• 소성∙가공
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• 제9권1호
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• pp.72-79
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• 2000

Dynamic recrystallization (DRX), which may occur during hot deformation, is important for the microsturctural evolution of 304 stainless steel. Especially, the current interest in modelling hot rolling demands quantitative relationships among the thermomechanical process variables, such as strain, temperature, strain rate, and etc. Thus, this paper individually presents the relationships for flow stress and volume fraction of DRX as a function of processing variables using torsion tests. The hot torsion tests of 304 stainless steel were performed at the temperature range of 900~110$0^{\circ}C$ and the strain rate range of 5x10-2~5s-1 to study the high temperature softening behavior. For the exact prediction of flow stress, the equation was divided into two regions, the work hardening (WH) and dynamic recovery (DRV) region and the DRX region. Especially, The flow stress of DRX region could be expressed by using the volume fraction of DRX (XDRX). Since XDRX was consisted of the critical strain($\varepsilon$c) for initiation of dynamic recrystallization (DRX) and the strain for maximum softening rate ($\varepsilon$*), that were related with the evolution of microstructure. The calculated results predicted the flow stress and the microstructure of the alloy at any deformation conditions well.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

• 동력기계공학회지
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• 제10권3호
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• pp.45-50
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• 2006

In this paper, creep tests of Mg-Zn-Mn and Mg-Zn-Mn-Ca alloy casted by mold under the temperature range of 473.00-573.00K, and the stress range of 23.42-87.00Mpa were done with the equipment of automatic controlled temperature and computer for data acquisition. The activation energies were obtained by relationship between creep rate and temperature, and the stress exponents were obtained by relationship between creep rate and stress. From the experiment results, the activation energies of Mg-Zn-Mn and Mg-Zn-Mn-Ca alloy were 149.87kJ/mol, 147.97kJ/mol, respectively, and the stress exponents of those alloy were 5.13, 5.59, respectively, under the temperature of 473.00-493.00K and the stress range of 62.43-78.00Mpa. And the activation energies of those alloy were 134.41kJ/mol, 129.22kJ/mol, respectively, and the stress exponent of those alloy were 3.48, 3.77, respectively, under the temperature of 553-573Mpa and the stress range of 23.42-39.00Mpa. Also the lifes of Mg-Zn-Mn-Ca alloy were higher than those of Mg-Zn-Mn alloy, and the results of SEM showed fracture surfaces under low temperature had smaller dimples than those under high temperature.

• 한국기계가공학회지
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• 제3권1호
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• pp.66-71
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• 2004

Magnesium alloys have been widely used for many structural components of automobiles and aircraft because of high specific strength and good cast-ability in spite of hexagonal closed-packed crystal structure of pure magnesium. In this study, it is studied about the forming characteristics of press forging of AZ31 magnesium alloy by MSC/MARC in case of material having one boss and MSC/Supeiforge in case of material having multi-boss with heat transfer analysis during deformation at elevated temperature. For these results it is simulated about temperature distribution, strain distribution, and stress distribution of AZ31 Magnesium alloy. During the press forging, foot regions of bosses showed greater temperature rise than other areas of AZ31 sheet. Finally the plastic strain of AZ31 sheet did not remarkably vary with increasing temperature from 373 to 473K, while it significantly increased as the forming temperature increased from 473 to 573K, which is related with the change in micro-structures, such as dynamic re-crystallization occurring during the deformation process.

• 한국생산제조학회지
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• 제6권3호
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• pp.44-51
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• 1997

Unsteady-state temperature distributions and thermal deformations of the spindle of a high precision lathe are studied in this paper. Three dimensional model is built for analysis, and the amount of heat generation of bearing and the thermal characteristic values including heat transfer coefficient are estimated. Temperature distributions and thermal deformations of a model are analyzed using the finite element method and the thermal boundary values. Numerical results are compared with the measured data. The results show that the thermal deformations and the temperature distributions of the dpindle of a high precision lathe can be reasonably estimated using the three dimensional model and the finite element method.

• 한국분말재료학회지
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• 제1권1호
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• pp.35-41
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• 1994

Mechanical alloying process of Al-8wt.% Ni powder was investigated for the various milling time in order to get the steady state powder. High temperature deformation behaviors of the sintered specimens were investigated by activation energy calculated after high temperature compression tests at the strain rates of 2.5$\times$10-3 s-1, 2.5$\times$10-2 s-1 and 2.5$\times$10-1 s-1 at the temperature range between $350^{\circ}C$ and $450^{\circ}C$. The steady state was obtained after 1000 minutes of milling with the PCA of 1.5 wt.% stearic acid under the condition of grinding media to powder weight ratio of 50 : 1 and impeller rotating speed of 300 rpm. True activation energy of Al-8wt.% Fe alloy was estimated to be 181 kJ/mole at the temperature range of 350~ $400^{\circ}C$ and 265 kJ/mole at the range of 400~$450^{\circ}C$.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.467-469
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• 2009

In this study, fatigue samples were prepared from cylinder head parts that are actually used in domestic (A) and foreign (B) automobiles; high-temperature, high-cycle, and low-cycle fatigue characteristics were then evaluated and compared. A study on the correlation between the microstructural factor and high temperature fatigue characteristic was attempted. The chemical compositions of the heat resistant aluminum alloys above represented A356 (A) and A319 (B), respectively. The result of the tensile strength test on material B at $250^{\circ}C$ was higher by 30.8MPa compared to material A. On the other hand, elongation was 8.5% higher for material A. At $130{\circ}C$, material B exhibited high fatigue life given high cycle fatigue under high stress, whereas material A showed high fatigue life when stress was lowered. With regard to the low-cycle fatigue result ($250^{\circ}C$) showing higher fatigue life as ductility is increased, material A demonstrated higher fatigue life. Through the observation of the differences in microstructure and the fatigue fracture surface, an attempt to explain the high-temperature fatigue deformation behavior of the materials was made.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.46-49
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• 2008

Drawing process of the high carbon steel wire with high speed is usually performed at room temperature using multi pass. Tn the multi pass drawing, temperature rise affects the mechanical properties of the final product. The excessive temperature rise during the deformation promotes the occurrence of delamination, and deteriorates the torsion property and durability of wire. This paper investigates the occurrence of delamination in the wire through the torsion test and the evaluation of wire temperature. The excessive wire temperature ieads to the occurrence of delamination. Based on the calculation of the wire temperature, a new pass schedule, that can prevent the delamination due to the excessive wire temperature rise, is designed through the isothermal pass schedule.

• 한국정밀공학회지
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• 제24권1호
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• pp.57-63
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• 2007

Wire drawing process of the high carbon steel with a high speed is usually conducted at room temperature using a number of passes or reductions through consequently located dies. In the multi-pass drawing process, temperature rise in each pass affects the mechanical properties of the final product such as bending, torsion, and tensile property, etc. This temperature rise during the deformation promotes the occurrence of delamination, and deteriorates the torsion property and durability of wire. This study investigates the occurrence of delamination in the wire through the torsion test and the evaluation of wire temperature. The excessive wire temperature leads to the occurrence of the delamination. Based on the calculation of the wire temperature, a new pass schedule, which can prevent the delamination due to the excessive wire temperature rise, is designed through the isothermal pass schedule.

• 한국항공우주학회지
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• 제49권8호
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• pp.617-626
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• 2021

비행체의 초음속 비행 중 고온 환경에서의 열 거동은 비행체의 열 구조 설계에 중요하다. 본 연구에서는 전역-국부 다중 디지털 이미지 상관기법을 사용하여 노치 구조물의 전 영역의 열변형 및 응력집중 현상에 대해 관찰/분석하였다. 다중 DIC 시스템은 2D DIC 시스템과 3D DIC 시스템으로 구성되었다. 가열 챔버를 이용하여 노치 시편을 가열하였으며 여러 온도에서 다중 DIC 시스템을 사용하여 구조물의 변형 이미지를 촬영하고 분석하였다. 다중 DIC 기법을 사용하여 노치 시편의 전 영역 변형률과 노치 부위의 응력집중 현상을 계측/분석하였으며 ABAQUS^TM 프로그램을 이용하여 노치 시편에 대해 유한요소해석을 진행하고 실험결과와 비교 분석하였다. 본 연구를 통해 다중 DIC 시스템의 열변형 계측과 응력 집중 현상의 연구 분석에서의 활용 가능성을 보여주었다.