• Journal of the Korean Ceramic Society
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• v.40 no.4
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• pp.350-353
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• 2003

Millimeter-wave dielectric ceramics have been used like applications for ultrahigh speed wireless LAN because it reduces the resources of electromagnetic wave, and Intelligent Transport System (ITS) because of straight propagation wave. For millimeterwave, the dielectric ceramics with high quality factor (Q$.$f), low dielectric constant($\varepsilon$), and nearly zero temperature coefficient of resonant frequency ($\tau$) are needed. No microwave dielectric ceramics with these three properties exist except Ba(Mg$\_$1/3/Ta/sub1/3/)O$_3$ (BMT), which has a little high s: In this paper, alumina (Al$_2$O$_3$) and fosterite (Mg$_2$SiO$_4$), candidates for millimeter-wave applications, were studied with an objective to get high q$.$f and nearly zero $\tau$$\_$f/ For alumina ceramics, q$.$f more than 680,000 GHz was obtained but it was difficult to obtain nearly zero Qf. On the other hand, for forsterite ceramics, q$.$f was achieved from 10,000 GHz of commercial for sterite to 240,000 GHz of highly purified MgO and SiO$_2$ raw materials, and $\tau$$\_$f/ was reduced a few by adding TiO$_2$ with high positive $\tau$$\_$f/.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.36-38
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• 2005

This study is about how to lower the driving voltage that enables to move the micro droplet by the EWOD (Electro Wetting On Dielectric) mechanism. EWOD is well known that it is used ${\mu}-TAS$ digital micro fluidics system. As the device which is fabricated with dielectric layer between electrode and micro droplet is applied voltage, the hydrophobic surface is changed into the hydrophilic surface by electrical property. Therefore, EWOD induces the movement of micro droplet with reducing contact angle of micro droplet. The driving voltage was depended on the dielectric constant of dielectric layer, thus it can be reduced by increase of dielectric constant. Typically, very high voltage ($100V{\sim}$) is used to move the micro droplet. In previous study, we used $Ta_{2}O_{5}$ as the dielectric layer and driving voltage was 23V that reduced 24 percent compared with $SiO_2$. In this study, we used $BZN(Bi_{2}O_{3}ZnO-Nb_{2}O_{5})$ layer which had high dielectric constant. It was operated the just 12V. And micro droplet was moved within Is on 15V. It was reduced the voltage until 35 percents compare with $Ta_{2}O_{5}$ and 50 percents compare with $SiO_2$. The movement of micro droplet within 1s was achieved with BZN (ferroelectrics)just on 15V.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.207-207
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• 2008

Modern industry has focused on processing that produce low- loss dielectric substrates used complex micron-sized devices using tick film technologies such as tape casting and slip casting. However, these processes have inherent disadvantages fabricating high density interconnect with embedded passives for high speed communication electronic devices. Here, we have successfully fabricated porous alumina dielectric layer infiltrated with polymer solution by using inkjet printing process. Alumina suspensions were formulated as dielectric ink that were optimized to use in inkjet process. The layer was confirmed by field emission scanning electron microscope (FE-SEM) for measuring microstructure and volume fraction. In addition, the reaction kinetics and electrical properties were characterized by FT-IR and the impedance analyzer. The volume fraction of alumina in porous dielectric alumina layer is around 70% much higher than that in the conventional process. Furthermore, after infiltration on the dielectric layer using polymer resins such as cyanate ester. Excellent Q factors of the dielectric is about 200 when confirmed by impedance analyzer without any high temperature process.

• Macromolecular Research
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• v.15 no.2
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• pp.114-128
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• 2007

Polyimides are one of the most important classes of polymers used in the microelectronics and photoelectronics industries. Because of their high thermal stability, chemical resistance, and good mechanical and electric properties, polyimides are often applied in photoresists, passivation and dielectric films, soft print circuit boards, and alignment films within displays. Recently, fully aliphatic and alicyclic polyimides have found applications as optoelectronics and inter layer dielectric materials, due to their good transparencies and low dielectric constants $(\varepsilon)$. The low molecular density, polarity and rare probability of forming inter- or intra-molecular charge transfers, resulting in lowering of the dielectric constant and high transparency, are the most striking characteristics of aliphatic polyimide. However, the ultimate end use of polyimides derived from aliphatic monomers is in their targeted applications that need less stringent thermal requirements. Much research effort has been exerted in the development of aliphatic polyimide with increased thermal and mechanical stabilities, while maintaining their transparencies and low dielectric constants, by the incorporation of rigid moieties. In this article, the recent research process in synthesizing fully aliphatic polyimides, with improved dimensional stability, high transparency and low $\delta$values, as well as the characterizations and future scope for their application in micro electric and photo-electronic industries, is reviewed.

• Journal of the Korean Ceramic Society
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• v.30 no.5
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• pp.365-372
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• 1993

Variation of dielectric constant in PMN-Pyrochlore diphasic mixtures were investigated with grain size of pyrochlore phase. Size of pyrochlore phase was controlled by the numbers of calcining and sedimentation method during powder processing. When grain size of pyrochlore phase is large in the sintered specimen, dielectric constant slowly decreased with increase of amount of pyrochlore phase. On the contary, grain size of pyrochlore phase is small, dielectric constant drastically decreased. It was thought that small sized pyrochlore grains more easily surrounded high dielectric phase (perovskite PMN) than large ones with addition of pyrochlore phase.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.826-828
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• 2003

With a new PDP transparent dielectric layer formation technique, we were able to make dielectric layer with high transmittance by using dry film type dielectric material. We optimized dielectric pastes for dry film and they showed good process properties in lamination , drying and firing.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1444-1446
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• 2009

The atmospheric pressure plasma polymerization of acrylate monomers was carried out to have dielectrics with easy preparation and high performance. The effects of discharge power, monomer concentration and deposition time on film properties were investigated using various characterization tools. With proper conditions, smooth dielectric layer of 100nm thickness was obtained. Dielectric property as organic dielectric layer has been studied for future applications in organic thin film transistors(OTFT).

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.727-729
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• 2007

Inorganic-organic hybrid polymer provides various advantages including low-temperature process, high dielectric constant and direct photo-patterning. The hybrid dielectric was synthesized by the sol-gel process in which an acid-catalyzed solution of Si alkoxide and Zr alkoxide was used as a precursor. The electrical performance of transistors with hybrid dielectric was investigated.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.201-212
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• 2005

[ $Epoxy/BaTiO_3$ ] composite embedded capacitor films (ECFs) were newly designed fur high dielectric constant and low tolerance (less than ${\pm}15\%$) embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of specially formulated epoxy resin and latent curing agent, and in terms of coating process, a comma roll coating method is used for uniform film thickness in large area. Dielectric constant of $BaTiO_3\;&\;SrTiO_3$ composite ECF is measured with MIM capacitor at 100 kHz using LCR meter. Dielectric constant of $BaTiO_3$ ECF is bigger than that of $SrTiO_3$ ECF, and it is due to difference of permittivity of $BaTiO_3\;and\;SrTiO_3$ particles. Dielectric constant of $BaTiO_3\;&\;SrTiO_3$ ECF in high frequency range $(0.5\~10GHz)$ is measured using cavity resonance method. In order to estimate dielectric constant, the reflection coefficient is measured with a network analyzer. Dielectric constant is calculated by observing the frequencies of the resonant cavity modes. About both powders, calculated dielectric constants in this frequency range are about 3/4 of the dielectric constants at 1 MHz. This difference is due to the decrease of the dielectric constant of epoxy matrix. For $BaTiO_3$ ECF, there is the dielectric relaxation at $5\~9GHz$. It is due to changing of polarization mode of $BaTiO_3$ powder. In the case of $SrTiO_3$ ECF, there is no relaxation up to 10GHz. Alternative material for embedded capacitor fabrication is $epoxy/BaTiO_3$ composite embedded capacitor paste (ECP). It uses similar materials formulation like ECF and a screen printing method for film coating. The screen printing method has the advantage of forming capacitor partially in desired part. But the screen printing makes surface irregularity during mask peel-off, Surface flatness is significantly improved by adding some additives and by applying pressure during curing. As a result, dielectric layer with improved thickness uniformity is successfully demonstrated. Using $epoxy/BaTiO_3$ composite ECP, dielectric constant of 63 and specific capacitance of 5.1nF/cm2 were achieved.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.63 no.4
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• pp.301-306
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• 2014

Recently in accordance with the rapid development of the industrial society, the accidents caused by dielectric breakdown have been increasing in power grid. It is important to prevent the dielectric breakdown of a high voltage apparatus to reduce the damage from electrical hazards. To establish an electrically reliable database of insulation design criteria for high voltage apparatus, a study on dielectric characteristics test is indispensable. In this study, dielectric characteristics according to field utilization factors (${\xi}$) which are represented as the ratio of mean electric field to maximum electric field are investigated. the dielectric breakdown experiments by using several kinds of electrode systems made with stainless steel are performed by AC breakdown voltage under air-insulation. Also, the experimental results are analyzed by the Weibull distribution. As a result, it is found that the dielectric characteristics of air-insulation are determined by ${\xi}$ as well as arrangement of electrode systems. It is considered that the results of this study would be applicable to designing the air-insulated high voltage apparatuses.