• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.4
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• pp.367-375
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• 2007

The purpose of this study is to investigate the cooling performance of Heat Pipe Heat Exchanger(HPHE) for an electronic telecommunication system by adequate convection condition. Heat generation rates of electronic components, the temperature distributions of HPHE and surrounding air are analyzed experimentally and numerically. In order to perform the heat transfer analysis for the thermal design of telecommunication system, a program is developed. The program is useful to a user who is not familiar with an electronic telecommunication system. The simulation results showed that the HPHE were able to achieve a cooling capacity of up to 230W at the maximum temperature difference of $17.4^{\circ}C$. To verify the results from the numerical simulation, an experiment was conducted under the same condition as the numerical simulation, and their results were compared.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.483-486
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• 2006

The fan is widely used to cool high heat flux generated as of the electronic communication device consoles. It, however, makes a lot of noises that interfere considerably with the operation environment. This study was conducted to obtain the cooling design technology of the consoles through being equipped with the Heat Pipe Heat Exchangers (HPHE) together with low revolution fans in place of existing fans for the cooling technology of the forced convection. Not only the sealed type consoles but the HPHE were also designed so as to cool effectively the heat generated from the inside of the console. The simulation was conducted by computational numerical analysis along with its experiments. The results of the numerical analysis and experiments were compared in order to improve the cooling technology of the consoles mounted with the HPHE. Consequently, instead of loud fan noise generated as of existing forced convection methods, the cooling technology of HPHE can remarkably improve many problems such as the operation environment, indoor dust, malfunction caused by pollution sources and so on.