• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1991년도 추계학술대회 논문집
• /
• pp.80-86
• /
• 1991

In this study an the development of the heat flux sensor with thermocouple, the heat-treated adhesive type film nickel gauge(Ni-Gauge) for measuring temperature was used. and this Ni-Gauge is not only comparable for platinum gauge(Pt-Gauge) in linearity, but also economically cheap. And from this viewpoint. numerical analysis is essential to investigate charateristics of sensor, since this analysis is capable of simulating precise boudary condition and practical conditions and so on. By the way. there are many types of heat flux sensor. of which adhesive type flux sensor is common, in the study this type of heat flux sensor was chogen. and analysis of the sensor is considered as a kind of open cavity figure. performed by SIMPLER algorithm. As a result. through temperature distributial of the sensor by numerical analysis in steady and unsteady state, the dracteristics of the acdhesive type heat flux sensor(lst heat flux sensor) acooodinge to heat flux, that is, outvoltage, sensitivity. and responsibilty could be evaluated. in addition, time of improved heat flux sensor(2nd heat flux sensor) could be predicted fran the reflectian of proper operating temperature(l50 $^{\circ}C$)of theNi-Gauge.

• 한국정밀공학회지
• /
• 제9권2호
• /
• pp.52-60
• /
• 1992

In this study on the development of the heat flux sensor, unlike the common heat-flux sensor with thermocouple, the heat-treated adhesive-tupe film nickel-gauge was used in measuring temperature. The proposed its Ni-gauge is bound to be compatible with platinum gauge(Pt-Gauge) in its linearity. It is also considered to be cheap in economical sense. In the evaluation of it's performance, the numerical analysis is essential to investigate charateristics of proper sensor and the adequate analsis is depended upon boundary conditions and actual conditions. There are many types of heat flux sensor in the market, and adhexive type flux sensor is most common. In the present investigation, this type of heat flux sensor had been chosen. The figure of the sensor under consideration is an open cavity type, which is calculated numerically by SIMPLER algorithm. The temperature distributions of the sensor predicted by numerical calculation for steady and unsteady states are able to give the chacteristics of the adhesive type heat flux sensor(1st heat flux sensor) according to the heat flux. It means that the outvoltage, the sensitivity, and the performances of responsibility could be evaluated as a result. Through this analysis improved heat flux sensor(2nd heat flux sensor) could be predicted with the reflection of proper operating temperature($150^{\circ}C$) of the Ni-gauge.

• 한국정밀공학회지
• /
• 제17권7호
• /
• pp.226-231
• /
• 2000

New types of the micro heat flux sensor are designed and fabricated using SU-8 and Cu electroplating. And then calibrated under convection environment. The thermal path was made by SU-8 structure and electroplated Cu layers. The bottom surface of the micro heat flux sensor receives the heat flux from the wall, Then the heat flows along the Cu layers and drains out to the environment with producing the temperature difference at the upper layer of Cu. By measuring this temperature difference, the heat flux from the wall can be obtained. The temperature difference is measured by thermopile which is composed of Ni-Cr pairs or Al-chromel pairs. The calibration is accomplished under convection environment because it is most frequent situation. The range of the sensitivity is 0.11~2.02$\mu$V/(㎽/$\textrm{cm}^2$) for the various heat flux and Reynolds numbers.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2004년도 춘계학술대회
• /
• pp.1364-1369
• /
• 2004

New method for the design, fabrication, and calibration of micro-machined heat flux sensor has been developed. Two types of micro-machined heat flux sensor having different thicknesses of the thermal-resistance layer are fabricated using the MEMS technique. Photo-resist patterning using a chrome mask, bulk-etching and copper-nickel sputtering using a shadow mask are applied to make heat flux sensors, which are calibrated in the convection-type heat flux calibration facility. The sensitivity of the device varies with thermal-resistance layer, and hence can be used to measure the heat flux in heat-transfer phenomena.

• 한국정밀공학회지
• /
• 제26권11호
• /
• pp.138-145
• /
• 2009

A suspended membrane micro fluidic heat flux sensor that is able to measure the heat flow rate was designed and fabricated by a complementary-metal-oxide-semiconductor-compatible process. The combination of a thirty-junction gold and nickel thermoelectric sensor with an ultralow noise preamplifier, low pass filter, and lock-in amp has enabled the resolution of 50 nW power and provides the sensitivity of $11.4\;mV/{\mu}W$. The heater modulation method was used to eliminate low frequency noises from sensor output. It is measured with various heat flux fluid of DI-water to test as micro fluidic application. In order to estimate the heat generation of samples from the output measurement of a micro fluidic heat-flux sensor, a methodology for modeling and simulating electro-thermal behavior in the micro fluidic heat-flux sensor with integrated electronic circuit is presented and validated. The electro-thermal model was constructed by using system dynamics, particularly the bond graph. The electro-thermal system model in which the thermal and the electrical domain are coupled expresses the heat generation of samples converts thermal input to electrical output. The proposed electro-thermal system model shows good agreement with measured output voltage response in transient state and steady-state.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2004년도 추계학술대회
• /
• pp.1219-1224
• /
• 2004

The objective of this study is to propose an experimental calibration facility in which a heat flux sensor can be calibrated under conductive condition by using helium gas. The heat flux calibration facility was designed, simulated and manufactured for use in a high heat transfer condition. It delivers heat fluxes up to a maximum of 35 KW $m^{-2}$. A copper block heated electrically with 3.5 KW power is designed to produce uniform temperature up to 600 K across its face. High heat fluxes are provided between hot plate and cold plate by 1 mm height helium filled gap. A cold plate is maintained around 300 K through pool boiling using a refrigerant and water-cooled heat exchanger. A simulation was conducted to verify the design of the main test section. To verify the performance of calibration facility, a heat flux sensor was examined. The measured heat fluxes were compared to the calculated one.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2004년도 춘계학술대회
• /
• pp.1358-1363
• /
• 2004

The objective of this work is to propose calibration facility in which a thin film type heat flux sensor can be calibrated under convective flow condition by using a small wind tunnel with the constant temperature plate condition. A small wind tunnel has been built to produce a boundary layer shear flow above a constant temperature copper plate. 12-independent copper blocks, thin film heaters, insulators and temperature controllers were used to keep the temperature of flat plate constant at a specified temperature. Three commercial thin film-type heat flux sensors were tested. Convective calibrations of these gages were performed over the available heat flux range of $1.4{\sim}2.5kW/m^2$. The uncertainty in the heat flux measurements in the convective-type heat flux calibration facility was ${\pm}2.07%$. Non-dimensional sensitivity is proposed to compare the sensitivity calibrated by manufacturer and that of experiment conducted in this study.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 춘계학술대회 논문집
• /
• pp.1210-1213
• /
• 2005

Micro heat flux sensor is used in various industries to measure heat flux. In this study, a micro heat flux sensor is fabricated using the MEMS (Micro Electro Mechanical Systems) techniques. The fabricated sensor is composed in thermopile for sensor and SU-8 for thermal resistance layer. The new method of fabrication SU-8 is proposed in this study. The sensitivity is $44\;\mu{V/(W/cm^2)}$ at steady state and Reynolds number is 91322.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
• /
• pp.19.2-19.2
• /
• 2005

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2012년도 추계학술대회 논문집
• /
• pp.85-86
• /
• 2012