• Title/Summary/Keyword: Heat dissipation efficiency

Search Result 65, Processing Time 0.033 seconds

A Design Process for Reduction of Pressure Drop of Air-cooled Condenser for Waste Heat Recovery System (폐열 회수 시스템용 공랭식 응축기의 압력 손실 저감 설계)

  • Bae, Sukjung;Heo, Hyungseok;Park, Jeongsang;Lee, Hongyeol;Kim, Charnjung
    • Transactions of the Korean Society of Automotive Engineers
    • /
    • v.21 no.6
    • /
    • pp.81-91
    • /
    • 2013
  • A novel design process of a parallel multi-flow type air-cooled condenser of a dual-loop waste heat recovery system with Rankine steam cycles for improving the fuel efficiency of gasoline automobiles has been investigated focusing on reduction of the pressure drop inside the micro-tubes. The low temperature condenser plays a role to dissipate heat from the system by condensing the low temperature loop working fluid sufficiently. However, the refrigerant has low evaporation temperature enough to recover the waste from engine coolant of about $100^{\circ}C$ but has small saturation enthalpy so that excessive mass flow rate of the LT working fluid, e.g., over 150 g/s, causes enormously large pressure drop of the working fluid to maintain the heat dissipation performance of more than 20 kW. This paper has dealt with the scheme to design the low temperature condenser that has reduced pressure drop while ensuring the required thermal performance. The number of pass, the arrangement of the tubes of each pass, and the positions of the inlet and outlet ports on the header are most critical parameters affecting the flow uniformity through all the tubes of the condenser. For the purpose of the performance predictions and the parametric study for the LT condenser, we have developed a 1-dimensional user-friendly performance prediction program that calculates feasibly the phase change of the working fluid in the tubes. An example is presented through the proposed design process and compared with an experiment.

Studies on the Performance Evaluation of Downsized High-efficiency Cooling Module (높이 축소형 고효율 냉각모듈의 성능 평가에 관한 연구)

  • Jung, Jung-Hun;Shin, Yoon-Hyuk;Park, Sung-Wook;Jeong, Sun-An;Kim, Sung-Chul
    • Transactions of the Korean Society of Automotive Engineers
    • /
    • v.19 no.6
    • /
    • pp.61-67
    • /
    • 2011
  • The cooling module needs enough space (or distance) from hood to absorb the energy from any pedestrian collision. Downsized cooling module for pedestrian protection is important to reduce the severity of pedestrian injury. When a vehicle collision happens, the downsized cooling module is required to reduce the risk of injury to the upper legs of adults and the heads of children. In this study, the performance of cooling module to cool the engine was investigated under 25% height reduction. The heat dissipation and pressure drop characteristics have been experimentally studied with the variation of coolant flow rate, air inlet velocity and A/C operation ON/OFF for the downsized cooling module. The results indicated that the cooling performance was about 94% level compared to that of the conventional cooling module. Therefore, we checked that the cooling module had good performance, and expected that the cooling module could meet the same cooling performance as conventional cooling module through optimization of components efficiency.

Development of Power Supply for Ka-band Tracking Radars (Ka-대역 추적 레이더용 전원공급기 개발)

  • Lee, Dongju;An, Se-Hwan;Joo, Ji-Han;Kwon, Jun-Beom;Seo, Mihui
    • The Journal of the Institute of Internet, Broadcasting and Communication
    • /
    • v.22 no.5
    • /
    • pp.99-103
    • /
    • 2022
  • Millimeter-wave tracking radars operate in various environmental restrictions, thus they demand stable power sources with low noise level under high fluctuation of input voltage. This paper presents the design and implementation of the compact power supply with max power of 727 W for Ka-band tracking radar applications. To meet requirements of voltage accuracy and system efficiency for transceiver circuits, upper plates of buck converters are attached on the covers of power supply for efficient heat dissipation. The proposed power supply achieves system efficiency of 88.4 %, output voltage accuracy of ±2 % and noise level of <1% under full load conditions.

Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications (전기자동차용 고신뢰성 파워모듈 패키징 기술)

  • Yoon, Jeong-Won;Bang, Jung-Hwan;Ko, Yong-Ho;Yoo, Se-Hoon;Kim, Jun-Ki;Lee, Chang-Woo
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.21 no.4
    • /
    • pp.1-13
    • /
    • 2014
  • The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

Influence of Bath Temperature on Electroless Ni-B Film Deposition on PCB for High Power LED Packaging

  • Samuel, Tweneboah-Koduah;Jo, Yang-Rae;Yoon, Jae-Sik;Lee, Youn-Seoung;Kim, Hyung-Chul;Rha, Sa-Kyun
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.02a
    • /
    • pp.323-323
    • /
    • 2013
  • High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

  • PDF

Analytical Study of High Speed Railway Braking Disc-hub for Enhancement of Cooling Performance (냉각 성능 향상을 위한 고속철도 제동 디스크 허브의 해석 연구)

  • Lee, Yong-Woo;Kim, Jang-Hoon
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.22 no.3
    • /
    • pp.199-207
    • /
    • 2021
  • This study aimed to improve the performance of the KTX (Korea Train Express) brake system. To develop a braking disc-hub for the high-speed rail, the model performance was analyzed by finite element analysis, and the analysis results were verified using the braking test results. In addition, heat transfer analysis, thermal stress analysis, natural frequency analysis, and static analysis were conducted to examine the mechanical performance of the braking system. By deriving the design factors and conducting parametric analyses according to the shape of the hub, this study derived the optimal specifications that could improve heat dissipation and reduce weight. The cooling efficiency and structural performance of the optimization model were improved during braking compared to the existing model. It is expected that the design verification will be carried out through analyses of the optimal specifications so that it can be used in the development of brakes in railway vehicles and motor vehicles.

Development of 200kW class electric vehicle traction motor driver based on SiC MOSFET (SiC MOSFET기반 200kW급 전기차 구동용 모터드라이버 개발)

  • Yeonwoo, Kim;Sehwan, Kim;Minjae, Kim;Uihyung, Yi;Sungwon, Lee
    • Journal of IKEEE
    • /
    • v.26 no.4
    • /
    • pp.671-680
    • /
    • 2022
  • In this paper, A 200kW traction motor driver that covers most of the traction motor specification of commercial electric vehicles (EV) is developed. In order to achieve high efficiency and high power density, a next-generation power semiconductors (Silicon carbide, SiC) are applied instead of power semiconductor(IGBT), which is Si based. Through hardware analysis for optimal use of SiC, expected efficiency and heat dissipation characteristics are obtained. A vector control algorithm for an IPMSM (Interior permanent magnet synchronous motor), which is mostly used in EV(Electric vehicle) traction motor, is implemented using DSP (Digital signal processor). In this paper, a prototype traction motor driver based SiC for EV is designed and manufactured, and its performance is verified through experiments.

Magnetic and Thermal Analysis of a Water-cooled Permanent Magnet Linear Synchronous Motor

  • Zhang, Xinmin;Lu, Qinfen;Cheng, Chuanying;Ye, Yunyue
    • Journal of international Conference on Electrical Machines and Systems
    • /
    • v.1 no.4
    • /
    • pp.498-504
    • /
    • 2012
  • The water-cooled Permanent Magnet Linear Synchronous Motor (PMLSM) has a wide range of applications due to high efficiency, high thrust force density and high acceleration. In order to ensure normal operation and maximum output, both the magnetic and thermal performance are vital to be considered. Based on ANSYS software, electromagnetic and thermal finite-element analysis (FEA) models of a 14-pole, 12-slot water-cooled PMLSM are erected adopting suitable assumptions. Firstly, the thrust force and force ripple with different current densities are calculated. Secondly, the influence of different water flow on the motor heat dissipation and force performance under different operationional conditions are investigated and optimized. Furthermore, for continuous operation, the temperature rise and thrust feature are studied under the rated load 8A, the proper temperature $120^{\circ}C$ and the limited temperature $155^{\circ}C$. Likewise, for short-time operation, the maximum duration is calculated when applied with a certain large current. Similarly, for intermittent operation, load time as well as standstill time are determined with the optimal current to achieve better thrust performance.

Reliability Testing and Materials Evaluation of Si Sub-Mount based LED Package (실리콘 서브 마운틴 기반의 LED 패키지 재료평가 및 신뢰성 시험)

  • Kim, Young-Pil;Ko, Seok-Cheol
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
    • /
    • v.29 no.4
    • /
    • pp.1-10
    • /
    • 2015
  • The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

A Study on the Thermo-flow Analysis of ISG (Integrated Starter and Generator) Driving Inverter (ISG 구동용 인버터의 열유동 해석에 관한 연구)

  • Kim, Dae Geon;Kim, Sung Chul
    • Transactions of the Korean Society of Automotive Engineers
    • /
    • v.21 no.5
    • /
    • pp.145-150
    • /
    • 2013
  • Recently, many vehicles have applied electric parts for saving fuel consumption and reducing levels of environmental pollution. ISG (integrated starter & generator) is one of main electric parts and can improve fuel efficiency by using idle stop & go function and regenerative braking system. However, if ISG driving inverter works under the continuously high load condition, it will make the performance and durability of the inverter decreased with rising temperature. In this study, we carried out the analysis on the fluid flow and thermal characteristics of the inverter. As a result, we found the MOSFET of the air cooled inverter was increased up to $116^{\circ}C$ over the limit temperature. On the other hand, the liquid cooled type inverter's MOSFET was decreased by about $17^{\circ}C$ compared to that of the air cooled inverter. Therefore, we verified the feasibility of the liquid cooled type using the present cooling structure.