• Title/Summary/Keyword: Hybrid-capacitor

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A Digital Input Class-D Audio Amplifier (디지털 입력 시그마-델타 변조 기반의 D급 오디오 증폭기)

  • Jo, Jun-Gi;Noh, Jin-Ho;Jeong, Tae-Seong;Yoo, Chang-Sik
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.11
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    • pp.6-12
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    • 2010
  • A sigma-delta modulator based class-D audio amplifier is presented. Parallel digital input is serialized to two-bit output by a fourth-order digital sigma-delta noise shaper. The output of the digital sigma-delta noise shaper is applied to a fourth-order analog sigma-delta modulator whose three-level output drives power switches. The pulse density modulated (PDM) output of the power switches is low-pass filtered by an LC-filter. The PDM output of the power switches is fed back to the input of the analog sigma-delta modulator. The first integrator of the analog sigma-delta modulator is a hybrid of continuous-time (CT) and switched-capacitor (SC) integrator. While the sampled input is applied to SC path, the continuous-time feedback signal is applied to CT path to suppress the noise of the PDM output. The class-D audio amplifier is fabricated in a standard $0.13-{\mu}m$ CMOS process and operates for the signal bandwidth from 100-Hz to 20-kHz. With 4-${\Omega}$ load, the maximum output power is 18.3-mW. The total harmonic distortion plus noise and dynamic range are 0.035-% and 80-dB, respectively. The modulator consumes 457-uW from 1.2-V power supply.

Low-k Polymer Composite Ink Applied to Transmission Line (전송선로에 적용한 Low-k 고분자 복합 잉크 개발)

  • Nam, Hyun Jin;Jung, Jae-Woong;Seo, Deokjin;Kim, Jisoo;Ryu, Jong-In;Park, Se-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.2
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    • pp.99-105
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    • 2022
  • As the chip size gets smaller, the width of the electrode line is also fine, and the density of interconnections is increasing. As a result, RC delay is becoming a problem due to the difference in resistance between the capacitor layer and the electrical conductivity layer. To solve this problem, the development of electrodes with high electrical conductivity and dielectric materials with low dielectric constant is required. In this study, we developed low dielectric ink by mixing commercial PSR which protect PCB's circuits from external factors and PI with excellent thermal property and low-k characteristics. As a result, the ink mixture of PSR and PI 10:3 showed the best results, with a dielectric constant of about 2.6 and 2.37 at 20 GHz and 28 GHz, respectively, and dielectric dissipation was measured at about 0.022 and 0.016. In order to verify the applicability of future applications, various line-width transmission lines produced on Teflon were evaluated, and as a result, the loss of transmission lines using low dielectric ink mixed with PI was 0.12 dB less on average in S21 than when only PSR was used.