• ETRI Journal
• /
• v.33 no.6
• /
• pp.864-870
• /
• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.36 no.5
• /
• pp.482-487
• /
• 2023

A carbon-based hybrid resistor was fabricated using carbon nanotube (CNT) paste as an adhesive layer to establish electrically continuous ohmic contacts between CNT sheets and different CNT sheet or copper based metal alloy plates, and its electrical properties were evaluated. CNT sheets were fabricated using vacuum filtration with a CNT solution dispersed in isopropyl alcohol (IPA) solvent. The electrical characteristics of these carbon-based hybrid resistors were investigated. The CNT paste fulfilled the requirements for forming ohmic contacts between CNT sheets and metal alloy plates, which was attributed to the lowest work function difference and excellent wettability at the interface.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.1
• /
• pp.51-54
• /
• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• Restorative Dentistry and Endodontics
• /
• v.19 no.2
• /
• pp.513-533
• /
• 1994

The smooth surface after polishing of composite resin contributes to the patient's comfort, and appearance and longevity of the restoration. This study was performed for the quantitative analysis of the effects of the various finishing and polishing instruments on the surface roughness and reflectivity of the microfill, and hybrid composite resins. Cylindrical specimens 2mm thick and 10mm in diameter of Silux Plus, Durafill VS ; Z100, Prisma TPH, Brilliant, and Herculite XR composite resin were polymerized under the matrix strip. 18 specimens for each composite resin materials were divided into 6 groups ; 5 experimental groups were abraded with # 600 sand paper to remove resin-rich layer, except control. Thereafter, using diamond bur(Mani Dia-Burs), carbide bur(E. T. carbide set 4159), rubber point(Composite polishing kit), aluminum-oxide disk(Sof-Lex disk), polishing paste(Enhance system) ; each specimen was polished to its best achievable surface according to manufacturer's directions. Final polished surfaces were evaluated for the surface roughness with profilometer(${\alpha}$-step 200, Tencor instruments, USA) and for the reflectivity with image analyser(Omniment Image Analyser, Buehler, USA). The results were as follows. 1. Polishing paste or aluminum-oxide disk finish in the microfill, and hybrid composite resins was as smooth as matrix strip finish on the surface roughness test. 2. Polishing paste or aluminum-oxide disk finish in the microfill ; polishing paste finish in the hybrid composite resins was as reflective as matrix strip finish on the refectivity test. 3. For the polishing paste, there were no significant differences between the composite resin materials on the surface roughness and refectivity tests. 4. For the aluminum-oxide disk, the best result was obtained with the microfill composite resin on the surface roughness and reflectivity test. 5. Diamond bur, carbide bur, and rubber point were inappropriate for the final polishing instruments.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2005.11a
• /
• pp.57-60
• /
• 2005

Composite-to-aluminum joins were tested to get failure loads and modes for three types of joins; adhesive bonding, bolt fastening, and adhesive-bolt hybrid joining. Film type adhesive FM73 and paste type adhesive Cytec EA9394S were used for aluminum and composite bonding to make a double-lap joint. A digital microscope camcorder was used to monitor the failure initiation and propagation. It was found that the hybrid joining is an effective method to strengthen the joint when the mechanical fastening is stronger than the bonding as in the case of using the paste type adhesive. On the contrary, when the strength of the bolted joint is lower than the strength of the bonded joint as in the joint with the film type adhesive, the bolt joining contribute little to the hybrid joint strength.

• The Magazine of the IEIE
• /
• v.17 no.6
• /
• pp.53-60
• /
• 1990

본 글은 완성된 circuit를 thick-film hybrid IC화 하기 위하여 고려하여야 할 사항인 설계의 기본개념, 기판 재질의 소개 및 특성, 도체, 저항, 유전체 paste를 소개하고 제조 기술 분야에서는 기본공정인 인쇄, 소성, 트리밍, packaging에 대하여 기술하였다.

• Advances in concrete construction
• /
• v.8 no.3
• /
• pp.217-223
• /
• 2019

This paper presents the mechanical and microstructural properties of the geopolymer paste which was developed by utilizing the industrial by-products, rice husk ash (RHA) and ultra-fine slag. Ultra-fine slag particles with average particle size in the range of 4 to 5 microns. RHA is partially replaced with ultra-fine slag at different levels of 0 to 50%. Sodium silicate to sodium hydroxide ratio of 1.0 and alkaline liquid to binder (AL/B) ratio of 0.60 is taken. Setting time, compressive, flexural strengths were studied up to the age of 90 days with different concentrations of NaOH. The microstructure of the hybrid geopolymer paste was studied by performing the SEM, EDS, and XRD on the broken samples. RHA based geopolymer paste blended with ultrafine slag resulted in high compressive and flexural strengths and increased setting times of the paste. Strength increased with the increase in NaOH concentration at all ages. The ultra-small particles of the slag acted as a micro-filler into the paste and enhanced the properties by improving the CASH, NASH, and CSH. The maximum compressive strength of 70MPa was achieved at 30% slag content with 16M NaOH. The results of XRD, SEM, and EDS at 30% replacement of RHA with ultra-fine slag densified the paste microstructure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.25 no.7
• /
• pp.558-562
• /
• 2012

As an alternative energy, Dye-sensitized solar cells (DSSCs) have received much attention due to low cost manufacturing procedure and high energy consumption rate. Incorporating scattering centers in the nanocrystalline photoanode or additional scattering layers on the nanocrystalline photoanode is an effective way to enhance the light harvest efficiency of the photoanode and the performance of dye-sensitized solar cells (DSSCs). The light scattering abilities of these scattering layers also depend on the relative sizes and phase of the particles in the layers. A higher surface area is normally obtained using large particle sizes. Therefore, transparent high surface area $TiO_2$ layers and an additional scattering layer consisting of $TiO_2$-Rutile 500 nm paste with relatively larger particles are attractive. In this work, we investigates the applicability of a hybrid $TiO_2$ electrode (or a working electrode with a light scattering layer) in a DSSCs. We fabrication various thin film using $TiO_2$ paste 20 nm and $TiO_2$ paste 500 nm. As a result, the efficiency of the a single structure thin film was 3.35% and the efficiency as scattering layer of hybrid structure thin film was 4.36%, 4.73%.

• Journal of Welding and Joining
• /
• v.13 no.3
• /
• pp.55-64
• /
• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

• Journal of the Korean Ceramic Society
• /
• v.50 no.3
• /
• pp.238-243
• /
• 2013

We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.