• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1085-1088
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• 2001

The process of styrofoam pattern that has been used for material of press die pattern depends chiefly on handwork. Laser manufacturing system developed to increase precision and efficiency of process that is also able to convert the design easily. Applying the RP(rapid prototyping) concept reversely, the unnecessary part of section is vapored away by heat source of laser beam after converting 3-D CAD model into cross-sectional shape information. Laser beam is line-scanned in plane specimens to measure the depth and width of cut, surface roughness, cross-sectional shape as converting laser power, scanning speed, cutting gas pressure. With these basic data, plane surface, inclined surface, hole, outer contour trimming process is experimented and optimum condition are obtained. In plane and inclined surface experiments, 15W laser power and 50mm/s scanning speed make superior processing property and 30W, 10mm/s make processing efficiency increase in trimming process. With these results, simple patterns were manufactured and the possibility of applying laser manufacturing system to styrofoam pattern was convinced.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.827-830
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• 2000

This paper describes the machining characteristics of the sintered carbide and die steel by electric discharge drilling with various tubular electrodes. Electrical discharge machining(EDM) removes material from the workpiece by a series of electrical sparks that cause localized temperatures high enough to melt or vaporise the metal in the vicinity of the charge. In the experiment, four types of electrode which have different diameter are used with the application of continuous direct current and axial electrode feed. The controlled factors include the dimension of the electrode. In drilling by EDM, the dielectric flushed down the interior of the rotating tube electrode, in order to facilitate the removal of machining debris from the hole.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.3
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• pp.8-13
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• 2006

Plunge milling process is used for machining hole and is widely used in aerospace, automobile, and die/mold industries. The cutter is fed in the direction of spindle axis which has the highest structural rigidity. The kinematics of plunge milling differs from the traditional turning and milling in aspect of tool engagement and chip generation. This paper proposes the mechanistic cutting force model for plunge milling. Uncut chip thickness is calculated using the present cutter edge position and the previous cutter edge position. Instantaneous cutting force coefficients, which depend only on instantaneous uncut chip thickness, are derived based on the mechanistic approach. The developed cutting force model is verified through comparison of the predicted and the measured cutting forces.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.7
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• pp.992-998
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• 2004

During the tube hydropiercing, the region adjacent to the pierced hole will be deformed and will be drawn away from the die block as the punch advances through the wall of the tube. The deformation in the region may range from a substantially flat form to a countersunk form, so called rollover. In this study, the effects of material properties, shape of piercing punches, roundness of tube surface and internal pressure within the tube during piercing on the rollover have been investigated experimentally. The results provide the quantitative variation of rollover at given hydropiercing parameters, and a relationship between the deformed radius and the rollover caused by the deformation has been established.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1195-1198
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• 2003

Micro former has been known as a useful tool for machining micro parts. It makes micro holes automatically with punches, a hole-shape die and material by rotation of crank shaft synchronously. Micro displacement in micro forming affects on the performance of machining because micro forming size is similar with its mechanical displacement. Therefore, the measurement of this micro displacement is essential to be guaranteed to obtain high forming precision in the whole machine as well as its devices. This paper addresses the development of a laser interferometer to measure micro displacement for a micro former. The laser interferometer is able to measure micro displacement during a few micro seconds with non-contact. For the experiment, a laser probe is installed on the optical table with optical devices and a micro displacement generating device. The velocity decoding board is also added to calculate doppler shift frequency directly. Finally simple experiments are conducted to confirm its functional operation.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.6
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• pp.40-47
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• 1998

Drilling is an indispensable process in manufacturing of the die and mould and the other mechanical parts which needs high dimensional and surface accuracy. In this paper, a new type of drilling method was proposed in order to improve both processing efficiency and accuracy. Specifically, the helical motion using ball end mill tools, instead of normal drilling method, was applied to perform an effective hole machining. In this paper, an theoretical background of the new type of drilling method was established, and the feasibility of the proposed theory was proved by experiments, where proposed drilling process in the paper gave a different machining specification than general method did.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.74-78
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• 2002

MEMS공정을 이용하여 폴리실리콘의 piezoresistivity를 이용한 스트레인 센서어레이를 제작하였고, 이 센서 어레이를 flexible substrate에 패키징하는 공정을 개발하였다. 실리콘 웨이퍼에 표면 가공(surface micromachining)된 센서는 폴리이미드 코팅, release-etch 방법을 통해 웨이퍼로부터 분리되어 폴리이미드를 기판으로 하는 flexible sensor array module을 완성할 수 있었다. 공정은 희생층과 절연층을 증착하고 폴리실리콘 0.5 $\mu\textrm{m}$을 증착, 도핑 및 패터닝하여 센서 어레이를 구성하였다. 이 센서어레이를 flexible substrate에 패키징 하기 위해서 폴리이미드를 코팅하여 15 $\mu\textrm{m}$의 막을 구성하였고, 100% $O_2$RIE를 이용한 선택적 식각 방법으로 via hole을 구성하였다. 이후 전기도금을 통해 회로를 구성하여 1단계 패키징(die to chip carrier)과 2단계 패키징(chip to substrate)을 웨이퍼 레벨에서 완성하였다. 희생층을 제거함으로서 웨이퍼로부터 센서어레이 모듈을 분리하였다. 제작되어진 센서 모듈은 임의의 곡면에 실장이 가능하도록 충분한 flexibility를 얻을 수 있었다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Journal of Welding and Joining
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• v.17 no.2
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• pp.61-65
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• 1999

Because of the need for packages which accommodate high pin count, high density and high speed device, PBGA(plastic ball grid array) package gets more spotlight. But the substrate material which is used for PBGA package is in nature susceptible to moisture penetration. The objective of the study is to find out the path of delamination in the stacked structure of substrate. To increase the adhesion between the cooper laminate and PSR(photo solder resist) which is the weakest part, experiments were performed by changing parameters of printing pre-treatment and post-treatment process. As a result of experiments, the factor effects on the adhesion between the cooper laminate and PSR is caused by all of the pre-treatment and post-treatment condition. A considerable change was observed depending on the amount of UV irradiation after thermal cure which is typical of printing post-treatment condition rather than pre-treatment condition.

• Korean Journal of Food Science and Technology
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• v.27 no.3
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• pp.404-413
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• 1995

System parameters (extrusion temperature, extrusion pressure, specific mechanical energy, mean residence time) were analysed on three different screw configurations during twin-screw extrusion of wheat bran. Experiments were conducted over a screw speed of $280{\sim}380\;rpm$, feed rate of $22{\sim}38\;kg/hr$ and moisture content of $17{\sim}33%$ using screws assembled with 3, 4, and 5 reverse screw elements (RSE) adjacent to the heating zone of the barrel. Extrusion temperature increased with increasing RSE but it decreased with increasing feed rate and moisture content. Decreasing the filling ratio of the screw resulted in a lower extrusion pressure, and increasing the length of the RSE gave similar results due to the higher temperature and lower viscosity of melted dough. It was also observed that increasing the feed rate and decreasing moisture content resulted in the reduced extrusion pressure. Specific mechanical energy (SME) decreased when the feed rate and moisture content increased, and SME increased when using RSE posses from 3 to 5. Screw configuration posses with 4 RSE yielded the longest RT, and the smaller the die hole, the higher the RT. In contrast, RT decreased when the feed rate increased. With increasing moisture content RT for 3 RSE increased, but that for 4 and 5 RSE decreased.