• 한국재료학회지
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• 제9권12호
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• pp.1176-1180
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• 1999

Polyetherimide와 실리콘 사이의 RIE 처리 및 알루미늄 킬레이트 계열의 adhesion promoter 처리에 따른 접착력과 고온고습환경에서의 신뢰성 변화를 연구하였다. 실험 방법으로는 180$^{\circ}$ 필 테스트 및 <85$^{\circ}C$ 85%> 테스트, SEM, AFM, 증류수 접촉각 실험이 수행되었다. $^O_2$ RIE 실험 결과 초기 접착력은 RIE 처리시간에 따라 약간의 변화를 가져왔으나 고온고습 환경에서의 저항성은 급격히 떨어지는 것이 관찰되었고 이것은 표면 거칠기의 영향이 아닌 표면의 친수성 정도에 따른 것으로 나타났다. Al-chelate adhesion promoter의 경우 초기 접착력에는 변화가 없으나 고온 고습환경에서의 저항성이 크게 증가하였는데 이것은 표면이 소수성으로 변한 데 따른 것으로 나타났다.

• 대한구순구개열학회지
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• 제7권1호
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• pp.1-16
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• 2004

본 연구에서는 구순접합술의 효과를 알아보기 위하여, 일측성 완전구순열을 가진 5명의 환아에서 Millard의 high haU-underminded adhesion과 Seibert 의 lip adhesion을 이용한 구순접합술후 Millard 변법을 이용한구순성형술을 시행하였다. 구순접합술은 상악치조분절 간의 관계를 개선해 주고 구순성형술을 쉽게해주며 최종적인 구순성형술 후 더욱 좋은 결과를 나타냈다. High kalf-underminded adhesion과 Seibert의 lip adhesion은 둘 다 넓은 구순열을 하는데 유용한 방법이며, 특히 Seibert의 lip ahesion은 강한 접합력을 얻을 수 있고 변위된 비중격의 개선 효과가 있으며 보다 심미적인 상순의 연속성을 얻게 해 주었다. 이상의 결과에서 넓은 완전구순열 환아에서 구순성형술에 앞서 구순접합술을 시행하면 상악치조분절 간의 관계를 개선시키고 구순성형술 후 최종적인 결과를 향상시킴을 알 수 있다.

• 한국재료학회지
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• 제19권8호
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• pp.437-442
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• 2009

This paper describes an improved strategy for controlling the adhesion force using both the antiadhesion and adhesion layers for a successful large-area transfer process. An MPTMS (3-mercaptopropyltrimethoxysilane) monolayer as an adhesion layer for Au/Pd thin films was deposited on Si substrates by vapor self assembly monolayer (VSAM) method. Contact angle, surface energy, film thickness, friction force, and roughness were considered for finding the optimized conditions. The sputtered Au/Pd ($\sim$17 nm) layer on the PDMS stamp without the anti-adhesion layer showed poor transfer results due to the high adhesion between sputtered Au/Pd and PDMS. In order to reduce the adhesion between Au/Pd and PDMS, an anti-adhesion monolayer was coated on the PDMS stamp using FOTS (perfluorooctyltrichlorosilane) after $O_2$ plasma treatment. The transfer process with the anti-adhesion layer gave good transfer results over a large area (20 mm $\times$ 20 mm) without pattern loss or distortion. To investigate the applied pressure effect, the PDMS stamp was sandwiched after 90$^{\circ}$ rotation on the MPTMS-coated patterned Si substrate with 1-${\mu}m$ depth. The sputtered Au/Pd was transferred onto the contact area, making square metal patterns on the top of the patterned Si structures. Applying low pressure helped to remove voids and to make conformal contact; however, high pressure yielded irregular transfer results due to PDMS stamp deformation. One of key parameters to success of this transfer process is the controllability of the adhesion force between the stamp and the target substrate. This technique offers high reliability during the transfer process, which suggests a potential building method for future functional structures.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2014년도 춘계 학술논문 발표대회
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• pp.96-97
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• 2014

The purpose of this study is to analyze the adhesion strength of metal spray coating system in steel using high-frequency arc metal spray method. For the purpose the experimental factor such as surface roughness was selected at 3 levels. As a result of experiment, it appeared that high-frequency arc metal spray method had higher adhesion strength than existing metal spray method. Especially, Al-Mg showed the highest adhesion strength than other metals. In case of surface roughness, the higher roughness steel has, the higher adhesion strength appeared.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
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• 제51권1호
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• pp.40-47
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• 2002

This paper describes a re-adhesion control method for the Korean High-Speed Train (KHST) with parallel induction motor drive. To keep a traction efficiency and to improve vehicle maintenance, the adhesion characteristics between wheel and rail are analyzed. Also the re-adhesion controller is designed as the subsystem of induction motor vector control. In order to verify performance of the proposed control techniques, the simulation is executed by train model and a downscaled re-adhesion control simulator is utilized. Both simulation and running test results show that good re-adhesion characteristics are obtained.

• 대한기계학회논문집A
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• 제29권6호
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• pp.804-808
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• 2005

A pneumatic tire is made up of many flexible filaments of high modulus cord of natural textile, synthetic polymer, glass fiber, or fine hard drawn steel embedded in and bonded to a matrix of low modulus polymetric material. Adhesion property of these materials is very important in tire durability safety because belt-leaving-belt tread separation reduces the ability of a driver to control a vehicle, whether or not the separation is accompanied by a loss of air. In this study adhesion test of carcass-belt-tread is conducted on material properties of 5 PCR tire model, which are on sale in domestic market and analyzed adhesion properties. For those tire models FMVSS 109 indoor high speed durability test is conducted to analyze the correlation between adhesion force and high speed performance of tires and found the correlation between the two test results.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2023년도 가을학술발표대회논문집
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• pp.179-180
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• 2023

The adhesion performance of PCCs for crack repair of RC structures was greater in the case of using ultra high-early strength cement than in the case of using ordinary Portland cement, and the effect of mixing silica fume was higher in the case of ordinary Portland cement than that of ultra high-early strength cement. On the other hand, 130% of W/C was more fluid than 80% of W/C in the same P/C 80%, which increased the fillability and improved the strength, but the strength improvement effect was the greatest in adhesion in flexure. Through this study, the basic characteristics of the adhesion performance of PCCs were identified, and based on this, it is necessary to induce an optimal mixing design that can increase adhesion performance through various mixing designs.

• Journal of the Korean Wood Science and Technology
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• 제38권2호
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• pp.117-123
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• 2010

The objective of this research was executed to investigate the effect of molar ratio of formaldehyde to urea and melamine (F/(U+M)) of urea-melamine-formaldehyde (UMF) resin on bonding high and low moisture content veneers. For that purpose, UMF resin types with 5 different F/(U+M) molar ratios (1.45, 1.65, 1.85, 2.05, and 2.25) synthesized were used in present study. First, their curing behavior was evaluated by differential scanning calorimetry. Second, their adhesion performance in bonding high and low moisture content veneers was evaluated by probe tack and dry and wet shear strength tests. Curing temperature and reaction enthalpy decreased with the increase of F/(U+M) molar ratio. And the dry and wet shear strengthsof plywood manufactured from low moisture content veneers were higher than thoseof plywood manufactured from high moisture content veneers. Also, the maximum initial tack force on the low moisture content veneer was higher than that on the high moisture content veneer.

• 열처리공학회지
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• 제3권1호
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• pp.17-24
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• 1990

In this study, TiN film was deposited onto steel by R.F.-PACVD in order to investigate the influence of parameters on the adhesion strength between film and substrate. Experimental results showed that adhesion strength by SAT is different from by optical microscopy. Adhesion strength is increased when the deposition temperature increases and is influenced by R.F. power and electrode distance. Especially heat treatment on the substrate has influenced over the adhesion strength, so it showed the 22 Newtons in adhesion strength by SAT and adhesion strength is decreased when deposition thickeness is thick and hardness is high. Also if the film is thick and high hardness simultaneous, the film was delaminated seriously.

• E2M - 전기 전자와 첨단 소재
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• 제9권7호
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• pp.727-732
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• 1996

In the present paper, the Cu films 4.mu.m thick were deposited by RF magnetron sputtering method on Si wafer. The Cu films deposited at a condition of 100W, 10mtorr exhibited a low electrical resistivity of 2.3.mu..ohm..cm and densed microstructure, poor adhesion. The Cu films grown by 200W, 20mtorr showed a good adhesion property and higher electrical resistivity of 7.mu..ohm..cm because of porous columnar microstructure. Therefore, The Cu films were deposited by double layer deposition method using RF magnetron sputtering on Si wafer. The dependence of the electrical resistivity, adhesion, and reflectance in the CU films [C $U_{4-d}$(low resistivity) / C $U_{d}$(high adhesion) / Si-wafer] on the thickness of d has been investigated. The films formed with this deposition methods had the low electrical resistivity of about 2.6.mu..ohm..cm and high adhesion of about 700g/cm.m.m.