• 한국자동차공학회논문집
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• 제21권6호
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• pp.81-91
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• 2013

A novel design process of a parallel multi-flow type air-cooled condenser of a dual-loop waste heat recovery system with Rankine steam cycles for improving the fuel efficiency of gasoline automobiles has been investigated focusing on reduction of the pressure drop inside the micro-tubes. The low temperature condenser plays a role to dissipate heat from the system by condensing the low temperature loop working fluid sufficiently. However, the refrigerant has low evaporation temperature enough to recover the waste from engine coolant of about $100^{\circ}C$ but has small saturation enthalpy so that excessive mass flow rate of the LT working fluid, e.g., over 150 g/s, causes enormously large pressure drop of the working fluid to maintain the heat dissipation performance of more than 20 kW. This paper has dealt with the scheme to design the low temperature condenser that has reduced pressure drop while ensuring the required thermal performance. The number of pass, the arrangement of the tubes of each pass, and the positions of the inlet and outlet ports on the header are most critical parameters affecting the flow uniformity through all the tubes of the condenser. For the purpose of the performance predictions and the parametric study for the LT condenser, we have developed a 1-dimensional user-friendly performance prediction program that calculates feasibly the phase change of the working fluid in the tubes. An example is presented through the proposed design process and compared with an experiment.

• 한국자동차공학회논문집
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• 제19권6호
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• pp.61-67
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• 2011

The cooling module needs enough space (or distance) from hood to absorb the energy from any pedestrian collision. Downsized cooling module for pedestrian protection is important to reduce the severity of pedestrian injury. When a vehicle collision happens, the downsized cooling module is required to reduce the risk of injury to the upper legs of adults and the heads of children. In this study, the performance of cooling module to cool the engine was investigated under 25% height reduction. The heat dissipation and pressure drop characteristics have been experimentally studied with the variation of coolant flow rate, air inlet velocity and A/C operation ON/OFF for the downsized cooling module. The results indicated that the cooling performance was about 94% level compared to that of the conventional cooling module. Therefore, we checked that the cooling module had good performance, and expected that the cooling module could meet the same cooling performance as conventional cooling module through optimization of components efficiency.

• 한국인터넷방송통신학회논문지
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• 제22권5호
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• pp.99-103
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• 2022

밀리미터파 추적 레이더는 다양한 환경조건에서 운용하므로 입력전압의 큰 변동에도 안정적인 출력전원을 공급하는 전원공급기가 필요하며, 송수신기에 고품질의 전원공급을 위해 낮은 잡음레벨 특성을 가져야 한다. 본 논문에서는 Ka-대역 추적 레이더에 적용하기 위한 최대 출력 727 W급의 소형 전원공급기 설계 및 구현방안에 대해 기술한다. 전압안정도 및 효율 요구사항을 충족하기 위해 buck 타입의 DC-DC 컨버터의 윗면이 전원공급기의 커버와 맞닿게 배치하여 방열효율을 극대화하였다. 최대 부하 조건에서 시스템 효율 88.4 %, 전압정밀도 ±2 %, 잡음레벨은 전압값의 1 % 이내임을 확인하였다.

• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.323-323
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• 2013

High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

• 한국산학기술학회논문지
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• 제22권3호
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• pp.199-207
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• 2021

본 연구는 한국형고속철도(KTX)의 제동장치의 국산화를 통한 성능 개선을 위한 목적으로 수행되었다. 본 연구에서 기존 수입에 의존하고 있는 고속철도용 제동 디스크 허브를 국산화하기 위하여 유한요소 해석을 통해 성능을 분석하고 제동 시험결과와 상관도 분석을 통해 모델의 검증을 수행하였다. 또한, 제동시 발생할 수 있는 기계적인 특성을 검토하기 위하여 마찰열에 의한 열전달-열응력 해석, 고유진동해석 및 강도해석을 수행하였다. 디스크 허브 국산화 신규 모델의 개발을 위해 형상에 따른 설계 인자를 도출하고 파라미터 해석을 수행하여 방열성능을 향상시키고 경량화를 위한 최적 사양을 도출하고자 하였다. 개발 모델을 기존 모델과 비교한 결과 기존 모델 대비 제동시 발생하는 허브의 최고 온도가 낮아졌으며, 냉각 효율이 향상되었음 확인할 수 있었다. 또한, 고유진동수 및 강도 특성 또한 동등 수준 이상의 성능을 확보한 설계임을 확인하였다. 본 연구 결과는 철도차량 및 수송기기 분야의 제동 디스크 시스템 개발에 활용될 수 있을 것으로 기대된다.

• 전기전자학회논문지
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• 제26권4호
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• pp.671-680
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• 2022

본 논문에서는 현재 출시되어 있는 전기차의 구동모터 사양을 대부분 포괄하는 200kW급 구동용 모터드라이버를 개발하였다. 고효율ㆍ고전력밀도를 달성하기 위해 기존 전력반도체(Insulated-gate bipolar transistor, IGBT)대신에 차세대 전력반도체(Silicon carbide, SiC)를 적용하였으며 SiC를 최적사용하기 위해 하드웨어에 대한 분석을 통해, 예상되는 효율 및 방열특성을 구하여 최적 설계를 하였다. 전기차 구동모터에 대부분 활용되는 매입형 영구자석 동기모터(Interior permanent-magnet synchronous machine, IPMSM)를 위한 벡터 제어 알고리즘을 DSP를 활용하여 구현하였다. 본 논문에서는 SiC기반 전기차 구동용 모터드라이버 시작품을 설계ㆍ제작하였으며 실험을 통해 성능을 검증하였다.

• Journal of international Conference on Electrical Machines and Systems
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• 제1권4호
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• pp.498-504
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• 2012

The water-cooled Permanent Magnet Linear Synchronous Motor (PMLSM) has a wide range of applications due to high efficiency, high thrust force density and high acceleration. In order to ensure normal operation and maximum output, both the magnetic and thermal performance are vital to be considered. Based on ANSYS software, electromagnetic and thermal finite-element analysis (FEA) models of a 14-pole, 12-slot water-cooled PMLSM are erected adopting suitable assumptions. Firstly, the thrust force and force ripple with different current densities are calculated. Secondly, the influence of different water flow on the motor heat dissipation and force performance under different operationional conditions are investigated and optimized. Furthermore, for continuous operation, the temperature rise and thrust feature are studied under the rated load 8A, the proper temperature $120^{\circ}C$ and the limited temperature $155^{\circ}C$. Likewise, for short-time operation, the maximum duration is calculated when applied with a certain large current. Similarly, for intermittent operation, load time as well as standstill time are determined with the optimal current to achieve better thrust performance.

• 조명전기설비학회논문지
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• 제29권4호
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• pp.1-10
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• 2015

The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

• 한국자동차공학회논문집
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• 제21권5호
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• pp.145-150
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• 2013

Recently, many vehicles have applied electric parts for saving fuel consumption and reducing levels of environmental pollution. ISG (integrated starter & generator) is one of main electric parts and can improve fuel efficiency by using idle stop & go function and regenerative braking system. However, if ISG driving inverter works under the continuously high load condition, it will make the performance and durability of the inverter decreased with rising temperature. In this study, we carried out the analysis on the fluid flow and thermal characteristics of the inverter. As a result, we found the MOSFET of the air cooled inverter was increased up to $116^{\circ}C$ over the limit temperature. On the other hand, the liquid cooled type inverter's MOSFET was decreased by about $17^{\circ}C$ compared to that of the air cooled inverter. Therefore, we verified the feasibility of the liquid cooled type using the present cooling structure.