• 제목/요약/키워드: Hot carrier

검색결과 284건 처리시간 0.039초

게이트-드레인 용량측정에 의한 수평농도 분포추출

  • 허성희;한철희
    • 전기의세계
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    • 제39권12호
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    • pp.63-67
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    • 1990
  • MOSFET의 드레인 불순물 농도 분포는 hot carrier효과 및 드레인 누설전류 특성에서 중요한 요소가 된다. 특히 MOSFET의 게이트 아래 부분의 수평 농도는 게이트 전압에 의한 누설전류 특성에 큰 영향을 주는 것으로 알려져 있다.[1][2]. 보통의 수직농도분포는 SIMS기법, ARS 방법등을 이용하여 측정이 가능하다. 그러나, 수평 불순물 농도분포는 실험적으로 구하는 방법이 없었고 보통 이차원 공정 시뮬레이션(MINIMOS, SUPRA등)을 통하여 산출하였다. 최근 드레인의 수평 불순물 농도분포를 게이트와 드레인 사이의 용량 측정에 의해 구하는 방법이 제시되었다[3]. 이방법에서는 농도가 높은 경우에는 수평접합깊이를 절대적인 값으로 구하지 못하였다. 본 논문에서는 게이트-드레인간 용량 측정에 의해 수평접합깊이를 구하고 그 농도분포를 추출하는 방법을 제시하고, ASR방법에 의해 측정된 수직 불순물 농도분포와 비교하고 검토한다.

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이종접합 태양전지용 p a-Si:H 에미터 층 최적화 및 태양전지 특성 거동 연구

  • 김경민;정대영;송준용;박주형;오병성;송진수;이정철
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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    • pp.129.2-129.2
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    • 2011
  • 본 연구에서는 a-Si:H/c-si 구조의 이종접합 태양전지의 p a-Si:H 에미터 층의 박막 조건에 따라 태양전지 특성을 연구하였다. p, n-layer는 PECVD (Plasma-enhanced chemical vapor deposition) i-layer는 HWCVD(Hot wire chemical vapor deposition), ITO는 RF 마그네트론 스퍼터링법으로 제작하였다. p-layer의 도핑 농도, 기판 증착 온도, 증착 높낮이에 따라 특성을 비교 분석 하였다. QSSPC로 minority carrier life time, 자외 가시선 분광분석 장치로 투과 반사도를, Ellipsometer로 흡수 계수, 두께, FTIR로 막의 구성요소 등의 변화를 조사하여 개선된 p a-Si:H의 특성이 이종접합 태양전지에서 효율향상에 영향을 주는지 Photo IV와 EQE를 통하여 조사하였다.

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Degradation of High Performance Short Channel N-type Poly-Si TFT under the Electrical Bias Caused by Self-Heating

  • Choi, Sung-Hwan;Song, In-Hyuk;Shin, Hee-Sun;Park, Sang-Geun;Han, Min-Koo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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    • pp.1301-1304
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    • 2007
  • We have investigated degradation of short channel n-type poly-Si TFTs with LDD under high gate and drain voltage stress due to self-heating. We have found that the threshold voltage of short channel TFT is shifted to negative direction on the selfheating stress, whereas the threshold voltage of long channel is moved to positive direction.

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Offset 구조 Poly-Si TFT의 Negative Bias Stress 효과 (Negative Bias Stress Effect with Offset Structure in Poly-Si TFT's)

  • 이제혁;변문기;임동규;조봉희;김영호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1998년도 추계학술대회 논문집
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    • pp.141-144
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    • 1998
  • The electrical characteristics of poly-Si TFT's with offset structure by negative bias stress are systematically investigated as a function of offset length. The changes of electrical characteristics, V$\_$th/, off-current, on/off ratio, in the offset structured poly-Si TFT's are smaller than that of the conventional structured poly-Si TFT's under the stress condition (V$\_$ds/=20V, V$\_$gs/=-20V). It is found that the hot carrier effect by negative bias stress is suppressed by the offset structured poly-Si TFT's because the local electric field near the drain region is decreased by offset region.

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Electrical Stress in High Permittivity TiO2 Gate Dielectric MOSFETs

  • Kim, Hyeon-Seag;S. A. Campbell;D. C. Gilmer
    • E2M - 전기 전자와 첨단 소재
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    • 제11권10호
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    • pp.94-99
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    • 1998
  • Suitable replacement materials for ultrathin SiO2 in deeply scaled MOSFETs such as lattice polarizable films, which have much higherpermittivities than SiO2, have bandgaps of only 3.0 to 4.0 eV. Due to these small bandgaps, the reliability of these films as a gate insulator is a serious concern. Ramped voltage, time dependent dielectric breakdown, and hot carrier effect measurements were done on 190 layers of TiO2 which were deposited through the metal-organic chemical vapor deposition of titanium tetrakis-isopropoxide (TTIP). Measurements of the high and low frequency capacitance indicate that virtually no interface state are created during constant current injection stress. The increase in leakage upon electrical stress suggests that uncharged, near-interface states may be created in the TiO2 film near the SiO2 interfacial layer that allow a tunneling current component at low bias.

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Application of Diameter Controlled ZnO Nanowire Field Effect Transistors

  • 이상렬
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 춘계학술발표대회
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    • pp.19.2-19.2
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    • 2011
  • ZnO nanowires have been fabricated by vapor-liquid-solidification with hot-walled pulsed laser deposition method. The diameter of ZnO nanowire has been systematically controlled simply by changing the thickness of Au catalyst. Field effect transistors with different diameter have been fabricated by using photolithography and e-beam lithography. The threshold voltage of ZnO nanowire FET showed enhanced mode and depleted mode depending on the diameter of ZnO nanowires. This is mainly due to the change of the carrier concentration depending on the size of nanowires. We have fabricated ZnO nanowire inverters using nanowire FETs. This simple method to fabricate ZnO nano-inverter will be useful to open the possibility of ZnO nanoelectronic applications.

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HWE 방법으로 성장한 ZnSe:Cl 박막의 특성 (Characteristics of Cl-doped ZnSe epilayers grown by hot wall epitaxy)

  • 이경준;전경남;강한솔;정원기;두하영;이춘호
    • 한국결정성장학회지
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    • 제7권2호
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    • pp.271-275
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    • 1997
  • HWE방법으로 GaAs 기관위에 Cl이 첨가된 ZnSe 박막을 성장하였다. 성장된 박막의 표면 상태는 경면이 있었으며 좋은 결정성과 낮은 비저항 n 형 전도성을 나타내었다. 성장된 박막의 운반자 농도는 $10^{16}Cm{-3}$ 정도였으며 비저항값은 10$\\Omega$\cdotcm였다. 실온에서 청색 발광을 하는 photoluminescence를 나타내었다. 나타내었다.

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게이트와 드리프트 영역 오버랩 길이에 따른 LDMOST 전력 소자의 전기적 특성 (Electrical Characteristics of LOMOST under Various Overlap Lengths between Gate and Drift Region)

  • 하종봉;나기열;조경록;김영석
    • 한국전기전자재료학회논문지
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    • 제18권7호
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    • pp.667-674
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    • 2005
  • In this paper the gate overlap length of the LDMOST is optimized for obtaining longer device lifetime. The LDMOSI device with drift region is fabricated using the $0.25\;{\mu}m$ CMOS Process. The gate overlap lengths on drift region are $0.1\;{\mu}m,\;0.4\;{\mu}m\;0.8\;{\mu}m\;and\;1.1\;{\mu}m$, respectively. The breakdown voltages, on-resistances and hot-carrier degradations of the fabricated LDMOST devices are characterized. The LDMOST device with gate overlap length of $0.4\;{\mu}m$ showed the longest on-resistance lifetime, 0.02 years and breakdown voltage of 22 V and on-resistance of $23\;m\Omega{\cdot}mm^2$.

저온 다결정 실리콘 박막 트랜지스터의 신뢰도 향상을 위한 Counter-doped Lateral Body Terminal (CLBT) 구조 (Reliability of Low Temperature Poly-Si TFT employing Counter-doped Lateral Body Terminal)

  • 김재신;유준석;김천홍;이민철;한민구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 C
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    • pp.1442-1444
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    • 2001
  • A new low-temperature poly-Si TFT employing a counter-doped lateral body terminal is proposed and fabricated, in order to enhance the stability of poly-Si TFT driving circuits. The LBT structure effectively suppresses the kink effect by collecting the counter-polarity carriers and suppresses the hot carrier effect by reducing the peak lateral field at the drain junction. The proposed device is immune to dynamic stress, so that it is suitable for low voltage and high speed driving circuits of AMLCD.

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Polysilicon Thin Film Transistor for Improving Reliability using by LDD Structure

  • Jung, Eun-Sik;Jang, Won-Su;Bea, Ji-Chel;Lee, Young-Jae
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2002년도 ITC-CSCC -2
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    • pp.1050-1053
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    • 2002
  • In this paper, Amorphous silicon on glass substrate was recrystallized to poly-crystalline silicon by solid phase crystallization (SPC) technology. The active region of thin film transistor (TFT) was fabricated by amorphous silicon. The output and transfer characteristics of thin film transistor with lightly doped drain (LDD) structure was measured and analyzed. As a results, analyzed TFTs reliability with LDD's length by various kinds argument such as sub-threshold swing coefficient, mobility and threshold voltages were evaluated. Stress effects in TFT were able to improve to the characteristics of turn-on current and hot carrier effects by LDD's length variations.

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