• 제목/요약/키워드: Hole Die

검색결과 135건 처리시간 0.019초

4 홀 Micro Multi Cell Tube 의 압출공정 해석 및 기계적 특성 평가 (Extrusion process Analysis and Evaluation of Mechanical property for Micro Multi Cell Tube with 4 hole)

  • 이정민;김병민
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.397-400
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    • 2004
  • The direct extrusion with porthole die can produce condenser tube which has the competitive power in costs and qualities compared with the existing conform extrusion. In general, porthole die extrusion has a great advantage in the forming that produces the hollow sections difficult to produce by conventional extrusion with a mandrel on the stem. Especially, condenser tube manufactured by porthole die belongs to sophisticated part and demands tighter dimension tolerance and higher surface finish than any other part. In order to confirm the general of porthole die extrusion, we perform the 3D FE analysis of hot porthole extrusion in non-steady state by using DEFORM 3D and investigate a pattern of elastic deformation for porthole die through the stress analysis using ANSYS 5.5 during extrusion process.

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의료용 카테타 튜빙의 압출을 위한 다이내의 수지 흐름해석 (Flow Analysis of Resin in an Extrusion Die for the Production of Medical Catheter Tubes)

  • 이민아;류민영;신동진;김태균
    • 소성∙가공
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    • 제24권2호
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    • pp.89-94
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    • 2015
  • Medical catheter tubes are disposable devices that are inserted into the body cavities such as the pleura, trachea, esophagus, stomach, urinary bladder, ureter, or blood vessels for surgical procedures. Each hole of the inner tube is called a lumen, which is used as a passage for drug injections, waste discharge, polypus removal, blood transport, or injection of a camera or sensor. The catheter tube is manufactured by extrusion. The flow in the inner extrusion die affects the thickness and diameter of the tube. In the current study computer simulation of flow in an extrusion die for catheter tubing was performed. Velocity, pressure, shear rate, and shear stress were investigated and the die design was examined.

내열마그네슘 합금을 이용한 자동차용 오일팬의 다이캐스팅 공정 연구 (A Study on Die Casting Process of the Automobile Oil Pan Using the Heat Resistant Magnesium Alloy)

  • 신현우;정연준;강승구
    • 한국자동차공학회논문집
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    • 제17권3호
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    • pp.45-53
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    • 2009
  • Die casting process of Mg alloys for high temperature applications was studied to produce an engine oil pan. The aim of this paper is to evaluate die casting processes of the Aluminium oil pan and in parallel to apply new Mg alloy for die casting the oil pan. Temperature distributions of the die and flow pattern of the alloys in cavity were simulated to diecast a new Mg alloy by the flow simulation software. Dies have to be modified according to material characteristics because melting temperature and heat capacity are different. We changed the shape and position of runner, gate, vent hole and overflow by the simulation results. After several trial and error, oil pans of AE44 and MRI153M Mg alloys are produced successfully without defect. Sleeve filling ratio, cavity filling time and shot speed of die casting machine are important parameter to minimize the defect for die casting Magnesium alloy.

유한요소법을 이용한 전방압출공정의 내부결함에 관한 연구

  • 김태형;김병민;강범수;최재한
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1992년도 춘계학술대회 논문집
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    • pp.79-83
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    • 1992
  • According to the variation of hydrostatic pressure on the central axis of deformable material, the V-shaped central bursting defect may be created on extrusion or drawing processes. The process factors whichaffect the generation of defects are die semi-angle, reduction ratio of cross-sectional area, friction factor, material properties and so on. The combination of these factors can determine the prossibility of defect creation and the shape of various round holes which have been created inside already. By the rigid plastic finite element method, this paper describes the observations of change in shape of a round hole with process conditions suchas die semi-angle, reduction ratio of cross-sectional area and friction factorat the unsteady state of axi-symmetrical extrusion process when the round hole is alreadyexisted inside the original billet, and also, the effects of process factors are investigated to prevent the possible defects.

하이드로 피어싱된 튜브 부위의 변형해석 (Analysis of Deformation Surrounding the Pierced Hole in the Tube Hydro-Piercing Process)

  • 최성기;김동규;문영훈
    • 소성∙가공
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    • 제13권2호
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    • pp.154-159
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    • 2004
  • Deformation surrounding the hole in the tube during the hydropiercing process has been investigated in this study. The tube is expanded and internally pressurized between upper and lower dies, and a piercing punch is driven forcefully through a cross passage in the die and through the wall of the tube. The pressurized fluid within the tube provides support to the wall of the tube during a piercing step to form a hole in the tube having less deformation surrounding the hole in the tube. The deformation area may be fully retracted to a substantially flat form or partially retracted to a countersunk form. In this study, a mathematical model that can predict deformation surrounding the hole has been proposed and experimentally verified by actual hydropiercing test.

Cu 전해도금을 이용한 TSV 충전 기술 (TSV Filling Technology using Cu Electrodeposition)

  • 기세호;신지오;정일호;김원중;정재필
    • Journal of Welding and Joining
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    • 제32권3호
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    • pp.11-18
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    • 2014
  • TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

방전드릴링에서 홀 관통 평가 방법 (A Method of Hole Pass-Through Evaluation for EDM Drilling)

  • 이철수;최인휴;허은영;김종민
    • 대한산업공학회지
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    • 제38권3호
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    • pp.220-226
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    • 2012
  • The Electric discharge machining (EDM) process is used to minimize the difference between designed feature and machined feature while the most workpiece is removed through the cutting processes. The tiny-deep hole machining and perpendicular wall machining in mold and die are good applications of EDM. Among EDM equipment, the super drill uses the hollowed electrode to eliminate the debris which causes the second discharge with the electrode and degrades the machining quality. Through the hollow, the high pressured discharge oil is supplied to remove the debris together with the spindle rotation. The thin-hollow electrode tends to easily wear out compared to the sold die-sinking electrode and its wear rate is might not allowed to monitor in real time during discharging. Up to now, the wear amount is measured by off line method, which leads machining time to increase because the hole pass-through moment can be check by visual (manually) with the extra tool path. Therefore, this study suggests the attractive method to evaluate the hole pass-through moment in which the gap voltage and z-axis encoder pulse are monitored to predict the moment. The commercial super drill is used to validate the proposed method and the experiment is carried out.

총 정전용량을 이용한 마이크로펀치 시스템의 펀치-다이 얼라인먼트 조절 알고리즘 개발 (The Development of Punch-Die Aligning Algorithm in Micro Punch System with using the Total Capacitance)

  • 최근형;김병희;김헌영;장인배
    • 한국정밀공학회지
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    • 제20권7호
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    • pp.114-119
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    • 2003
  • The aligning between the punch and die governs no only the burr formation characteristics but also the life time of the punch and die in the sheet metal blanking process. There are many ways to adjust the two elements in the general punching systems but in the case of micro punch system, the punch size is reduced to a few tenth of micrometer range and the general aligning methods are almost impossible to apply. The image processing is the most widely used method in micro punch aligning, but in order to apply the method, it needs quite a large space for visionary system to approach the punch-die aligning zone. In this paper, the new punch-die aligning method with using the total capacitance between the punch and die hole is proposed. In this method, the tip surface of the punch tool locates at the same plane of the die surface and the capacitance variation between the two elements are measured. When the center of the two elements are coincided, the capacitance is minimized, but when the align is changed to any direction, the capacitance between the two elements increase. In order to verify the feasibility of this method, the aligning and punching tests was performed.

총 정전용량을 이용한 마이크로 펀치 시스템의 펀치-다이 얼라인먼트 조절 알고리즘 개발 (The development of punch-die aligning algorithm in micro punch system with using the total capacitance)

  • 최근형;김병희;김헌영;장인배
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.1049-1052
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    • 2002
  • The aligning between the punch and die governs no only the burr formation characteristics but also the life time of the punch and die in the sheet metal blanking process. There are many ways to adjust the two elements in the general punching systems but in the case of micro punch system, the punch size is reduced to a few tenth of micrometer range and the general aligning methods are almost impossible to apply. The image processing is the most widely used method in micro punch aligning, but in order to apply the method, it needs quite a large space for visionary system to approach the punch-die aligning zone. In this paper, the new punch-die aligning method with using the total capacitance between the punch and die hole is proposed. In this method, the tip surface of the punch tool locates at the same plane of the die surface and the capacitance variation between the two elements are measured. When the center of the two elements are coincided, the capacitance is minimized, but when the align Is changed to any direction, the capacitance between the two elements increase. In order to verify the feasibility of this method, the aligning and punching tests was performed.

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