• 제목/요약/키워드: High reactive substrate

검색결과 154건 처리시간 0.032초

Experimental Studies of Wrinkle Formation in the UV Cured Coating Around Film-Substrate Insterface (자외선 경화코팅 필름-기질 계면에서의 주름현상에 대한 연구)

  • Hong, Jin Hu;Lee, Haeng U
    • Journal of the Korean Chemical Society
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    • 제38권7호
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    • pp.480-484
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    • 1994
  • The durability of UV radiation cured coatings near the film-substrate interface has been studied. Particularly, the influence of the reactive diluent and oligomer in the UV-cured urethane acrylate formulation on the wrinkle formation of coating films was investigated. Results showed that wrinkle resistance increases when DMTA loss peaks of coating network are broad and has shoulder. When modified aromatic urethane acrylate oligomer is used to replace the aliphatic one, resulting cured network provides coating film of high hardness and flexibility. Therefore, the high values of loss modulus as low temperature are considered to be the main reason for wrinkle resistance improvements. The SEM and instron data support above conclusion.

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Fabrication of Large Area Transmission Electro-Absorption Modulator with High Uniformity Backside Etching

  • Lee, Soo Kyung;Na, Byung Hoon;Choi, Hee Ju;Ju, Gun Wu;Jeon, Jin Myeong;Cho, Yong Chul;Park, Yong Hwa;Park, Chang Young;Lee, Yong Tak
    • Proceedings of the Korean Vacuum Society Conference
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.220-220
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    • 2013
  • Surface-normal transmission electro-absorption modulator (EAM) are attractive for high-definition (HD) three-dimensional (3D) imaging application due to its features such as small system volume and simple epitaxial structure [1,2]. However, EAM in order to be used for HD 3D imaging system requires uniform modulation performance over large area. To achieve highly uniform modulation performance of EAM at the operating wavelength of 850 nm, it is extremely important to remove the GaAs substrate over large area since GaAs material has high absorption coefficient below 870 nm which corresponds to band-edge energy of GaAs (1.424 eV). In this study, we propose and experimentally demonstrate a transmission EAM in which highly selective backside etching methods which include lapping, dry etching and wet etching is carried out to remove the GaAs substrate for achieving highly uniform modulation performance. First, lapping process on GaAs substrate was carried out for different lapping speeds (5 rpm, 7 rpm, 10 rpm) and the thickness was measured over different areas of surface. For a lapping speed of 5 rpm, a highly uniform surface over a large area ($2{\times}1\;mm^2$) was obtained. Second, optimization of inductive coupled plasma-reactive ion etching (ICP-RIE) was carried out to achieve anisotropy and high etch rate. The dry etching carried out using a gas mixture of SiCl4 and Ar, each having a flow rate of 10 sccm and 40 sccm, respectively with an RF power of 50 W, ICP power of 400 W and chamber pressure of 2 mTorr was the optimum etching condition. Last, the rest of GaAs substrate was successfully removed by highly selective backside wet etching with pH adjusted solution of citric acid and hydrogen peroxide. Citric acid/hydrogen peroxide etching solution having a volume ratio of 5:1 was the best etching condition which provides not only high selectivity of 235:1 between GaAs and AlAs but also good etching profile [3]. The fabricated transmission EAM array have an amplitude modulation of more than 50% at the bias voltage of -9 V and maintains high uniformity of >90% over large area ($2{\times}1\;mm^2$). These results show that the fabricated transmission EAM with substrate removed is an excellent candidate to be used as an optical shutter for HD 3D imaging application.

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Characteristic of Tantalum Nitride Thin-films for High Precision Resistors (고정밀 저항용 질화탄탈 박막의 특성)

  • Choi, Sung-Kyu;Na, Kyung-Il;Nam, Hyo-Duk;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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    • pp.537-540
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    • 2001
  • This paper presents the characteristics of Ta-N thin-film for high precision resistors, which were deposited on Si substrate by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(4~16 %)$N_2$). Structural properties studied using X-ray diffraction(XRD) indicate the presence of TaN, $Ta_3N_5$ or a mixture of Ta-N phases in the films depending on the amount of nitrogen in the sputtering gas. The chemical composition are investigated by auger electro spectroscopy(AES). The optimized conditions of Ta-N thin-film resistors were deposited in 4 % $N_2$ gas flow ratio. Under optimum conditions, the Ta-N thin-film resistors are obtained a high resistivity, $\rho=305.7{\mu}{\Omega}cm$, a low temperature coefficient of resistance, TCR=-36 $ppm/^{\circ}C$.

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Characteristic of Tantalum Nitride Thin-films for High Precision Resistors (고정밀 저항용 질화탄탈 박막의 특성)

  • 최성규;나경일;남효덕;정귀상
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집
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    • pp.537-540
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    • 2001
  • This paper presents the characteristics of Ta-N thin-(ibm for high precision resistors, which were deposited oni substrate by DC reactive magnetorn sputtering in an argon-nitrogen atmosphere(Ar-(4∼16%)N$_2$). Sturcutural properties sutided using X-ray diffraction (XRD) indicate the presence of TaN, Ta$_3$N$\sub$5/ or a mixture of Ta-N phases in the films depending on the amount of nitrogen in the sputtering gas. The chemical composition are investigated by auger electro spectroscopy(AES). The optimized conditions of Ta-N thin-film resistors were deposited in 4 % N$_2$ gas flow ratio. Under optimum conditions, the Ta-N thin-film resistors are obtained a high resistivity, $\rho$=305.7 ${\mu}$Ωcm, a low temperature coefficient of resistance, TCR=-36 ppm/$^{\circ}C$.

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Optimization of Amorphous Indium Gallium Zinc Oxide Thin Film for Transparent Thin Film Transistor Applications

  • Shin, Han Jae;Lee, Dong Ic;Yeom, Se-Hyuk;Seo, Chang Tae
    • Proceedings of the Korean Vacuum Society Conference
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.352.1-352.1
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    • 2014
  • Indium Tin Oxide (ITO) films are the most extensively studied and commonly used as ones of TCO films. The ITO films having a high electric conductivity and high transparency are easily fabricated on glass substrate at a substrate temperature over $250^{\circ}C$. However, glass substrates are somewhat heavy and brittle, whereas plastic substrates are lightweight, unbreakable, and so on. For these reasons, it has been recently suggested to use plastic substrates for flexible display application instead of glass. Many reaearchers have tried to produce high quality thin films at rood temperatures by using several methods. Therefore, amorphous ITO films excluding thermal process exhibit a decrease in electrical conductivity and optical transparency with time and a very poor chemical stability. However the amorphous Indium Gallium Zinc Oxide (IGZO) offers several advantages. For typical instance, unlike either crystalline or amorphous ITO, same and higher than a-IGZO resistivity is found when no reactive oxygen is added to the sputter chamber, this greatly simplifies the deposition. We reported on the characteristics of a-IGZO thin films were fabricated by RF-magnetron sputtering method on the PEN substrate at room temperature using 3inch sputtering targets different rate of Zn. The homogeneous and stable targets were prepared by calcine and sintering process. Furthermore, two types of IGZO TFT design, a- IGZO source/drain material in TFT and the other a- ITO source/drain material, have been fabricated for comparison with each other. The experimental results reveal that the a- IGZO source/drain electrode in IGZO TFT is shown to be superior TFT performances, compared with a- ITO source/drain electrode in IGZO TFT.

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Preparation of Pure Cellulose Substrate from Low-Grade Woods by Autohydrolysis (저급목재의 자기가수분해 전처리에 의한 고순도 셀룰로오스 기질의 제조)

  • Cho, Nam-Seok;Kim, Byoung-Ro;Paik, Ki-Hyon
    • Journal of the Korean Wood Science and Technology
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    • 제30권4호
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    • pp.8-16
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    • 2002
  • This study was performed to produce the high reactive lignin zero substrates from autohydrolyzed wood resources. In chemical compositions of used raw-materials, there were significant differences between two species, Japanese larch (Larix leptolepis) and oak (Quercus mongolica) woods. Japanese larch contained 25 to 3.5 times higher amounts of extractives than oak wood, which is mainly derived from high content of arabinogalactan in Japanese larch wood. Oak wood has 5% lower lignin content and 3% higher holocellulose and pentosans than larch wood. Concerned to changes in wood components during autohydrolysis pretreatment at 22 kg/cm2 steaming pressure for 5~60 min, glucose content was constant during pretreatment, while hemicellulose and lignin were abruptly changed. Hemicellulose fraction was decreased significantly and lignin contents increased because of its condensation reaction with hemicellulose degradation products. The pH of hydrolyzates during pretreatment was decreased, reached upto pH 3 and since then leveled off. In the case of oak wood, same tendency was observed as in Japanese larch. Autohydrolysis followed by sodium chlorite and sulfite or bisulfite pretreatment was very effective in delignification of the substrates. In particular, two-stage delignification of autohydrolyzed woods with alkali and O2-alkali resulted in very low lignin content substrates, such as 0~0.2% lignin substrate.

Rear Surface Passivation with Al2O3 Layer by Reactive Magnetron Sputtering for High-Efficiency Silicon Solar Cell

  • Moon, Sun-Woo;Kim, Eun-Kyeom;Park, Won-Woong;Jeon, Jun-Hong;Choi, Jin-Young;Kim, Dong-Hwan;Han, Seung-Hee
    • Proceedings of the Korean Vacuum Society Conference
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.211-211
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    • 2012
  • The electrical loss of the photo-generated carriers is dominated by the recombination at the metal- semiconductor interface. In order to enhance the performance of the solar cells, many studies have been performed on the surface treatment with passivation layer like SiN, SiO2, Al2O3, and a-Si:H. In this work, Al2O3 thin films were investigated to reduce recombination at surface. The Al2O3 thin films have two advantages, such as good passivation properties and back surface field (BSF) effect at rear surface. It is usually deposited by atomic layer deposition (ALD) technique. However, ALD process is a very expensive process and it has rather low deposition rate. In this study, the ICP-assisted reactive magnetron sputtering method was used to deposit Al2O3 thin films. For optimization of the properties of the Al2O3 thin film, various fabrication conditions were controlled, such as ICP RF power, substrate bias voltage and deposition temperature, and argon to oxygen ratio. Chemical states and atomic concentration ratio were analyzed by x-ray photoelectron spectroscopy (XPS). In order to investigate the electrical properties, Al/(Al2O3 or SiO2,/Al2O3)/Si (MIS) devices were fabricated and characterized using the C-V measurement technique (HP 4284A). The detailed characteristics of the Al2O3 passivation thin films manufactured by ICP-assisted reactive magnetron sputtering technique will be shown and discussed.

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Decomposition of Toxic Chemicals in Microemulsion by Electrolytic Oxidation Method (마이크로 에멀젼 상태에서 전기분해법을 이용한 독성물질 분해 연구)

  • Shim, Sung-Hyun;Chun, Byoung-Chul;Chung, Yong-Chan
    • Clean Technology
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    • 제14권3호
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    • pp.218-223
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    • 2008
  • Decomposition of reactive organic compound dispersed in microemulsion media by hydroxide ions and proton ions generated during electrolysis was tried and the half-lifes for decomposition were compared. Absorbance of p-nitrophenoxide produced from the decomposition of p-nitrophenylacetate (PNPA) was followed to find the rate of decomposition. The applied voltage, temperature, and the amount of substrate were changed to see the effects on the decomposition rate. The advantages of electrolysis in microemulsion system were the high solubilizing capacity of substrate, easy control of decomposition rate, low operation cost, no need for any addition of chemicals, and no byproducts. The mechanism of decomposition and the application to water purification were discussed.

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Fabrication of Silicon Window for Low-price Thermal Imaging System (저가형 열영상 시스템을 위한 실리콘 윈도우 제작)

  • Sung, Byung Mok;Jung, Dong Geon;Bang, Soon Jae;Baek, Sun Min;Kong, Seong Ho
    • Journal of Sensor Science and Technology
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    • 제24권4호
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    • pp.264-269
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    • 2015
  • An infrared (IR) bolometer measures the change of resistance by absorbing incident IR radiation and generates a signal as a function of the radiation intensity. Since a bolometer requires temperature stabilization and light filtering except for the infrared rays, it is essential for the device to be packaged meeting conditions that above mentioned. Minimization of heat loss is needed in order to stabilize temperature of bolometer. Heat loss by conduction or convection requires a medium, so the heat loss will be minimized if the medium is a vacuum. Therefore, vacuum packaging for bolometer is necessary. Another important element in bolometer packaging is germanium (Ge) window, which transmits IR radiation to heat the bolometer. To ensure a complete transmittance of IR light, anti-reflection (AR) coatings are deposited on both sides of the window. Although the transmittance of Ge window is high for IR rays, it is difficult to use frequently in low-price IR bolometer because of its high price. In this paper, we fabricated IR window by utilizing silicon (Si) substrate instead of Ge in order to reduce the cost of bolometer packaging. To enhance the IR transmittance through Si substrate, it is textured using Reactive Ion Etching (RIE). The texturing process of Si substrate is performed along with the change of experimental conditions such as gas ratio, pressure, etching time and RF power.

Transition temperatures and upper critical fields of NbN thin films fabricated at room temperature

  • Hwang, T.J.;Kim, D.H.
    • Progress in Superconductivity and Cryogenics
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    • 제17권3호
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    • pp.9-12
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    • 2015
  • NbN thin films were deposited on thermally oxidized Si substrate at room temperature by using reactive magnetron sputtering in an $Ar-N_2$ gas mixture. Total sputtering gas pressure was fixed while varying $N_2$ flow rate from 1.4 sccm to 2.9 sccm. X-ray diffraction pattern analysis revealed dominant NbN(200) orientation in the low $N_2$ flow rate but emerging of (111) orientation with diminishing (200) orientation at higher flow rate. The dependences of the superconducting properties on the $N_2$ gas flow rate were investigated. All the NbN thin films showed a small negative temperature coefficient of resistance with resistivity ratio between 300 K and 20 K in the range from 0.98 to 0.89 as the $N_2$ flow rate is increased. Transition temperature showed non-monotonic dependence on $N_2$ flow rate reaching as high as 11.12 K determined by the mid-point temperature of the transition with transition width of 0.3 K. On the other hand, the upper critical field showed roughly linear increase with $N_2$ flow rate up to 2.7 sccm. The highest upper critical field extrapolated to 0 K was 17.4 T with corresponding coherence length of 4.3 nm. Our results are discussed with the granular nature of NbN thin films.