• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.124-130
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• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.8
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• pp.857-863
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• 2012

In this study, tailor-welded blanks(TWB) were formed between high-strength steel(SABC1470) and cold rolled steels(SPFH590 and SPFC980) to improve passenger safety and reduce the weight of cars. Multi-material TWB specimens were highly strengthened through the heat treatment of SABC1470. The change in tensile strength caused by the stand-by time until water cooling after stamping and the deformation behavior of high-speed bending in a statically indeterminate condition such as in the center-pillar were evaluated. Multi-material TWB specimens that were heat-treated at the same temperature tended to show a decrease in tensile and yield strength, depending on the stand-by time until water cooling. On the other hand, Multi-material TWB specimens(SABC1470+SPFH590) that were heat treated at $850^{\circ}C$ showed good properties that were suitable for ensuring passenger safety in car accidents. From the viewpoint of passenger safety, it is best to use SABC1470 and SPFH590 in the upper and lower area of the center-pillar, respectively.

• Journal of the Korean Society for Nondestructive Testing
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• v.20 no.5
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• pp.381-389
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• 2000

Metal matrix composite(MMCs) have been rapidly becoming one of the strongest candidates for structural materials for high temperature application. It is well recognized that MMCs always experience at least one large cool-down from processing temperature before my significant applied service loading. Due to the large difference in thermal expansion coefficient between the fiber and matrix, large thermal residual stresses generally develop in composites. It was reported from many previous studies that the effects of thermal residual stress on mechanical properties and fracture behavior were much more complex and dramatic than conventional engineering materials. Therefore it is crucial to evaluate the effect of heat treatment which changes the characteristic of distribution of thermal residual stress in MMCs. Single fiber composite(SFC) test based on the balance in a micromechanical model is a quite convenient method to evaluate interfacial shear strength(IFSS) and the failure mode of composite. In this study the effect of heat treatment on IFSS and the microscopic failure mechanism of MMC is investigated by combining acoustic emission(AE) technique with SFC test. The characteristic of AE signal, IFSS and microscopic failure mechanism due to heat treatment condition is discussed.