• Title/Summary/Keyword: Hybrid Laser

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Hybrid (CNC+Laser) process for polymer welding (하이브리드 방식 (CNC+Laser)을 이용한 폴리머용접공정)

  • Yoo, Jong-Gi;Lee, Choon-Woo;Kim, Soon-Dong;Choi, Hae-Woon;Shin, Hyun-Myung
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.4-4
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    • 2009
  • Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) was welded through a combination of a diode laser and CNC. Laser beam passed the transparent PC and was absorbed in an opaque ABS. Polymers were melted and welded by absorbed and conducted heat. Experiments were carried out by varying working distance from 44mm to 50mm for the focus spot diameter control, laser input power from 10W to 25W, and scanning speed from 100 to 400mm/min. The weld bead size and the specimen cross-section were analyzed, and tensile results were presented through the joint force measurement. With focus distance at 48mm, laser power with 20W, and welding speed at 300mm/min, experimental results showed the best welding quality which bead size was 3.75mm and the shear strength was $22.8N/mm^2$. Considering tensile strength of ABS is $43N/mm^2$, shear strength was sufficient to hold two materials. A single process was possible in CNC machining processes, surface processing, hole machining and welding. As a result, the process cycle time was reduced to 25%. Compared to a typical process, specimens were fabricated in a single process, with high precision. By combining two operations processes developed process gained 50% more efficiency.

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Fabrication of Laser Diodes using Beam-Lead and its thermal characteristics (Beam-Lead를 이용한 Laser Diode의 제작과 열저항 특성)

  • 조성대
    • Proceedings of the Optical Society of Korea Conference
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    • 1990.02a
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    • pp.69-72
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    • 1990
  • For the effective heat transfering in Lser Diodes, Beam-Lead structure were introduced which is applicable to hybrid Optoelectronic Integrated Circuits. A 5-layer planar structure Laser Diode is fabricated and Beam-Lead is made by Au plating. And carrier was made by etching Si substrate and LD was mounted on a carrier. The thermal resistance was measured and we could certain that Beam-Lead structure behaves well as a heat sink.

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