• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.253-253
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• 2012

Low temperature SiOx film process has being required for both silicon and oxide (IGZO) based low temperature thin film transistor (TFT) for application of flexible display. In recent decades, from low density and high pressure such as capacitively coupled plasma (CCP) type plasma enhanced chemical vapor deposition (PECVD) to the high density plasma and low pressure such as inductively coupled plasma (ICP) and electron cyclotron resonance (ECR) have been used to researching to obtain high quality silicon oxide (SiOx) thin film at low temperature. However, these plasma deposition devices have limitation of controllability of process condition because process parameters of plasma deposition such as RF power, working pressure and gas ratio influence each other on plasma conditions which non-leanly influence depositing thin film. In compared to these plasma deposition devices, neutral beam assisted chemical vapor deposition (NBaCVD) has advantage of independence of control parameters. The energy of neutral beam (NB) can be controlled independently of other process conditions. In this manner, we obtained NB dependent high crystallized intrinsic and doped silicon thin film at low temperature in our another papers. We examine the properties of the low temperature processed silicon oxide thin films which are fabricated by the NBaCVD. NBaCVD deposition system consists of the internal inductively coupled plasma (ICP) antenna and the reflector. Internal ICP antenna generates high density plasma and reflector generates NB by auger recombination of ions at the surface of metal reflector. During deposition of silicon oxide thin film by using the NBaCVD process with a tungsten reflector, the energetic Neutral Beam (NB) that controlled by the reflector bias believed to help surface reaction. Electrical and structural properties of the silicon oxide are changed by the reflector bias, effectively. We measured the breakdown field and structure property of the Si oxide thin film by analysis of I-V, C-V and FTIR measurement.

• Journal of Welding and Joining
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• 제20권4호
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• pp.525-534
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• 2002

During laser spot welding of the braun tube electron gun, phenomena such as serious spattering and oxidative reaction, etc. were occurred. The spatter occurred from weld pool affects the braun tube, namely it blocks up a very small hole on the shadow mask and causes short circuit between two roles of the electron gun. We guessed that high power density and oxidative reaction are main sources of these problems. So, we studied to prevent and to reduce spatter occurring in spot welding of the braun tube electron gun using pulsed Nd:YAG laser. The characteristics of laser output power was estimated, and the loss of laser energy by optical parameter and spatter was measured by powermeter. The effects of welding parameters, laser defocused distance and incident angle, were investigated on the shape and penetration depth of the laser welded bead in flare and flange joints. From these results, the laser peak power was a major factor to control penetration depth and to occur spatter. It was found that the losses of laser energy by optic parameter and sticked spatter affect seriously laser weldability of thin sheets. The deepest penetration depth is gotten on focal position, and a "bead transition" occurred with a slight displacement of focal position relative to the workpiece surface and the absorption rate of the laser energy is affected by the shape factor of the workpiece. When we changed the incident angle of laser beam, the penetration depth was decreased a little with increasing of the incident angle, and the bead width was increased. The spattering was prevented by considering laser beam energy and incident angle.ent angle.

• Journal of the Korean Ceramic Society
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• 제43권5호
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• pp.299-303
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• 2006

In this paper, anode supported SOFC with columnar structured YSZ electrolyte was fabricated via Electron Beam Physical Vapor Deposition (EBPVD) method. Liquid condensation process was employed for the preparation of NiO-YSZ substrate and the high power electron beam deposition method was used for the deposition of YSZ electrolyte film. Double layered cathode with LSM-YSZ and LSM was printed on electrolyte via screen-printing method and fired at $1150^{\circ}C$ in air atmosphere for 3 h. The electrochemical performance and the long-term stability of $5{\times}5cm^2$ single cell were investigated with DC current-voltage characteristics and AC-impedance spectroscopy. According to the investigation, $5{\times}5cm^2$ sized unit cell showed the maximum power density of around $0.76W/cm^2$ at $800^{\circ}C$ and maintained the stable performance over 400 h.

• Journal of the Korean Society of Propulsion Engineers
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• 제19권3호
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• pp.83-88
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• 2015

Coating materials used in the electron beam (EB) deposition method, which is being studied as one of the fabrication methods of thermal barrier coating, are exposed to high power electron beam at focused area during the EB deposition. Therefore the coating source for EB process is needed to form as ingot with appropriate density and microstructure to sustain their shape and stable melts status during EB deposition. In this study, we tried to find the optimum powder condition for fabrication of ingot of 8 wt% yttria stabilized zirconia which can be used for EB irradiation. It seems that the ingot, which is fabricated through bi-modal type initial powder mixture which consists of tens of micro and nano size particles, was shown better performance than the ingot which is fabricated using monolithic nanoscale powder when exposed to high power EB.

• Journal of the Institute of Electronics Engineers of Korea SD
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• 제41권11호
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• pp.29-34
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• 2004

This paper reports the RF dispersion and linearity characteristics of unpassivated AlGaN/InGaN/GaN high electron-mobility transistors (HEMTs) grown by molecular beam epitaxy (MBE). The devices with a 0.5 ${\mu}{\textrm}{m}$ gate-length exhibited relatively good DC characteristics with a maximum drain current of 730 mA/mm and a peak g$_{m}$ of 156 mS/mm. Highly linear characteristic was observed by relatively flat DC transconductance (g$_{m}$) and good inter-modulation distortion characteristics, which indicates tight channel carrier confinement of the InGaN channel. Little current collapse in pulse I-V and load-pull measurements was observed at elevated temperatures and a relatively high power density of 1.8 W/mm was obtained at 2 GHz. These results indicate that current collapse related with surface states will not be a power limiting factor for the AlGaN/InGaN HEMTs.

• Design & Manufacturing
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• 제14권2호
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• pp.62-68
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• 2020

Recently, research on precise parts required in aerospace, ship, and automobile industries has been actively conducted. In this paper, electron beam drilling machining parameters were selected and experiments were conducted to compare processing characteristics analysis according to machining parameters through machining experiments of a vaporization amplification sheet to which STS 304 was applied. Also, as a result of measuring the machining. As the thickness gradually increased, it was confirmed that the electron beam could not reach the vaporization amplification sheet and thus melted on the surface of the material. As a result of the experimental analysis, it was analyzed that the vaporization explosion reaction of the vaporization amplification sheet was not normally performed due to the working distance (WD) according to the material thickness.

• Proceedings of the KIEE Conference
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1554-1555
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• 2006

We have studied the backward wave oscillator, a power pulsed generator oscillator at 20 GHz has higher frequency then current one. An absolute instability linear analysis was used for the purpose of designing the slow wave structure. A large diameter of the slow wave structure was adopted to prevent the breakdown brought about by the increase of power density.

• Journal of the Korean Vacuum Society
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• 제6권4호
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• pp.354-358
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• 1997

Crystal properties of wurtzite GaN films grown on $Al_2O_3$(0001) substrates under various nitrogen pressure and plasma power by electron cyclotron resonance molecular beam epitaxy were investigated by full width at half maximum of X-ray diffraction peak and scanning electron microscope. It was found that the nitrogen pressure has a large effect on the FWHM value of XRD, and the GaN film grown under the optimum nitrogen pressure contains high density of dislocations. These results suggest that the crystal quality is sensitive to the plasma source conditions and that the relaxation of stress depends of V/III ratio. However, substrate-surface nitridation has little effect on the relaxation of misfit stress.

• Proceedings of the KWS Conference
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.612-619
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• 2002

The dynamic behavior of Al-Mg alloys plasma was very unstable and this instability was closely related to the unstable motion of keyhole during laser irradiation. The keyhole fluctuated both in size and shape and its fluctuation period was about 440 ${\mu}{\textrm}{m}$. This instability has been estimated to be caused by the evaporation phenomena of metals with different boiling point and latent heats of vaporization. Therefore, the authors have conducted the spectroscopic diagnostics of plasma induced in the pulsed YAG laser welding of Al-Mg alloys in air and argon atmospheres. In the air environment, the identified spectra were atomic lines of Al, Mg, Cr, Mn, Cu, Fe and Zn, and singly ionized Mg line, as well as strong molecular spectrum of AlO, MgO and AIH. It was confirmed that the resonant lines of Al and Mg were strongly self-absorbed, in particular in the vicinity of pool surface. The self-absorption of atomic Mg line was more eminent in alloys containing higher Mg. These facts showed that the laser-induced plasma was relatively a low temperature and high density metallic vapor. The intensities of molecular spectra of AlO and MgO were different each other depending on the power density of laser beam. Under the low power density irradiation condition, the MgO band spectra were predominant in intensity, while the AlO spectra became much stronger in higher power density. In argon atmosphere the band spectra of MgO and AlO completely vanished, but AlH molecular spectra was detected clearly. The hydrogen source was presumably the hydrogen solved in the base Metal, absorbed water on the surface oxide layer or H$_2$ and $H_2O$ in the shielding gas. The temporal change in spectral line intensities was quite similar to the fluctuation of keyhole. The time average plasma temperature at 1 mm high above the surface of A5083 alloy was determined by the Boltzmann plot method of atomic Cr lines of different excitation energy. The obtained electron temperature was 3, 280$\pm$150 K which was about 500 K higher than the boiling point of pure aluminum. The electron number density was determined by measuring the relative intensities of the spectra1lines of atomic and singly ionized Magnesium, and the obtained value was 1.85 x 1019 1/㎥.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.287-287
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• 2011

ITRS(international technology roadmap for semiconductors)에 따르면 MOS (metal-oxide-semiconductor)의 CD(critical dimension)가 45 nm node이하로 줄어들면서 poly-Si/SiO2를 대체할 수 있는 poly-Si/metal gate/high-k dielectric이 대두되고 있다. 일반적으로 metal gate를 식각시 정확한 CD를 형성시키기 위해서 plasma를 이용한 RIE(reactive ion etching)를 사용하고 있지만 PIDs(plasma induced damages)의 하나인 PICD(plasma induced charging damage)의 발생이 문제가 되고 있다. PICD의 원인으로 plasma의 non-uniform으로 locally imbalanced한 ion과 electron이 PICC(plasma induced charging current)를 gate oxide에 발생시켜 gate oxide의 interface에 trap을 형성시키므로 그 결과 소자 특성 저하가 보고되고 있다. 그러므로 본 연구에서는 이에 차세대 MOS의 metal gate의 식각공정에 HDP(high density plasma)의 ICP(inductively coupled plasma) source를 이용한 중성빔 시스템을 사용하여 PICD를 줄일 수 있는 새로운 식각 공정에 대한 연구를 하였다. 식각공정조건으로 gas는 HBr 12 sccm (80%)와 Cl2 3 sccm (20%)와 power는 300 w를 사용하였고 200 eV의 에너지로 식각공정시 TEM(transmission electron microscopy)으로 TiN의 anisotropic한 형상을 볼 수 있었고 100 eV 이하의 에너지로 식각공정시 하부층인 HfO2와 높은 etch selectivity로 etch stop을 시킬 수 있었다. 실제 공정을 MOS의 metal gate에 적용시켜 metal gate/high-k dielectric CMOSFETs의 NCSU(North Carolina State University) CVC model로 effective electric field electron mobility를 구한 결과 electorn mobility의 증가를 볼 수 있었고 또한 mos parameter인 transconductance (Gm)의 증가를 볼 수 있었다. 그 원인으로 CP(Charge pumping) 1MHz로 gate oxide의 inteface의 분석 결과 이러한 결과가 gate oxide의 interface trap양의 감소로 개선으로 기인함을 확인할 수 있었다.