• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.233-236
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• 2000

The structural, electrical and chemical characteristics of Al alloy thin film with low impurity concentrations AlW deposited by using dc magnetron sputtering deposition are investigated for the applications as data bus line in the TFT-LCD panel. The deposited thin films show the decrease of resistivity and the increase of grain size after the RTA at $300^{\circ}C$ for 20 min.. Moreover, the resistivity of AlW does not show appreciable grain size dependence after RTA. It is concluded that the decrease of resistivity after RTA is due to the increase of grain size. The annealed AlW is found to be hillock free. And for investigating chemical attack in TFT-LCD etching processing the electric potential of AlW alloy for Ag/AgCl were investigated by cyclic voltammetry. When W wt.% of AlW alloy was higher than about 3%, the electric potential of AlW was more positive than ITO's. Therefore AlW alloy thin film can be propose to use for data bus line.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1738-1740
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• 1999

This paper deals with a novel structure of poly-Si solar cell. A solar cell conversion efficiency was degraded by grain boundary effect in Polycrystalline silicon. To reduce grain boundary effect, we performed a preferential grain boundary etching, $POCl_3$ n-type emitter doping, and then ITO film growth on poly-Si. Among the various preferential etchants, Schimmel etch solution exhibited the best result having grain boundary etch depth about $10{\mu}m$. RF magnetron sputter grown ITO films showed a low resistivity of $10^{-4}\Omega-cm$ and high transmittance of 85%. With well fabricated poly-Si solar cells. we were able to achieve as high as 15% conversion efficiency at the input power of 20mW/$cm^2$.

• Journal of the Korean Vacuum Society
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• v.6 no.4
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• pp.321-325
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• 1997

Recently, photosensitive color filters have received much attention for their use in the liquid crystal display (LCD) industry. It is well known that chemical and physical properties of polymer surfaces can be modified by special surface treatments. In this work, we have studied the polymer surfaces of LCD blue color filters which were exposed to the UV light during photolithography. A better understanding of the irradiated polymer surfaces is required for the subsequent processes such as plasma etching, ITO electrode deposition, etc. The surface analysis has been undertaken using secondary ion mass spectrometry (SIMS), x-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM). A significant enrichment of the pigment component and roughening of surface with bubble-like feature have been observed at the modified polymer surface.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.111.2-111.2
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• 2012

정보 기술 시대에 맞춰 광전소자의 연구가 활발해지면서 투명전극으로 사용될 수 있는 Transparent Conductive Oxide (TCO) 재료에 대한 관심이 높아지고 있다. 하지만 TCO의 대표적인 물질인 Indium Tin Oxide (ITO)의 경우 In의 가격 상승으로 인해 최근에는 낮은 전도도와 높은 투과도를 가질 수 있는 대체 물질에 대한 연구가 활발히 진행되고 있다. 그 중에서 3.2 eV 의 높은 밴드갭을 갖는 ZnO 는 가시광선 영역에서 높은 투과율을 나타낼 뿐만 아니라 Al, Ga을 도핑함으로써 낮은 전도도를 가질 수 있다. 이러한 TCO 재료는 surface texturing을 통하여 optical region 에서 반사를 억제 시킴으로서 빛을 모으는 역할을 하여 태양전지의 효율을 향상 시킬 수 있기 때문에 PV (Photovoltaics) Cell의 anti-reflective coating에 적용 할 수 있다. 본 연구에서는 pulsed DC magnetron sputtering을 이용하여 Ga-doped ZnO (GZO) 박막을 증착하였고, HCl 0.5 wt %로 wet etching을 통하여 surface texturing을 진행하였다. 결정성은 X-ray diffractometer (XRD)로 분석하였으며, 표면 형상은 Scanning Electron Microscope (SEM)을 통해 확인하였다. Van der Pauw 방법을 통해 resistivity, carrier concentration, hall mobility 등의 전기적 특성을 분석하였고 UV-Vis spectrophotometer 를 통해 투과도 및 반사도를 측정하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.49.2-49.2
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• 2009

투명전극은 디스플레이, 태양전지와 같은 광전자 소자에 필수적이며, 지금까지 개발된 재료 중에는 ITO가 가장 투명하면서 전기전도도가 높고 생산성도 좋기 때문에 투명전극의 재료로 사용하고 있다. ITO는 낮은 비저항(${\sim}10^{-4}{\Omega}cm$) 과 높은 투과율 (~85 %), 상대적으로 넓은 밴드갭 에너지 (3.5 eV) 의특성과 같이 뛰어난 전기적 광학적 특성에 반해서 높은 원자재 가격, 불안정한 공급량 등으로 인한 문제점이꾸준히 제기되고 있다. 따라서 $In_2O_3$:Sn, ZnO:Al, ZnO:Ga, ZnO:F, ZnO:B, TiN 등과 같은 물질들로대체하려는 연구가 활발하게 진행되고 있다. ZnO는 ITO보다원자재의 수급이 원활하기 때문에 원가가 낮으며, 상대적으로 낮은 온도에서도 제작이 가능하다. 또한 화학적으로 안정적이므로 ZnO에 Al, Ga 등의 3족 원소를 도핑함으로써 낮은 비저항의 박막 제작이 가능하고, ITO 박막과 비교하여 etching이 쉬우며 기판과의 접착성이 좋으며, sputtering 공정시 plasma 분위기에서의 안정성이 뛰어나고 박막증착율이 높기 때문에 투명전극으로 적합한 재료이다. 본 연구에서는 cylindrical type의 Aldoping된 ZnO single target을 사용하여 박막 증착 압력의 변화를 주어 유리기판 위에 DC sputtering을 하였다. Fieldemission scanning electron microscope (FESEM)을 통해 ZnO:Al 박막의 표면의 형상과 두께를 확인하였으며, X-ray diffraction (XRD) 분석을 통해 박막의 결정학적 특성을 관찰하였다. 투명전극용 물질로서 ZnO:Al 박막의 적합성 여부를 확인하기 위하여 Van der Pauw 방법을 이용하여 박막의 비저항, 전자 이동도, 캐리어 농도를 측정하였으며, 박막의 기계적 성질 및 표면 접착성을 확인하기 위하여 nano-indentaion 분석을 하였다. 또한 UV-vis spectrophotometer를 이용하여 ZnO:Al 박막의 투과율을 분석하여 투명전극으로의 응용 가능성을 확인하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.232-235
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• 2002

An 150 kV gas cluster ion accelerator was fabricated and assessed. The change of surface morphology and surface roughness were examined by an atom force microscope (AFM) after irradiation of $CO_2$ gas clusters on Si (100) surfaces at the acceleration voltages of 50 kV. The density of hillocks induced by cluster ion impact was gradually increased with the dosage up to 5$\times$10$^{11}$ ions/$\textrm{cm}^2$. At the boundary of the ion dosage of 10$^{12}$ ions/$\textrm{cm}^2$, the density of the induced hillocks was decreased and RMS (root mean square) surface roughness was not deteriorated further. At the dosage of 5x10$^{13}$ ions/$\textrm{cm}^2$, the induced hillocks completely disappeared and the surface became very flat. In addition, the irradiated region was sputtered. $CO_2$ cluster ions are irradiated at the acceleration voltage of 25 kV to remove hillocks on indium tin oxide (ITO) surface and thus to attain highly smooth surfaces. $CO_2$ monomer ions are also bombarded on the ITO surface at the same acceleration voltage to compare sputtering phenomena. From the AFM results, the irradiation of monomer ions make the hillocks sharper and the surfaces rougher On the other hand, the irradiation of $CO_2$ cluster ions reduces the hight of hillocks and planarize the ITO surfaces. From the experiment of isolated cluster ion impact on the Si surfaces, the induced hillocks m high had the surfaces embossed at the lower ion dosages. The surface roughness was slightly increased with the hillock density and the ion dosage. At higher than a critical ion dosage, the induced hillocks were sputtered and the sputtered particles migrated in order to fill valleys among the hillocks. After prolonged irradiation of cluster ions, the irradiated region was very flat and etched.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.56-56
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• 1999

For advanced TFT-LCD manufacturing processes, dry etching of thin-film layers(a-Si, $SiN_x$, SID & gate electrodes, ITO etc.) is increasingly preferred instead of conventional wet etching processes. To dry etch Al gate electrode which is advantageous for reducing propagation delay time of scan signals, high etch rate, slope angle control, and etch uniformity are required. For the Al gate electrode, some metals such as Ti and Nd are added in Al to prevent hillocks during post-annealing processes in addition to gaining low-resistivity($<10u{\Omega}{\cdot}cm$), high performance to heat tolerance and corrosion tolerance of Al thin films. In the case of AI-Nd alloy films, however, low etch rate and poor selectivity over photoresist are remained as a problem. In this study, to enhance the etch rates together with etch uniformity of AI-Nd alloys, magnetized inductively coupled plasma(MICP) have been used instead of conventional ICP and the effects of various magnets and processes conditions have been studied. MICP was consisted of fourteen pairs of permanent magnets arranged along the inside of chamber wall and also a Helmholtz type axial electromagnets was located outside the chamber. Gas combinations of $Cl_2,{\;}BCl_3$, and HBr were used with pressures between 5mTorr and 30mTorr, rf-bias voltages from -50Vto -200V, and inductive powers from 400W to 800W. In the case of $Cl_2/BCl_3$ plasma chemistry, the etch rate of AI-Nd films and etch selectivity over photoresist increased with $BCl_3$ rich etch chemistries for both with and without the magnets. The highest etch rate of $1,000{\AA}/min$, however, could be obtained with the magnets(both the multi-dipole magnets and the electromagnets). Under an optimized electromagnetic strength, etch uniformity of less than 5% also could be obtained under the above conditions.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.258-258
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• 2009

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.175-175
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• 2013

염료감응형 태양전지(Dye Sensitized Solar Cells; DSSC)에서 투명전극(Transparent Conducting Oxide; TCO)으로 사용되는 ITO, FTO의 경우 자원의 희소성과 고온에 취약하며 취성과 같은 단점 등이 있다. Graphene은 단원자층의 얇은 물질로써 우수한 전도도와 투과도, 고강도와 고탄성의 특성들을 가진다. 이러한 특성들을 가지는 Graphene을 기존의 투명전극을 대체하여 DSSC의 작업전극에 적용 하였다. 본 실험에서 사용된 그래핀 시트는 근적외선을 source로 하는 RTA (Rapid Thermal Annealing)장비에 탄화수소 기반의 gas를 주입하여 Ni위에 성장시켰으며, 습식방법인 용액Etching 방식을 사용하여 유리판 위에 전사시켰다. 전사된 Graphene 투명전극의 전기적 특성과 광학적 특성을 평가하기 위해 4 point probe, FT-IR, 마이크로 Raman분광법, 광학현미경 및 투과도를 측정하여 평가 하였다. 전사된 Graphene 투명전극을 염료감응형 태양전지 작업전극에 적용하여, DSSC소자를 제작하고, Solar Simulator로 광전변환효율 및 EIS(Electrochemical Impedance Spectroscopy)를 측정하여 기존의 FTO로 만든 DSSC와 비교하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1193-1196
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• 2009

Low resistivity interconnection and high-mobility channel are required to realize ultrahigh-definition LCDs such as 4k ${\times}$ 2k TVs. We evaluated fully Cu-based gate and Source/Drain interconnections, consisting of stacked pure-Cu/Cu-Mn layers for TFT-LCDs, and found the underlying Cu-Mn alloy film has superior adhesion to glass substrates and CVD-SiOx films. It was also confirmed that wet etching of the Cu/Cu-Mn films without residues and low contact resistance with both channel IGZO and pixel ITO films can be obtained. It is thus considered that the stacked Cu/Cu-Mn structure is one of candidates to replacing conventionally pure-Cu/refractory metal.