipment and impedance measurement results are presented. Also impedance matching technique using matching transformers will be explained. We showed the result of the improved performance by the impedance matching.

Understanding of RF Impedance Matching System Using VI-Probe

  • Lee, Ji Ha;Park, Hyun Keun;Lee, Jungsoo;Hong, Snag Jeen
    • 반도체디스플레이기술학회지
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    • 제19권3호
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    • pp.43-48
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    • 2020
  • The demand for stable plasma has been on the rise because of the increased delivery power amount in the chamber for improving productivity, and fast and accurate plasma impedance matching become a crucial performance measure for radio frequency (RF) power system in semiconductor manufacturing equipment. In this paper, the overall impedance matching was understood, and voltage and current values were extracted with voltage - current (VI) probe to measure plasma impedance in real-time. Actual matching data were analyzed to derive calibration coefficient for V and I measurements to understand the characteristics of VI probe, and we demonstrated the tendency of RF impedance matching according to changes in load impedance. This preliminary empirical research can contribute to fast RF matching as well as advanced equipment control for the next level of detailed investigation on embedded system based-RF matching controller.

Impedance Matching Characteristic Research Utilizing L-type Matching Network

  • Jun Gyu Ha;Bo Keun Kim;Dae Sik Junn
    • 반도체디스플레이기술학회지
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    • 제22권2호
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    • pp.64-71
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    • 2023
  • If an impedance mismatch occurs between the source and load in a Radio Frequency transmission system, reflected power is generated. This results in incomplete power transmission and the generation of Reflected Power, which returns to the Radio Frequency generator. To minimize this Reflected Power, Impedance matching is performed. Fast and efficient Impedance matching, along with converging reflected power towards zero, is advantageous for achieving desired plasma characteristics in semiconductor processes. This paper explores Impedance matching by adjusting the Vacuum Variable Capacitor of an L-type Matching Module based on the trends observed in the voltage of the Phase Sensor and Electromotive Force voltage. After assessing the impedance matching characteristics, the findings are described.

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임피던스 정합장치 내 위상센서를 이용한 RF정합 알고리즘 연구 (RF Impedance Matching Algorithm Using Phase Detector)

  • 김황규;양진우;강석호;최대호;홍상진
    • 반도체디스플레이기술학회지
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    • 제21권2호
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    • pp.32-37
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    • 2022
  • As semiconductors become finer, equipment must perform precise and accurate processes to achieve the desired wafer fabrication requirement. Radio frequency power delivery system in plasma system plays a critical role to generate the plasma, and the role of impedance matching unit is critical to terminate the reflected radio frequency power by modifying the impedance of the matching network in the plasma equipment. Impedance matching unit contains one fixed inductor and two variable vacuum capacitors whose positions are controlled two step motors. Controlling the amount of vacuum variable capacitor should be made as soon as possible when the mismatched impedance is detected. In this paper, we present the impedance matching algorithm using the phase sensor.

Broadband Impedance Matching Circuit Design for PLC Coupler Using Tchebycheff Equalizer

  • Kim, Gi-Rae;Tangyao, Xie
    • Journal of information and communication convergence engineering
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    • 제7권2호
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    • pp.113-118
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    • 2009
  • This paper is about design broadband impedance matching circuit for Coupler to improve power transfer efficiency in the power line communication (PLC) system. The Tchebycheff gain function algorithm is represented to design broadband matching circuit. A practical PLC Coupler impedance matching circuit is designed, and the characteristics for S11 and S21 of PLC coupler are enhanced comparing with unmatched one. This is done by maximizing the power transfer gain from modem to the load.

Design of Broadband Impedance Matching Circuit for PLC Coupler using Butterworth Equalizer

  • Xie, Tangyao;Kim, Gi-Rae
    • Journal of information and communication convergence engineering
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    • 제8권3호
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    • pp.258-262
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    • 2010
  • This paper represents design broadband impedance matching circuit for Coupler to improve power transfer efficiency in the broadband power line communication(BPLC) systems. The Butterworth gain function equalizer is used to design broadband matching circuit. A practical PLC Coupler impedance matching circuit is designed, and the characteristics for S11 and S21 of PLC Coupler are enhanced comparing with unmatched one. This is done by maximizing the power transfer gain from modem to the load.

Development of an Impedance Matching Layer in an Ultrasound Transducer with Gradient Properties

  • Jeong, Jihoon
    • 센서학회지
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    • 제27권6호
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    • pp.374-379
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    • 2018
  • The piezocomposite transducer is widely used because it is highly efficient in transforming electric energy into mechanical energy, and its frequency range is broader than that of other types of ultrasound transducers. A general piezocomposite transducer is composed of an acoustic lens, impedance matching layers, piezoelectric materials, and backing layers. When an input voltage is applied to a piezoelectric material as an active material, it generates sound waves while vibrating. At that time, an impedance matching layer helps the sound waves to propagate forward while reducing the impedance mismatch that may occur at the interface between the active material and its front material. The impedance mismatch has a negative effect on the signal of an ultrasound transducer; thus, it is important to design a matching layer to overcome the issue. In this study, an optimized feature of a matching layer with gradient properties is studied. An objective function is defined to minimize both the average and the deviation of the reflection coefficients that are functions of the frequencies. As a result, an improvement in the signal characteristics with respect to the sensitivity and bandwidth is reported.

불균일 카이크로스트립 선로의 특성 (The Characteristics of Non-uniform Microstrip)

  • 박기수
    • 대한전자공학회논문지
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    • 제13권1호
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    • pp.31-34
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    • 1976
  • 본 논문에서는 특성임피이던스가 선형적으로 변화하는 불균일박송선로의 특성, 특히 임피이던스정합특성을 해석하고 아울러 특성임피이던스 및 스트립의 폭이 선형적으로 변화하는 하는 불균일 마이크로스트립의 정합특성을 실험적으로 고찰하였다. In this paper, the characteristics, especially impedance matching behavior of linearly tapered transmission line which impedance is varied linearly is analyzed. Also impedance matching of nonuniform microstrip which characteristic impedance or width of strip is varied linearly are experimentally investigated.

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고속 ATE 시스템을 위한 임피던스 정합회로 구현 (Implementation of Impedance Matching Circuit for ATE)

  • 김종원;서용배;이용성
    • 반도체디스플레이기술학회지
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    • 제5권4호
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    • pp.17-22
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    • 2006
  • In the manufacturing processes of semiconductor, test process is important for quality of products. In the manufacturing process of dynamic memory, memory test is more important. So, automatic test equipment(ATE) is used necessarily. But, according to increase of speed of dynamic memory operation, the rapid test equipment is needed. Impedance matching between ATE and dynamic memory is expected to be an important problem for making a rapid test equipment over 1Gbps. According to increase of speed, inner impedance of ATE also works on important parameter for test. This paper is about the method that is for impedance matching of inner impedance and coaxial cable occurring in manufacturing of ATE. We proved effects of inner impedance by electric theory and verified the method of impedance matching using computer simulation.

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새로운 임피던스 매칭 구조를 가지는 소형 모노폴 안테나 (A Small Monopole Antenna with Novel Impedance Matching Structure)

  • 김동진;민경식
    • 한국전자파학회논문지
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    • 제18권7호
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    • pp.828-833
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    • 2007
  • 본 논문에서는 임피던스 매칭 구조를 가진 소형 모노폴 안테나를 제안하고 그 특성들을 나타내었다. 안테나 매칭을 위해서 안테나 상단에 구성한 inductive 매칭 구조는 효과적으로 안테나의 capacitive 성분들을 보상하여 설계 대역에서 임피던스 매칭이 잘 이루어지는 효과를 보였다. 기존의 많은 소형 안테나들이 임피던스 매칭을 위하여 별도의 매칭 구조를 안테나의 입력부에 적용한 것과는 달리 본 논문에서 제안한 방법은 안테나의 상단에 매칭 구조를 위치시킴으로써 비교적 적은 공간을 이용하여 효과적으로 안테나의 임력 임피던스를 매칭할 수 있는 방법을 제시하였다. 제안한 안테나는 중심 주파수에 대하여 40 % 이상의 대역폭과 95 % 이상의 방사 효율을 보이며, $2.6{\sim}3$ dBi 정도의 높은 이득 특성을 보이므로 향후 단말기 혹은 여러 분야에 적용될 수 있을 것으로 기대된다.