• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.759-760
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.179-180
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2004.05a
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• pp.92-92
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• 2004

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.655-656
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• 2005

In the future, plastic based system will play a crucial role in modem life, for examples, transparent display or disposable electronics and so on. In this paper, we introduced a new method to fabricate the metal line on the plastic substrate. Metal lines were fabricated by hot embossing and CMP process on PMMA (polymethylmethacrylate) substrates. A Si mold was made by wet etching process and a PMMA wafer was cut off from I mm thick PMMA sheet. A 100 nm thick Al was deposited on PMMA wafers. The Al deposited PMMA wafer and the Si mold carefully sandwiched which was directly imprinted by hot embossing. After imprinting process, a residual Al layer was removed by CMP process. Finally, we found the entire process may be very useful to fabricate the metal line on plastic substrates.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.43-46
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• 2005

Micro molding technology is a promising mass production technology for polymer based microstructures. Mass production technologies such as the micro injection/compression molding, hot embossing, and micro reaction molding are already in use. In the present study, we have developed a numerical analysis system to simulate three-dimensional non-isothermal cavity filling for hot embossing, with a special emphasis on the free surface capturing. Precise free surface capturing has been successfully accomplished with the level set method, which is solved by means of the Runge-Kutta discontinuous Galerkin (RKDG) method. The RKDG method turns out to be excellent from the viewpoint of both numerical stability and accuracy of volume conservation. The Stokes equations are solved by the stabilized finite element method using the equal order tri-linear interpolation function. To prevent possible numerical oscillation in temperature Held we employ the streamline upwind Petrov-Galerkin (SUPG) method. With the developed code we investigated the detailed change of free surface shape in time during the mold filling. In the filling simulation of a simple rectangular cavity with repeating protruded parts, we find out that filling patterns are significantly influenced by the geometric characteristics such as the thickness of base plate and the aspect ratio and pitch of repeating microstructures. The numerical analysis system enables us to understand the basic flow and material deformation taking place during the cavity filling stage in microstructure fabrications.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.178-184
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• 2006

Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.

• Korean Journal of Materials Research
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• v.15 no.3
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• pp.149-154
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• 2005

Teflon like fluorocarbon thin films have been deposited on silicon and oxide molds as an antistiction layer for the hot embossing process by an inductively coupled plasma (ICP) chemical vapor deposition (CVD) method. The process was performed at $C_4F_8$ gas flow rate of 2 sccm and 30 W of plasma power as a function of substrate temperature. The thickness of film was measured by a spectroscopic ellipsometry. These films were left in a vacuum oven of 100, 200 and $300^{\circ}C$ for a week. The change of film thickness, contact angle and adhesion and friction force was measured before and after the thermal test. No degradation of film was observed when films were treated at $100^{\circ}C$. The heat treatment of films at 200 and $300^{\circ}C$ caused the reduction of contact angles and film thickness in both silicon and oxide samples. Higher adhesion and friction forces of films were also measured on films treated at higher temperatures than $100^{\circ}C$. No differences on film properties were found when films were deposited on either silicon or oxide. A 100 nm silicon template with 1 to $500\;{\mu}m$ patterns was used for the hot embossing process on $4.5\;{\mu}m$ thick PMMA spun coated silicon wafers. The antistiction layer of 10 nm was deposited on the silicon mold. No stiction or damages were found on PMMA surfaces even after 30 times of hot embossing at $200^{\circ}C$ and 10 kN.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.945-949
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• 2003

LIGA(Lithographie Galvanoformung Abformung), a fabrication method for the production of microstructrues with a high aspect ratio, is now playing an important role in a fabrication of polymeric optical waveguide device as the replication processes have been developed such as hot embossing and injection molding. The present report deals with the fabrication of Ni master used for the replication of multi-mode polymeric optical waveguide. With the basic technological features in the sequence of the LIGA technique, we fabricated Ni master with 12 channel microstructures of $100\;{\times}\;100{\mu}m\;^2{\times}\;60mm$, and achieved an accuracy of ${\pm}1\;{\mu}m$. Manufactured polymeric optical wavegude with the same using hot embossing process has also the same accuracy and approved its mass production capability.

• Journal of Pharmaceutical Investigation
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• v.41 no.3
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• pp.147-151
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• 2011

This paper demonstrates the development of a method for preparing micropatterned microdiscs in order to increase contact area with cells and to change the release pattern of drugs. The microdiscs were manufactured with hot embossing, where a polyurethane master structure was pressed onto both solid and porous microparticles made of polylactic-co-glycolic acid at various temperatures to form a micropattern on the microdiscs. Flat microdiscs were formed by hot embossing of porous microparticles; the porosity allowed space for flattening of the microdiscs. Three types of micro-grooves were patterned onto the flat microdiscs using prepared micropatterned molds: (1) 10 ${\mu}M$ deep, 5 ${\mu}M$ wide, and spaced 2 ${\mu}M$ apart; (2) 10 ${\mu}M$ deep, 9 ${\mu}M$ wide, and spaced 5 ${\mu}M$ apart; and (3) 10 ${\mu}M$ deep, 50 ${\mu}M$ wide, and spaced 50 ${\mu}M$ apart. This novel microdisc preparation method using hot embossing to create micropatterns on flattened porous microparticles provides the opportunity for low-cost, rapid manufacture of microdiscs that can be used to control cell adhesion and drug delivery rates.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.6
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• pp.697-701
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• 2009

A simple method for the fabrication of porous nano-master for the anti-reflection effect on the transparent substrates is presented. In the conventional fabrication methods for antireflective surface, coating method using materials with low refractive index has usually been used. However, it is required to have a high cost and long processing time for mass production. In this paper, we developed a porous nano-master with anti-reflective surface for the molding stamper of the injection mold, hot embossing and UV imprinting by using the aluminum anodizing process. Through two-step anodizing and etching processes, a porous nano-master with anti-reflective surface was fabricated at the large area. Pattern size Pore diameter and inter-pore distance are about 130nm and 200nm, respectively. In order to replicate anti-reflective structure, hot embossing process was performed by varying the processing parameters such as temperature, pressure and embossing time etc. Finally, antireflective surface can be successfully obtained after etching process to remove selectively silicon layer of AAO master.