• 제목/요약/키워드: Hole concentration

검색결과 382건 처리시간 0.036초

2차원 평판 내 구멍-모서리 및 구멍간의 응력 집중 효과를 고려한 리벳 배치 최적화 기법 검증 및 제안 (Verification and Suggestion of Optimization Method for Rivet Arrangement with Regard to Stress Concentration between Hole-Edge and Hole-Hole on a 2-D Plate)

  • 이상구;공두현;심지수;신상준
    • 한국전산구조공학회논문집
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    • 제29권6호
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    • pp.491-498
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    • 2016
  • 리벳이나 볼트가 결합되는 구멍은 항공기, 선박 및 기타 구조물에 사용되는 판재의 응력 집중을 유발한다. 과도한 응력 집중 현상이 지속되면 종래에는 파단이 일어날 수 있으므로 설계 단계에서 응력 집중 현상의 명확한 해석이 중요하다. 이 논문에서는 판재위에 리벳을 배치하는 간단한 최적화 방법이 제시되었다. 첫째로 응력 집중 현상 해석에서 FEM 구조 해석이 얼마나 정확한지 검증하였다. 평판 위에 존재하는 단일 구멍의 반경을 바꿔가며 응력 집중 계수의 변화를 분석하였다. 같은 방법으로 일렬로 존재하는 구멍들 사이에서의 응력 집중 계수를 수치 해석하였다. 각각의 응력 집중 계수를 이론값과 비교하여 정확도를 확인하였다. 마지막으로 두 응력 집중 현상을 독립적으로 적용하는 최적화 방법을 확인 및 검증하였다. 이 결과들은 이론적인 예측과 밀접한 경향성을 보여 앞으로의 리벳 배치 최적화에도 활용될 수 있을 것으로 예상된다.

YBCO의 특성분석에 있어서 불순물효과의 보정 (Correction of lmpurity Effects on the Characterization of YBCO)

  • 하동한;변순예;김용일;한기열;이규원
    • 한국초전도학회:학술대회논문집
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    • 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
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    • pp.171-174
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    • 1999
  • We have characterized solid solution Y$_{l-x}Ca_xBa_2Cu_3O_y$ (0${\le}$x${\le}$0.3) materials by measuring the XRD pattern, resistivity and hole concentrations, etc. As Ca concentration increases, T$_c$, is decreased monotonically because the hole concentration on the superconducting plane increases beyond the optimum region in the electronic phase diagram due to the hole transfer from the Cu-O chain to the CuO$_2$ plane. A very small amount of secondary phase have large effects on the analysis of oxygen content and hole concentration etc. The results before the correction of impurity phase are compared with those after the correction.

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컴퓨터 네비게이션을 이용한 슬관절 전치환술에서 핀 홀에 의한 응력 집중: 유한요소해석 (The Stress Concentration Caused by Pin-hole in Femur after Computer-navigated Total Knee Arthroplasty: A Finite Element Analysis)

  • 박형균;김윤혁;박원만;김경수
    • 대한의용생체공학회:의공학회지
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    • 제29권6호
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    • pp.451-456
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    • 2008
  • Total knee arthroplasty(TKA) using computer-assisted navigation has been increased in order to improve the accuracy of femoral and tibial components implantation. Recently, a few clinical studies have reported on the femoral stress fracture after TKA using computer-assisted navigation. The purpose of this study is to investigate the stress concentration around the femoral pin-hole for different pin-hole diameter, the modes of pin penetration by finite element analysis to understand the effects of pin-hole parameters on femoral stress fracture risk. A three-dimensional finite element model of a male femur was reconstructed from 1 mm thick computed tomography(CT) images. The bone was rigidly fixed to a 25 mm above the distal end and 1500 N of axial compressive force and 12 Nm of axial torsion were applied at the femoral head. For all cases, transcortical pin penetration mode showed the highest stress fracture risk and unicortical pin penetration mode showed the lowest stress concentration. Pin-hole diameter increased the stress concentration, but pin number did not increase the stress dramatically. The results of this study provided a biomechanical guideline for pin-hole fracture risk of the computer navigated TKA.

Effect of the Hole on the Tensile Fatigue Properties of CFRP Laminates

  • Lee, Yeon-Soo;Ben, Goichi;Lee, Se-Hwan
    • Advanced Composite Materials
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    • 제18권1호
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    • pp.43-59
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    • 2009
  • The current study assessed the effect of a bolt hole on tensile fatigue properties of CFRP laminates. Two specimens, i.e. $[(0/90)_3]S$, $[(0/45/90/-45)_2]_S$, were analyzed using a finite element method and were experimentally tested for cases, both with and without a hole, whose diameter corresponded to 0.12 times the specimen width. Delamination positions predicted by a 3-dimensional static finite element analysis were matched well to those observed by an ultrasonic imaging system in the middle of fatigue test. A hole whose diameter corresponds to 0.12 times the specimen width caused the fatigue strength to decrease by 9% and 11% under 5 Hz loading frequency, and by 22% and 25% under 10 Hz loading frequency for $[(0/90)_3]_S$ and $[(0/45/90/-45)_2]_S$, respectively. Because the decrease in sectional area due to the hole was normalized in calculation of the tensile strength, a stress concentration around the hole is believed to induce the strength degradation of fatigue specimens. From the finite element analyses, the stress concentration factor around a hole was expected as 8.8 and 9.5 for $[(0/90)_3]_S$ and $[(0/45/90/-45)_2]_S$, respectively.

Ant lion optimizer for optimization of finite perforated metallic plate

  • Chaleshtaria, Mohammad H. Bayati;Jafari, Mohammad
    • Structural Engineering and Mechanics
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    • 제69권6호
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    • pp.667-676
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    • 2019
  • Minimizing the stress concentration around hypotrochoid hole in finite metallic plates under in-plane loading is an important consideration in engineering design. In the analysis of finite metallic plate, the effective factors on stress distribution around holes include curvature radius of the corner of the hole, hole orientation, plate's aspect ratio, and hole size. This paper aims to investigate the impact of these factors on stress analysis of finite metallic plate with central hypotrochoid hole. To obtain the lowest value of stress around a hypotrochoid hole, a swarm intelligence optimization method named ant lion optimizer is used. In this study, with the hypothesis of plane stress circumstances, analytical solution of Muskhelishvili's complex variable method and conformal mapping is employed. The plate is taken into account to be finite, isotropic and linearly elastic. By applying suitable boundary conditions and least square boundary collocation technique, undefined coefficients of stress function are found. The results revealed that by choosing the above-mentioned factor correctly, the lowest value of stress would be obtained around the hole allowing to an increment in load-bearing capacity of the structure.

IGBT의 콜렉터 구조에 따른 홀 주입효율의 변화 (Variations of the hole injection efficiency with IGBT's collector structure)

  • 최병성;정상구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 D
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    • pp.1956-1958
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    • 1999
  • The analysis of hole injection efficiency at the p+/n-drift layer junction in non-punchthrough IGBT structure is presented. This analysis takes into account carrier concentration variations by conductivity modulation. Good agreement between this analysis and simulation is found over a wide range of carrier lifetime and current density. The proposed analytical model of the hole injection efficiency as a function of collector width, collector concentration has been verified by device simulator, ATLAS.

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RHP에서의 $Zn_3P_2$ 박막 및 RTA법에 의한 Zn 확산의 특성 (Characterization of Zn diffusion in TnP Cy $Zn_3P_2$ thin film and rapid thermal annealing)

  • 우용득
    • 한국진공학회지
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    • 제13권3호
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    • pp.109-113
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    • 2004
  • InP에서 열처리 온도와 시간 및 활성화 온도에 따른 Zn의 확산의 특성을 electrochemical capacitance-voltage 법으로 조사하였다. InP층은 metal organic chemical vapor deposition를 이용하여 성장하였으며, 화산방법으로는 $Zn_3P_2$ 확산과 박막과 rapid thermal annealing를 사용하였다. 최대의 정공 농도를 갖는 p-lnP 층은 $550^{\circ}C$에서 5분 동안 확산과 활성화를 한 시료에서 얻었고, Zn의 농도는 $1\times10^{19}\textrm{cm}^{-3}$이었다. $550^{\circ}C$에서 5-20 분 동안 확산을 수행한 결과 정공농도의 확산 깊이는 1.51 $\mu\textrm{m}$에서 3.23 $\mu\textrm{m}$로 이동하였고, Zn의 확산계수는 $5.4\times10^{-11}\textrm{cm}^2$/sec이었다. 활성화 시간의 증가로, Zn가 더 깊게 확산하지만, 정공농도는 거의 변화가 없었다. 이는 도핑된 영역의 과잉의 침입형 Zn가 도핑되지 않은 영역으로 빠르게 확산하고 치환형 Zn로 변한다는 것을 의미한다. 정공농도는 $SiO_2$ 박막의 두께가 1,000$\AA$ 이상이어야 안정적으로 분포된다.

전해 방전법에 의한 유리의 미세 구멍 가공 (Microscopic hole fabrication of glass using electro-chemical discharge method)

  • 이왕훈;이영태
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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    • pp.89-92
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    • 2001
  • In this paper, we studied on drilling a microscopic hole of glass using electro-chemical discharge methode. In this research, we fabricated a electro-chemical discharge machine for drilling glass hole. The used parameters to get a fine microscopic hole are the concentration of NaOH solution from 5wt% to 50wt%, the supply voltage from 10V to 40V and the fabricating time from 5 second to 50 second. Also, we used a 0.16mm glass plate. We learned from our experiment that, the fabrication most efficient when supply voltage is 25V-30V and concentration of NaOH solution 35wt% or less.

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Exact deformation of an infinite rectangular plate with an arbitrarily located circular hole under in-plane loadings

  • Yang, Yeong-Bin;Kang, Jae-Hoon
    • Structural Engineering and Mechanics
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    • 제58권5호
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    • pp.783-797
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    • 2016
  • Exact solutions for stresses, strains, and displacements of a perforated rectangular plate by an arbitrarily located circular hole subjected to both linearly varying in-plane normal stresses on the two opposite edges and in-plane shear stresses are investigated using the Airy stress function. The hoop stress occurring at the edge of the non-central circular hole are computed and plotted. Stress concentration factors (the maximum non-dimensional hoop stresses) depending on the location and size of the non-central circular hole and the loading condition are tabularized.

전해 방전법에 의한 유리의 미세 구멍 가공 (Microscopic hole fabrication of glass using electro-chemical discharge method)

  • 이왕훈;이영태
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집
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    • pp.89-92
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    • 2001
  • In this paper, we studied on drilling a microscopic hole of glass using electro-chemical discharge methode. In this research, we fabricated a electro-chemical discharge machine for drilling glass hole. The used parameters to get a fine microscopic hole are the concentration of NaOH solution from 5wt% to 50wt%, the supply voltage from 10V to 40V and the fabricating time from 5 second to 50 second. Also, we used a 0.16mm glass plate. We learned from our experiment that, the fabrication most efficient when supply voltage is 25V-30V and concentration of NaOH solution 35wt% or less.

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