• Title/Summary/Keyword: Hot Spot Cooling

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An Experimental Investigation of Jet Impingement Cooling Using the Vortex Tube (보텍스튜브를 이용한 충돌냉각의 실험적 연구)

  • Shin, Woon-Chul;Kim, Chang-Soo;Bae, Shin-Chul
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.31 no.1 s.256
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    • pp.8-15
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    • 2007
  • The jet impingement cooling characteristics are investigated experimentally. The study is motivated by the potential application of local hot spot cooling by means of the vortex tube. The purposes of this research are to examine the effect of the nozzle-block spacing and flow rate. The results of jet through vortex tube is compared with ones of circular Jet. Flow visualization by the smoke-wire technique is also performed to investigate the flow structure. As the nozzle-block spacing is increased and flow rate decreased, the cooling effect of the Jet through the vortex tube decreases mere remarkably than that of the circular jet. So the cooling effect for the jet through the vortex tube is higher than that for the circular jet at $H/D{\leq}3$, $Q{\geq}10m^3/h$.

A Study on Spot-Welding Characteristics and Material Analysis of Boron Steel for Hot-Stamping under Different Heat-Treatment Conditions (핫스탬핑용 보론 강판의 열처리 조건에 따른 재질분석 및 점용접 특성 연구)

  • Je, Hwan-Il;Son, Chang-Suk;Nam, Ki-Woo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.4
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    • pp.383-391
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    • 2011
  • The hot-stamping technique is used to manufacture high-strength parts by press forming by heating at a temperature above the Austenite transformation temperature and then rapid cooling. Boron steel, which contains a very small amount of boron, is one of the materials used for hot stamping. The purpose of this study is to show the microstructures and to investigate the mechanical properties under different heat-treatment conditions. The heat treatment of water quenching was conducted at the various temperatures and different elapsed times. These can be practical data useful when boron steels are used for hot stamping. Furthermore, the microstructures and mechanical properties of the spot-welded specimen with coatings and counterpart materials (SPRC 340, SPRC 590) is investigated in order to determine the welding characteristics of boron steel at different welding condition.

A PARAMETRIC STUDY OF CONICAL FRUSTUM GEOMETRY FOR IMPROVEMENT OF COOLING PERFORMANCE OF VORTEX TUBE (Vortex Tube 성능 개선을 위한 절두체의 형상 매개변수에 대한 연구)

  • Koo, H.B.;Park, J.Y.;Sohn, D.Y.;Choi, Y.H.
    • Journal of computational fluids engineering
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    • v.20 no.4
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    • pp.7-13
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    • 2015
  • Vortex tube is a thermal static device that separates compressed air into hot and cold streams. In general, the cooling efficiency of vortex tubes is lower than that of traditional air conditioning equipment and vortex tubes are mainly used for industrial spot cooling applications because of their quick responses. In this study, conical frustums are employed in the nozzle chamber to improve the cooling performance. Conical frustums can be used to decrease the ineffective mass fraction that directly passes through the cold exit without energy separation. The shape optimization of conical frustums has been performed using full factorial design. It is found that the height of frustums has the largest main effects on the cooling performance. Computational results show that the cooling performance can be increased by about 10% within the considered range of the design parameters. This is because the ineffective mass fraction toward the cold exit is decreased by about 20%.

A Study on Annealing Cycle Control Temperature of Hi - CON/2 BAF and HNx BAF (Hi-CON/H2 BAF와 HNx BAF의 소둔사이클 제어온도에 관한 연구)

  • 김문경
    • Journal of Advanced Marine Engineering and Technology
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    • v.18 no.1
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    • pp.114-122
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    • 1994
  • A cold temperature control system for the BAF(batch annealing furnace) has been established in order to reduce energy consumption to imrpove productivity and stabilize the properties of products. Therefore we confirmed a relation between annealing cycle time and atmospheric gas, changing annealing cycle time according to BAF temperature with time during heating and actual temperature measurements cold spot during soaking. The results of the temperature variation effect on the batch annealing are as follows. 1) Cooling rate is increasing gradually with increasing atmospheric gas flow, but heating rate is hardly increasing without atmospheric gas component. Heating time is reduced to one half with increasing atmospheric gas flow rate and changing of atmospheric gas component from HNx to Ax gas and annealing cycle time is reduce to 2.7 times. 2) With enlarging the difference between furnace temperature and soaking temperature at the HNx BAF, heating time becomes short, but cooling time is indifferent. 3) If temperature difference of 300.deg. C in the temperature change of cold spot according to the annealing cycle control temperature, Hi-CON/H2BAF is interchanging at each other at 26hours, but HNxBAF at 50 hours. 4) Soaking time at batch annealing cycle determination is made a decision by the input coil width, and soaking time for quality homogenization of 1219 mm width coil must be 2.5 hours longer then that of 914mm width coil for the same coil weight at Hi-CON/H2BAF. But, it is necessary to make 2 hours longer at HNxBAF.

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Thermal Management for Multi-core Processor and Prototyping Thermal-aware Task Scheduler (멀티 코어 프로세서의 온도관리를 위한 방안 연구 및 열-인식 태스크 스케줄링)

  • Choi, Jeong-Hwan
    • Journal of KIISE:Computer Systems and Theory
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    • v.35 no.7
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    • pp.354-360
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    • 2008
  • Power-related issues have become important considerations in current generation microprocessor design. One of these issues is that of elevated on-chip temperatures. This has an adverse effect on cooling cost and, if not addressed suitably, on chip reliability. In this paper we investigate the general trade-offs between temporal and spatial hot spot mitigation schemes and thermal time constants, workload variations and microprocessor power distributions. By leveraging spatial and temporal heat slacks, our schemes enable lowering of on-chip unit temperatures by changing the workload in a timely manner with Operating System (OS) and existing hardware support.

Rapid cooling of injection mold for high-curvature parts using CO2 cooling module (CO2 냉각모듈을 적용한 고곡률 성형품의 사출금형 급속냉각)

  • Se-Ho Lee;Ho-Sang Lee
    • Design & Manufacturing
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    • v.16 no.4
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    • pp.67-74
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    • 2022
  • Injection molding is a cyclic process comprising of cooling phase as the largest part of this cycle. Providing efficient cooling in lesser cycle times is of significant importance in the molding industry. Recently, lots of researches have been done for rapid cooling of a hot-spot area using CO2 in injection molding. The CO2 flows under high pressure through small, flexible capillary tubes to the point of use, where it expands to create a snow and gas mixture at a temperature of -79℃. The gaseous CO2 removes heat from the mold and releases it into the atmosphere. In this paper, a CO2 cooling module was applied to an injection mold in order to cool a large area cavity uniformly and quickly, and the cooling performance of the injection mold was investigated. The product was a high-curvature molded part with a molding area of 300x100mm. Heat cartridges were installed in a stationary mold, and CO2 cooling module was inserted inside a movable mold. Through structural analysis, it was confirmed that the maximum deformation of mold with CO2 cooling module was 0.09mm. A CO2 feed system with a heat exchanger was used for cooling experiments. The CO2 was injected into the holes on both sides of the supply pipe of the cooling module and discharged through hexagon blocks to cool the mold. It took 5.8 seconds to cool the mold from an average temperature of 140℃ to 70℃. Through the experiment using CO2 cooling module, it was found that a cooling rate of up to 12.98℃/s and an average of 10.18℃/s could be achieved.

Heat Dissipation Trends in Semiconductors and Electronic Packaging (반도체 및 전자패키지의 방열기술 동향)

  • S.H. Moon;K.S. Choi;Y.S. Eom;H.G. Yun;J.H. Joo;G.M. Choi;J.H. Shin
    • Electronics and Telecommunications Trends
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    • v.38 no.6
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    • pp.41-51
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    • 2023
  • Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

Root cause analysis of sticking in hydraulically actuated multi-disc friction clutch for ship propulsion (선박 추진용 유압작동식 다판 마찰클러치 고착현상 고장탐구)

  • Jeong, Sang-Hu;Kim, Jeong-Ryeol;Shin, Jae-Won
    • Journal of Advanced Marine Engineering and Technology
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    • v.41 no.4
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    • pp.330-336
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    • 2017
  • This study performs a root cause analysis of the sticking that occurs in the hydraulically actuated wet type multi-disc friction clutch in a ship's diesel engine propulsion system that uses rubber elastic coupling. The fishbone method was used to study the sticking through dismantling investigation of the reduction gear and clutch, investigation of the components, and onboard system tests including nondestructive testing. The friction plate sticking is caused by the slip due to friction heat resulting from the leakage of control oil through cracks in the assembled hollow shaft. The friction plate cooling oil also leaks simultaneously through the crack, and partial sticking occurs due to the hot spots in the friction plates. These are caused by insufficient amount of cooling oil due to oil leakage.

Characteristic Analysis of Hot Spot Temperature according to Cooling Performance Variation of Natural Ester Transformer (식물성 절연유 변압기의 냉각특성 변화에 따른 최고점온도 특성 해석)

  • Kim, Ji-Ho;Lee, Hyang-Beom
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.64 no.4
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    • pp.236-240
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    • 2015
  • Natural ester has a higher biodegradability, flash and fire points, and a greater permittivity compared to conventional mineral oils. However, natural ester also has a higher pour point, viscosity, and water content. These characteristics hamper circulation and the electrical properties of oil-filled transformer. Thus, this paper applied electromagnetic-thermal-flow coupled analysis method to predict temperature distribution inside 154kV single phase power transformer using natural ester. It modeled in the actual appearance for the tank and winding of the power transformer to improve the accuracy of analysis and applied heat flow analysis that considered hydromechanics and heat transfer at the same time. It calculated the power loss, the main cause of temperature rise, from winding and core with electromagnetic analysis then used for the heat source for the heat flow analysis. It then compared the reasonability of result of measurement analysis based on the result acquired from temperature rise test using FBG sensor on the power transformer.

The Thermal Analysis of Pole Mount Mold Transformer with One-body Molding by Duct Condition (일체형 주상용 몰드 변압기의 덕트에 따른 열해석 특성 연구)

  • 조한구;이운용;박영두
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.3
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    • pp.348-352
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    • 2004
  • The mold transformers have been widely used in underground substations in large building and have some advantages in comparison to oil-transformer, that is low fire risk, excellent environmental compatibility, compact size and high reliability. In addition, the application of mold transformer for outdoor is possible due to development of epoxy resin. The mold transformer generally has cooling duct between low voltage coil and high voltage coil. A mold transformer made by one body molding method has been developed for small size and ow loss, but it needs some cooling method because heat radiation between each winding is difficult. The life of transformer is significantly dependent on the thermal behavior in windings. Many transformer designers have calculated temperature distribution and hot spot point by finite element method(FEM) to analyze winding temperature rise. In this paper, The thermal analysis of pole mount mold transformer with one body molding by duct condition is investigated and the test result of temperature rise is compared with simulation data.