• 한국산업융합학회 논문집
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• 제23권6_2호
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• pp.1059-1065
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• 2020

Demand for pressure sensors is increasing in various fields such as machinery, healthcare and medical care. A recent study is being conducted to create sensors that are more sensitive and have longer linear sections based on measurement principles. In this paper, a film-type sensor with a membrane structure was developed to measure the pressure distributed in the axial direction of a hot roll laminator. Performance of sensors was evaluated by resistance and durability according to membrane diameter. The resistance of the membrane sensor varies according to the contact state and contact area of the electrode. Therefore, the membrane diameter selection is important. Experiments showed the most pronounced variation in resistance under pressure at 8 mm in diameter of membrane. Reliability evaluation of sensors was carried out at room temperature and high temperature. The pressure on the sensor was pressurized 1000 times to measure the initial resistance and the resistance after the evaluation to analyze the change. Sensors showed stable results with low resistance changes of 5.15% and 6.27%, respectively. A large area sensor manufactured using the developed sensor also showed reliable results.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.21-28
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• 2004

Polytetrafluoroethylene (PTFE/Teflon ) 인쇄회로기판용 미세 피치 솔더 범프 형성을 위해 dry film photoresist (DFR)를 photolithography 공정에 적용하였다. DFR lamination을 위한 test board는 폭 100$\mu\textrm{m}$와 두께 18$\mu\textrm{m}$의 copper line들이 100-200$\mu\textrm{m}$의 간격으로 배열된 형태로 디자인하였다. 15$\mu\textrm{m}$의 두께를 갖는 DFR을 hot roll laminator를 사용하여 lamination 온도와 속도를 변화시켜가면서 lamination 공정 실험을 수행하였다. 실험 결과, PTFE 인쇄회로기판에 DFR을 lamination하는 공정의 최적 조건은 lamination 온도 $150^{\circ}C$, 속도 약 0.63cm/s였다. UV exposure 및 development 공정을 거쳐 저융점 솔더 재료인 인듐을 증착하였다. DFR 박리 순서에 따른 두 가지 다른 reflow 공정을 통해 최소 지름 50$\mu\textrm{m}$, 최소 피치 100$\mu\textrm{m}$를 갖는 인듐 솔더 범프를 형성하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.