• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.99-105
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• 2022

As the chip size gets smaller, the width of the electrode line is also fine, and the density of interconnections is increasing. As a result, RC delay is becoming a problem due to the difference in resistance between the capacitor layer and the electrical conductivity layer. To solve this problem, the development of electrodes with high electrical conductivity and dielectric materials with low dielectric constant is required. In this study, we developed low dielectric ink by mixing commercial PSR which protect PCB's circuits from external factors and PI with excellent thermal property and low-k characteristics. As a result, the ink mixture of PSR and PI 10:3 showed the best results, with a dielectric constant of about 2.6 and 2.37 at 20 GHz and 28 GHz, respectively, and dielectric dissipation was measured at about 0.022 and 0.016. In order to verify the applicability of future applications, various line-width transmission lines produced on Teflon were evaluated, and as a result, the loss of transmission lines using low dielectric ink mixed with PI was 0.12 dB less on average in S21 than when only PSR was used.

• Restorative Dentistry and Endodontics
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• v.36 no.6
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• pp.490-497
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• 2011

Objectives: This study examined the effect of the uncured dentin adhesives on the bond interface between the resin inlay and dentin. Materials and Methods: Dentin surface was exposed in 24 extracted human molars and the teeth were assigned to indirect and direct resin restoration group. For indirect resin groups, exposed dentin surfaces were temporized with provisional resin. The provisional restoration was removed after 1 wk and the teeth were divided further into 4 groups which used dentin adhesives (OptiBond FL, Kerr; One-Step, Bisco) with or without light-curing, respectively (Group OB-C, OB-NC, OS-C and OS-NC). Pre-fabricated resin blocks were cemented on the entire surfaces with resin cement. For the direct resin restoration groups, the dentin surfaces were treated with dentin adhesives (Group OB-D and OS-D), followed by restoring composite resin. After 24 hr, the teeth were assigned to microtensile bond strength (${\mu}TBS$) and confocal laser scanning microscopy (CLSM), respectively. Results: The indirect resin restoration groups showed a lower ${\mu}TBS$ than the direct resin restoration groups. The ${\mu}TBS$ values of the light cured dentin adhesive groups were higher than those of the uncured dentin adhesive groups (p < 0.05). CLSM analysis of the light cured dentin adhesive groups revealed definite and homogenous hybrid layers. However, the uncured dentin adhesive groups showed uncertain or even no hybrid layer. Conclusions: Light-curing of the dentin adhesive prior to the application of the cementing material in luting a resin inlay to dentin resulted in definite, homogenous hybrid layer formation, which may improve the bond strength.

• Composites Research
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• v.31 no.5
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• pp.177-185
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• 2018

Fiber metal laminate (FML) is a type of hybrid composites which consist of metallic and fiber-reinforced plastic sheets. As the FML has a drawback of the delamination that is a failure of the interfacial adhesive layer, the nominal stresses and the energy release rates should be determined to identify the delamination behavior. However, it is difficult to derive the nominal stresses and the energy release rates since the operating temperature of the equipment is restricted. For this reason, the objective of this paper is to predict the mode-I nominal stress and the mode-I energy release rate of the adhesive layer using the inverse analysis based on the Levenberg-Marquardt method. First, the mode-I nominal stress was assumed as the tensile strength of the adhesive layer, and the mode-I energy release rate was obtained from the double cantilever beam test. Next, the finite element method was applied to predict the mode-I delamination behavior. Finally, the mode-I nominal stress and the mode-I energy release rate were predicted by the inverse analysis. In addition, the convergence of the parameters was validated by trying to input two cases of the initial parameters. Consequently, it is noted that the inverse analysis can predict the mode-I delamination behavior, and the two input parameters were converged to similar values.

• Journal of the korean academy of Pediatric Dentistry
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• v.35 no.3
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• pp.456-468
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• 2008

This study was performed to evaluate the quality of newly offered dentin bonding system($AdheSE^{(R)}$ One) by comparing the degree of microleakage measured with those of several conventional adhesive materials(AQ Bond Plus and $Adper^{TM}$ Single Bond 2). The quality of hybrid layer and resin tags was analyzed by observing restoration/ tooth interface under SEM. All-in-one system is in the limelight for having advantage of reducing chair time of children with difficult behavior pattern. Therefore the possibility of clinical application of All-in-one system was evaluated. The results obtained are as follows; 1. At the enamel margin, group II(AQ Bond Plus) showed the highest value of microleakage, and the other groups showed decreased value in order of group III($AdheSE^{(R)}$ One) and I($Adper^{TM}$ Single Bond 2). There was statistically significant difference between group II and the others(p<0.05), and no statistical difference was found between group I and III. 2. At the dentin margin, microleakage value was increased in order of group II, I, III and significant difference between all groups(p<0.05). 3. In group I and III, microleakage value measured at the enamel margin was significantly lower than that seen at the dentin margin(p<0.05), and there was no statistical difference in group II. 4. Resin tags observed under SEM were very weak and tangled in group II and III while the strong and thick tags were observed in group I. In conclusion, careful case selection and accurate clinical application is recommended in using AQ Bond Plus and $AdheSE^{(R)}$ One, giving consideration of the results showing its higher microleakage and weaker strength than $Adper^{TM}$ Single Bond 2.