• Journal of the Korean Society of Industry Convergence
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• v.23 no.6_2
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• pp.1059-1065
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• 2020

Demand for pressure sensors is increasing in various fields such as machinery, healthcare and medical care. A recent study is being conducted to create sensors that are more sensitive and have longer linear sections based on measurement principles. In this paper, a film-type sensor with a membrane structure was developed to measure the pressure distributed in the axial direction of a hot roll laminator. Performance of sensors was evaluated by resistance and durability according to membrane diameter. The resistance of the membrane sensor varies according to the contact state and contact area of the electrode. Therefore, the membrane diameter selection is important. Experiments showed the most pronounced variation in resistance under pressure at 8 mm in diameter of membrane. Reliability evaluation of sensors was carried out at room temperature and high temperature. The pressure on the sensor was pressurized 1000 times to measure the initial resistance and the resistance after the evaluation to analyze the change. Sensors showed stable results with low resistance changes of 5.15% and 6.27%, respectively. A large area sensor manufactured using the developed sensor also showed reliable results.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.169-173
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• 2003

We demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon) printed circuit board (PCB). The copper lines were formed with $100\;{\mu}m$ width and $18\;{\mu}m$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of $100-200\;{\mu}m$. The DFRs of $15\;{\mu}m$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100^{\circ}C\;to\;150^{\circ}C$ and laminating speed. We found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63 cm/s. And the smallest size of indium solder bump was diameter of $50\;{\mu}m$ with pitch of $100\;{\mu}m$.