• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 춘계학술대회 논문집
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• pp.39-42
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• 2004

In the present paper, a novel systematic method using the 2-D hybrid special finite elements containing an edge crack is employed to study the fracture behaviors of laser beam spot-welds in automotive structures. 2-D hybrid special finite elements each containing an edge crack can assure the high precision especially in the vicinity of crack tips and give a better description of its singularity with only one hybrid element surrounding one crack. Therefore, the numerical modeling of the laser beam spot-welds can be greatly simplified. Some numerical examples are provided to demonstrate the validity and versatility of the proposed method. All the lap-shear, lap-tension and angle clip specimens are analyzed and some useful fracture parameters (such as stress intensity factors, the initial direction of crack growth) are obtained simultaneously.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 추계학술발표대회 개요집
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• pp.243-245
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• 2005

Recently many research are going on in the field of application of Laser-Arc hybrid welding for superstructures such as shop-structures, transport vehicles etc. However, the study on heat distribution and welding residual stress of hybrid weld by numerical simulation leaves much to be desired. Therefore in this study an optimized welding condition and numerical simulation for hybrid welding by using previous numerical analysis which is used to calculate the heat source for hybrid welding has been analyzed.

• 전자통신동향분석
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• 제35권4호
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Journal of Information Display
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• 제4권3호
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• pp.1-5
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• 2003

Laser-Induced Thermal Imaging (LITI) is a laser addressed patterning process and has unique advantages such as high-resolution patterning with over all position accuracy of the imaged stripes of within 2.5 micrometer and scalability to large-size mother glass. This accuracy is accomplished by real-time error correction and a high-resolution stage control system that includes laser interferometers. Here the new concept of hybrid system that complement the merits of small molecule and polymer to be used as an OLED; our system can realize easy processing of light emitting polymers and high luminance efficiency of small molecules. LITI process enables the stripes to be patlerned with excellent thickness uniformity and multi-stacking of various functional layers without having to use any type of fine metal shadow mask. In this study, we report a full-color hybrid OLED using the multi-layered structure consisting of small molecules and polymers.

• 한국광학회지
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• 제20권4호
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• pp.217-222
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• 2009

본 논문에서는 고굴절률차 폴리머 도파로를 이용하여 이중 링 공진기 가감필터(Add/Drop Filter) 반사기를 설계하고 제작하였다. 이 가감필터 반사기를 반사형 반도체 광 증폭기와 하이브리드 집적함으로써 저가형 파장가변 레이저를 제작하고 그 측정결과를 분석하였다. 이중 링 공진기 반사기는 서로 다른 반경을 가진 두 개의 링 공진기로 인하여 선택적인 반사 특성을 가지게 되며, 버니어 효과로 인하여 넓은 파장가변 특성을 가질 수 있다. 반사형 반도체 광 증폭기와 능동 정렬을 통하여 제작된 하이브리드 집적 파장가변 레이저는 26 dB의 부 모드 억제율과 0.03 nm의 선폭을 가지며 단일 모드로 발진하였다. 또한 25 mA의 전류를 이중 링 공진기 가감필터 반사기 상부에 형성된 전극에 인가하여 총 17 nm의 파장가변을 측정하였으며, 파장가변 과정에서 부 모드 억제율은 일정하게 유지됨을 확인하였다.

• 한국산학기술학회논문지
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• 제16권5호
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• pp.2979-2984
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• 2015

본 연구에서는 발포제를 이용하여 형성된 기공을 확대하는 방식의 공정으로써, 선택적 하이브리드 구조의 폴리머 필름의 제작을 위한 새로운 발포기술을 제시하였다. 기존의 발포제만을 이용한 폐쇄형 기공보다 큰 기공을 형성하기 위해서 PP에 발포제와 구리분말(Copper powder)을 혼합하여 만든 필름 내부에 355nm파장의 UV 펄스레이저를 이용하여 LAMO(Laser Aided Micro pore Opening) 공정 방식을 통한 기공의 크기를 확장하는 실험을 진행하였다. 그 결과 발포공정만 수행된 기공의 크기보다 추가적인 LAMO 공정을 통해 형성된 기공의 크기가 훨씬 더 크게 관찰되었다. 본 실험의 결과를 통해 LAMO 공정에 의한 기공의 특성과의 상관관계를 파악할 수 있었으며, 기존의 UV laser를 이용하여 원하는 부위에 선택적으로 폐쇄형 기공을 형성하는 것 이상으로 기공의 크기를 제어하는 방안을 제시하고자 한다.

• Journal of Welding and Joining
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• 제24권5호
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• pp.49-56
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• 2006

For laser welding in shipbuilding industry, gap bridging capability is one of the most important characteristics to achieve the high productivity and good weld quality. Recently, laser-GMA hybrid welding process is regarded as a distinctive method to overcome the tight gap tolerance with improving the productivity. In this study, the influence of process parameters on the bead formation was experimentally analyzed and the relationship between the process parameters and geometric imperfections was investigated. It was revealed that undercut, excessive weld metal, excessive penetration and incompletely filled groove were the major geometric imperfections. The optimized wire feeding and arc pressure were necessary to ensure the gap bridging ability. The approach to select the process parameters was conducted for butt welding with up to 2mm joint gap, in which the sound weld beads were generated without changing the welding speed.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.163-166
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• 2003

Laser-Induced Thermal Imaging (LITI) is a laser addressed patterning process and has unique advantages, such as high-resolution patterning with over-all position accuracy of the imaged stripes within 2.5 micrometer and scalability to large-size mother glass. This accuracy is accomplished using real-time error correction and a high -resolution stage control system that includes laser interferometers. Here the new concept of mixed hybrid system which complement the advantages of small molecular and polymeric materials for use as an OLED; our system can realize the easy processing of polymers and high luminance efficiency of recently developed small molecules. LITI process enables to pattern the stripes with excellent thickness uniformity and multi-stacking of various functional layers without using any type of fine metal shadow mask. In this study, we report a full-color hybrid OLED using the multi-layered structure of small molecular/polymeric species.

• Journal of Welding and Joining
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• 제28권3호
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• pp.42-48
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• 2010

Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) were welded by a combination of a diode laser and a CNC machining center. Laser beam delivered through the transparent PC and was absorbed in an opaque ABS. Polymers were melted and joined by absorbed and conducted heat. Experiments were carried out by varying working distance from 44mm to 50mm for the focus spot diameter control, laser input power from 10W to 25W, and scanning speed from 100 to 400mm/min. The weld bead and cross-section were analyzed for weld quality, and tensile results were presented through the joint force measurement. With focus distance at 48mm, laser power with 20W, and welding speed at 300mm/min, experimental results showed the best welding quality which bead size was measured to be 3.75mm. The shear strength at the given condition was $22.8N/mm^2$. Considering tensile strength of ABS is $43N/mm^2$, shear strength was sufficient to hold two materials. A single process was possible in a CNC machining system, surface processing, hole machining and welding. As a result, the process cycle time was reduced to 25%. Compared to a typical process, specimens were fabricated in a single process, with high precision.

• Restorative Dentistry and Endodontics
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• 제28권6호
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• pp.491-497
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• 2003

The purpose of this study was to evaluate the correlation between hybrid layer thickness and bond strength using confocal laser scanning microscope and microtensile bond strength test of two adhesive systems. The dentin surface of human molars. sectioned to remove the enamel from the occlusal surface. Either Scotchbond Multi-Purpose(3M Dental Product, St. Paul, MN, U.S.A) or Clearfil SE Bond (Kuraray, Osaka, Japan) was bonded to the surface. and covered with resin-composite. The resin-bonded teeth were serially sliced perpendicular to the adhesive interface to measure the hybrid layer thickness by confocal laser scanning microscope. The specimen were trimmed to give a bonded cross-sectional surface area of $1\textrm{mm}^2$, then the micro-tensile bone test was performed at a cross head speed of 1.0 mm/min. All fractured surfaces were also observed by stereomicroscope. There was no significant differences in bond strengths the materials(p>0.05). However. the hybrid layers of three-step dentin adhesive system, SM, had significantly thicker than self-etching adhesive system. CS(p<0.05). Pearson's correlation coefficient showed no correlation between hybrid layer thickness and bond strengths(p>0.05). Bond strengths of dentin adhesive systems were not dependent on the thickness of hybrid layer.