• 제목/요약/키워드: Hump

검색결과 154건 처리시간 0.027초

STI 구조에서 발생하는 MOSFET Hump 특성에 관한 연구 (A Study On MOSFET Hump Characteristics with STI Structures)

  • 이용희;정상범;이천희
    • 한국정보과학회:학술대회논문집
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    • 한국정보과학회 1998년도 가을 학술발표논문집 Vol.25 No.2 (2)
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    • pp.674-676
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    • 1998
  • 소자가 sub-quarter um급으로 축소됨에 따라 STI(Shallow Trench Isolation) 기술은 고 집적도의 ULSI 구현에 있어서 중요한 격리 방법으로 많이 사용되고 있다. 현재의 STI 기술은 주로 실리콘 기판을 식각 후 절연물질로 빈 공백이 없이 채우는 (void-free gap filling) 방법 [1,2]과 절연물질을 다시 표면 근처까지 CMP(Chemical Mechnical Polishing)로 etchback하여 평탄화를 하는 방법이 주요한 기술이 되고 있다. 또한 STI 구조로된 격리구조에서 만들어진 MOSFET의 전기적인 특성은 트랜치 격리의 상부 부분의 형태와 gap-filling 물질에 따라 큰 영향을 받게된다. 따라서 본 논문에서는 STI 구조로 만들어진 격리 구조에서 MOSFET의 hump 특성에 관해 연구하였다. 그 결과 hump는 STI 모서리에서 필드 옥사이드의 recess에 의한 모서리 부분에서의 전계 집중과 boron의 segration에 기인한 농도 감소로 인해 hump가 발생하는 것으로 나타났다.

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과속방지턱의 설치효과 분석 및 수직가속도에 의한 개발 연구 (A Study on the Installation Effect Analysis and for Future Develop with Vertical Acceleration of Speed Hump)

  • 금기정
    • 대한교통학회지
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    • 제14권4호
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    • pp.77-90
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    • 1996
  • Recently existing the road traffic low is requlated by hump standard, which is established throuth the actual england TRRL(Transpodt and Road Research Laboratory) experiment. The determined standard has been utilized, however, wihtout the test on of our street and its drivers driving characteristics. Even with the utilization, the appropriate before and after management, is not constituted. In Spite of minimum speed limit, in many case, the utilization itself is questionalble rather than the purpose of restraining speed limit or reducing vehicle confacts. Along with hump consideration, social attention is focused due to series of personal law suit(traffic accident) field against the negligence of local organization management. Therefore counter measure of safe transportation facility is urgently required. With consideration of above background, the purpose of this research is to develop the hump that is appropriate with our transportation environment. This can be achieved thr ugh analysis of hump effectiveness, examination of drivers awamess, facilitation/management problems, and various problems in verticle acceleration.

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STI 채널 모서리에서 발생하는 MOSFET의 험프 특성 (The MOSFET Hump Characteristics Occurring at STI Channel Edge)

  • 김현호;이천희
    • 한국시뮬레이션학회논문지
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    • 제11권1호
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    • pp.23-30
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    • 2002
  • An STI(Shallow Trench Isolation) by using a CMP(Chemical Mechanical Polishing) process has been one of the key issues in the device isolation[1] In this paper we fabricated N, P-MOSFEET tall analyse hump characteristics in various rounding oxdation thickness(ex : Skip, 500, 800, 1000$\AA$). As a result we found that hump occurred at STI channel edge region by field oxide recess. and boron segregation(early turn on due to boron segregatiorn at channel edge). Therefore we improved that hump occurrence by increased oxidation thickness, and control field oxide recess( 20nm), wet oxidation etch time(19HF,30sec), STI nitride wet cleaning time(99HF, 60sec+P 90min) and fate pre-oxidation cleaning time (U10min+19HF, 60sec) to prevent hump occurring at STI channel edge.

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RANS 모델링을 이용한 Hump 형상의 박리 유동에 대한 연구 (THE STUDY ON THE SEPARATED FLOW OF A HUMP USING RANSMODELING)

  • 이재훈;배중헌;정경진
    • 한국전산유체공학회지
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    • 제22권1호
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    • pp.8-14
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    • 2017
  • In this paper, separated flow characteristics is studied using the RANS(Reynold-averaged Navier-Stokes) modeling. The analysis is performed for the NASA's hump configuration which is the combination of a flat plate and a hump. This configuration was used in NASA's flow control workshop and it was one of validation cases for RANS and LES simulations. The separation occurs at the 65% of model length where a slot is positioned for the flow control. No flow control case and steady suction case are studied using RANS modeling. The Spalart-Allmaras model and the SST(Shear Stress Transport) model are applied and their accuracy are compared. To correlate CFD analysis with experimental data, the optimal boundary condition was investigated and the effect of a cavity around the slot is studied for the no flow case.

4WD용 비스코스 커플링 정상상태 특성 해석 (Analysis of 4WD Viscous Coupling Characteristics at Steady State)

  • 이정석;김경하;김현진;김현수
    • 한국자동차공학회논문집
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    • 제6권2호
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    • pp.21-31
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    • 1998
  • In this paper, a thermo-mechanical model for viscous coupling(VC) was suggested and torque equation in viscous mode was derived considering the effects of geometry of the plates, thermo-mechanical dynamics, silicon oil characteristics and dissolved air characteristics in the silicon oil. Theoretical results were in good accordance with experimental results demonstrating that VC thermo-mechanical model and the theoretical equations, response of the torque transmitted, pressure, temperature and time to the hump were investigated. Simulation results showed that filling rate of the silicon oil plays an integral role not only in the steady state torque characteristics but also in determining the time to hump.

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다기준의사결정론을 적용한 자전거 과속방지턱 설계기법 연구 (Methodology for Designing Bicycle Speed Hump Using Multi-critiria Decision Making Process)

  • 주신혜;오철;최희용;장지용
    • 한국도로학회논문집
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    • 제14권4호
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    • pp.103-111
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    • 2012
  • PURPOSES : Effective speed management is necessary for preventing traffic crashes on the road. Speed hump is known as an effective tool for managing speed. Unlike existing studies which are mainly focused on humps for vehicles, this study proposed a novel method to determine design parameters for bicycle speed humps based on a multi-criteria decision making process. METHODS : Three objectives including the effectiveness of speed reduction, bicycle safety, and user's comfortability were incorporated into the proposed evaluation framework for determining design parameters. A multi-criteria value function was also derived and utilized as a part of the proposed method. RESULTS : Extensive simulations and statistical tests show that an integrated bike-box way is identified as the best in terms of operational efficiency and safety. CONCLUSIONS : It is expected that the outcomes of this study can be a valuable precursor for developing design guidelines for bicycle road and facility.

AC PDP에서 다양한 형태의 ${\prod}$형 금속방전유지 전극의 효과 (Effect of Various ${\prod}$Type Metal Electrode in the AC PDP)

  • 유수복
    • 전기학회논문지
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    • 제58권3호
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    • pp.586-590
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    • 2009
  • Recently, an AC Plasma Display Panels(PDP) with the metal sustain electrodes have been reported in order to reduce the manufacturing cost of the AC PDP. However, the luminance and efficacy of the AC PDP with metal electrodes are worse than those of the AC PDP with ITO electrodes. In this paper, various ${\prod}$type metal electrodes are suggested, in order to improve the electro-optical characteristics of the AC PDP with metal electrodes. Among the suggested electrode types, luminance of Hump electrode structure is higher by $40\;cd/m^2$ and discharge current of Asymmetry electrode structure is lower by 5% than those of Pi electrode structure, respectively. Moreover, $T_1$ of Hump electrode structure is reduced to 10% as compared with Pi electrode structure in address period for ADS driving scheme. In all aspects, the characteristics of Hump and Asymmetry electrode structure show best performance.

MOSFET의 험프 특성에 관한 연구 (A Study on the Hump Characteristics of the MOSFETs)

  • 김현호;이용희;이재영;이천희
    • 한국정보처리학회:학술대회논문집
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    • 한국정보처리학회 2002년도 춘계학술발표논문집 (상)
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    • pp.631-634
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    • 2002
  • In this paper we improved that hump occurrence by increased oxidation thickness, and control field oxide recess$(\leq20nm)$, wet oxidation etch time(19HF, 30sec), STI nitride wet cleaning time(99 HF, 60sec + P 90min) and gate pre-oxidation cleaning time(U10min+19HF, 60sec) to prevent hump occurring at STI channel edge.

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Copper CMP에서 Electrochemical Plating 두께에 따른 Defect 특성 연구 (Study of defect characteristics by electrochemical plating thickness in copper CMP)

  • 김태건;김남훈;김상용;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.125-126
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    • 2005
  • Recently semiconductor devices are required more smaller scale and more powerful performance. For smaller scale of device, multilayer structure is proposed. And, for the higher performance, interconnection material is change to copper, because copper has high EM(Electro-migration)and low resistivity. Then copper CMP process is a great role in a multilayer formation of semiconductor. Copper process is different from aluminum process. ECP process is one of the copper processes. In this paper, we focused on the defects tendency by copper thickness which filled using ECP process. we observed hump high and dishing. Conclusively, hump hight reduced at copper thickness increased Also dishing reduced.

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A STANDARD METHOD FOR JOINTING CAMEL CARCASSES WITH REFERENCE TO THE EFFECT OF SLAUGHTER AGE ON CARCASS CHARACTERISTICS IN NAJDI CAMELS. 3. PARTITION AND DISTRIBUTION OF CARCASS FAT

  • Abouheif, M.A.;Basmaeil, S.M.;Bakkar, M.N.
    • Asian-Australasian Journal of Animal Sciences
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    • 제4권3호
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    • pp.219-225
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    • 1991
  • The influence of age on the relative growth patterns of subcutaneous, intermuscular, intramuscular, perirenal, channel and hump fat in relation to the total fat weight in carcass sides of 18 Najdi male camels averaging 8, 16 and 26 months of age has been investigated. The total fat weight in a carcass side increased (p<.01) from 17.3% to 27.1% as the camel age increased from 8 to 26 months. However, at all ages studied, intermuscular fat weight was the largest fat depot, followed, in order, by subcutaneous and intramuscular fat. The change in weight of the intramuscular, intermuscular and subcutaneous fat between 8 and 26 months of age was greater, reaching 6.7, 4.3 and 4 times respectively, than the hump, channel and perirenal fat weight which increased by 3.6, 2.5 and 2.3 times, respectively. The allometric growth coefficient (${\beta}$) for intramuscular fat in relation to the total carcass fat weight was the highest, followed, in order, by intermuscular, subcutaneous, hump, channel and perirenal fat.