• International Journal of Highway Engineering
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• v.18 no.3
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• pp.59-65
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• 2016

PURPOSES : This paper aims to develop a road pavement de-icing system using carbon sheet to replace the older snow de-icing method. Carbon sheet is a light and high-strength metal. Hence, various bodies of research for its applications in many industries have progressed. METHODS : The experiment was conducted in a laboratory. The carbon sheet supplied voltage through a power supply system, and produced heat transfers to the concrete surface. Various factors, such as pavement material, carbon sheet width, penetration depth, and freezing-thawing resistance, were considered in the conducted experiments to confirm the heating transfer efficiency of the carbon sheet. RESULTS : The carbon sheet used was a conductor. Therefore, it produced heat if voltage was supplied. The exposed carbon sheet on the atmosphere did not affect the carbon sheet width when it provided constant voltage. However, the sheet showed different heating behaviors by width change when the carbon sheet penetrated into the concrete. Moreover, the freezing-thawing resistance was decreased by the carbon sheet with increasing width. CONCLUSIONS : The experiments confirmed the possibility of developing a road snow melting system using a carbon sheet. The antiicing system using the carbon sheet to replace the traditional anti-icing system has disadvantages of environmental pollution risk and electric leakage. The pavement also improved its toughness resistance. The utilization value will be very high in the future if carbon sheet heat loss can be minimized and durability is improved.

• Progress in Superconductivity and Cryogenics
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• v.16 no.4
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• pp.66-70
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• 2014

The superconducting fault current limiter (SFCL) is an electrical power system device that detects the fault current automatically and limits the magnitude of the current below a certain safety level. The SFCL module does not have any electrical resistance below the critical temperature, which facilitates lossless power transmission in the electric power system. Once given the fault current, however, the superconducting conductor exhibits extremely high electrical resistance, and the magnitude of the current is accordingly limited to a low value. Therefore, SFCL should be maintained at a temperature below the critical temperature, which justifies the cryogenic cooling system as a mandatory component. This report is a study which reported on the cooling system for the 154 kV-class hybrid SFCL owned by Korea Electric Power Corporation (KEPCO). Using the cryocooler, the temperature of liquid nitrogen (LN2) was lowered to 71 K. The cryostat was pressurized to 5 bars to improve the dielectric strength of nitrogen and suppress nitrogen bubble foaming during operation of SFCL. The SFCL module was immersed in the liquid nitrogen of the cryostat to maintain the superconducting state. The performance test results of the key components such as cryocooler, LN2 circulation pump, cold box, and pressure builder are shown in this paper.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Korean Journal of Materials Research
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• v.22 no.2
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• pp.61-65
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• 2012

A $Li_2O-2SiO_2$ ($LS_2$) glass was investigated as a lithium-ion conducting oxide glass, which is applicable to a fast ionic conductor even at low temperature due to its high mechanical strength and chemical stability. The $Li_2O-2SiO_2$ glass is likely to be broken into small pieces when quenched; thus, it is difficult to fabricate a specifically sized sample. The production of properly sized glass samples is necessary for device applications. In this study, we applied spark plasma sintering (SPS) to fabricate $LS_2$ glass samples which have a particular size as well as high transparency. The sintered samples, $15mm\phi{\times}2mmT$ in size, ($LS_2$-s) were produced by SPS between $480^{\circ}C$ and $500^{\circ}C$ at 45MPa for 3~5mim, after which the thermal and dielectric properties of the $LS_2$-s samples were compared with those of quenched glass ($LS_2$-q) samples. Thermal behavior, crystalline structure, and electrical conductivity of both samples were analyzed by differential scanning calorimetry (DSC), X-ray diffraction (XRD) and an impedance/gain-phase analyzer, respectively. The results showed that the $LS_2$-s had an amorphous structure, like the $LS_2$-q sample, and that both samples took on the lithium disilicate structure after the heat treatment at $800^{\circ}C$. We observed similar dielectric peaks in both of the samples between room temperature and $700^{\circ}C$. The DC activation energies of the $LS_2$-q and $LS_2$-s samples were $0.48{\pm}0.05eV$ and $0.66{\pm}0.04eV$, while the AC activation energies were $0.48{\pm}0.05eV$ and $0.68{\pm}0.04eV$, respectively.

• Journal of the Korean Ceramic Society
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• v.39 no.10
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• pp.994-1000
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• 2002

Oxygen permeability and the mechanical properties of mixed ionic-electronic conductive $La_{0.6}Sr_{0.4}Co_{0.2}Fe_{0.8}O_{3-{\delta}}$ perovskite-type membrane, fabricated by solid state reaction, were investigated with regard to microstructure. The microstructure of the membrane was controlled by changing the sintering temperature and holding time. The average grain size and relative density were evaluated as a function of sintering conditions. As the fraction of grain boundary decreased, oxygen permeability showed a tendency to increase. Especially the maximum oxygen flux of 0.37 ml/$cm^2$${\cdot}$min was measured for the specimen sintered at 1300${\circ}C$ for 10 h, which has high density and relatively large grain size. Fracture strength was dependent on the relative density of sintered body, while fracture toughness increased with average grain size.